211947 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices having separate containers the devices being of a type provided for in group the containers being in a stacked arrangement the lowermost container comprising a device support
Sub-classes:SEMICONDUCTOR PACKAGE
#2MULTI-DIE PACKAGE ON PACKAGE
#3Multi-die, vertical-wire package-in-package apparatus, and methods of making same
#4Semiconductor device and imaging apparatus
#5Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
#6Configurable substrate and systems
#7Semiconductor device and imaging apparatus
#8Semiconductor packages
#9Semiconductor module
#10Method of manufacturing a semiconductor package
#11Package on package structure and fabrication method thereof
#12METHODS AND STRUCTURES FOR PROCESSING SEMICONDUCTOR DEVICES
#13Die carrier for package on package assembly
#14HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
#15POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
#16Integrated circuit packaging system with package stacking and method of manufacture thereof
#17Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages
#18Pre-encapsulated cavity interposer