211946 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices having separate containers the devices being of a type provided for in group the containers being in a stacked arrangement
Sub-classes:SEMICONDUCTOR MODULE
#2SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED CHIP PACKAGE
#3SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4SEMICONDUCTOR PACKAGE
#5SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME
#6SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
#7SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#8Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#9Semiconductor Package
#10Semiconductor package including composite molding structure
#11Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#12Semiconductor device having a heat dissipation structure connected chip package
#13Semiconductor device having a redistribution layer
#14Semiconductor package including composite molding structure
#15Semiconductor package
#16Semiconductor device having a heat dissipation structure connected chip package
#17Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#18Semiconductor package
#19Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
#20Stacked modules
#21Semiconductor device having upper and lower redistribution layers
#22Stacked semiconductor device and method of manufacturing the same
#23Method of packaging chip and chip package structure
#24Semiconductor device and manufacturing method thereof
#25Packaged electronic device with integrated electronic circuits having transceiving antennas
#26Semiconductor device and method for manufacturing same
#27Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same
#28METHOD OF MANUFACTURING A MICRO-FABRICATED WAFER LEVEL INTEGRATED INDUCTOR OR TRANSFORMER FOR HIGH FREQUENCY SWITCH MODE POWER SUPPLIES
#29Semiconductor device and manufacturing method thereof
#30Stacked semiconductor package and method for manufacturing the same
#31Packaged electronic device with integrated electronic circuits having transceiving antennas
#32Stacked semiconductor package and method for manufacturing the same
#33Signal processing device
#34Power module
#35SEMICONDUCTOR PACKAGE
#36Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
#37Electronic package with stacked semiconductor chips
#38Integrated circuit packaging system with dual side connection and method of manufacture thereof
#39Integrated circuit packaging system with flip chip and method of manufacture thereof
#40Vertically stacked pre-packaged integrated circuit chips
#41Integrated circuit packaging system with layered packaging and method of manufacture thereof
#42Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method
#43Delay circuit and delay time adjustment method
#44Chip package module
#45Stacked die package system
#46Electronic component packaging structure and method for producing the same
#47Stacked die package system
#48Vertically stacked pre-packaged integrated circuit chips
#49Apparatus and methods for stackable packaging