207579 ⎘
Details of semiconductor or other solid state devices; Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties Metallic substrates having insulating layers
SEMICONDUCTOR DEVICE
#2STACKED STRUCTURES FOR SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
#3SEMICONDUCTOR PACKAGE INCLUDING A HIGH VOLTAGE SEMICONDUCTOR TRANSISTOR CHIP AND A DIELECTRIC INORGANIC SUBSTRATE
#4PLANAR DEVICE AND SWITCHING CIRCUIT
#5HOUSING, SEMICONDUCTOR MODULE HAVING A HOUSING, AND METHOD FOR ASSEMBLING A SEMICONDUCTOR MODULE
#6Electronic Component With Reduced Inductance
#7METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE
#8SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#9POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND METHOD OF MAKING THE SAME
#10SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
#11PACKAGE STRUCTURES
#12PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
#13MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, AND A MANUFACTURING METHOD OF A POWER SEMICONDUCTOR MODULE INCLUDING THE SAME
#14SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING AND A PACKAGE CONTAINING SUCH SUBSTRATE
#15POWER CONVERSION APPARATUS
#16SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
#17VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC SPACERS
#18MOUNTING STRUCTURE
#19EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUIT SUBSTRATE
#20METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE
#21POWER MODULE
#22SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL CORE FOR IMPROVED ELECTRICAL SHIELDING AND STRUCTURAL STRENGTH, AND RELATED IC PACKAGES AND FABRICATION METHODS
#23SEMICONDUCTOR DEVICE
#24SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH EXPOSED GLASS FIBRES
#25SEMICONDUCTOR MODULE
#26SEMICONDUCTOR MODULE HAVING A SUBSTRATE WITH AN INSULATING CERAMIC LAYER AND A METHOD FOR FABRICATING THEREOF
#27INTEGRATED PACKAGING DEVICE AND FABRICATION METHODS THEREOF
#28METAL CORE SUBSTRATE BASED PACKAGE INTERCONNECT SYSTEMS
#29POWER SEMICONDUCTOR DEVICE
#30METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE
#31FILM COVERS FOR SENSOR PACKAGES
#32POWER SEMICONDUCTOR DEVICE, METHOD FOR PREPARING POWER SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
#33POWER ELECTRONICS MODULE
#34WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
#35Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate
#36POWER ELECTRONICS MODULE
#37METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
#38DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
#39WIRING SUBSTRATE
#40ANODIC ALUMINUM OXIDE FILM-BASED INTERPOSER FOR ELECTRICAL CONNECTION AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR, MULTI-STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, DISPLAY AND MANUFACTURING METHOD THEREFOR
#41WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC MODULE
#42SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#43SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#44SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE
#45Power conversion apparatus
#46Power substrate assembly with reduced warpage
#47ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
#48Integrated Electronic Component
#49SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#50SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#51Module configurations for integrated III-nitride devices
#52SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#53Electric Circuit for an Electronic Chip Card Module with Colored Contacts and Method for Producing Same
#54Film covers for sensor packages
#55SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
#56Package and printed circuit board attachment
#57SEMICONDUCTOR DEVICE
#58SUBSTRATE FOR LIGHT EMITTING ELEMENTS, LIGHT EMITTING DEVICE INCLUDING SUBSTRATE FOR LIGHT EMITTING ELEMENTS, AND METHOD OF PRODUCING SUBSTRATE FOR LIGHT EMITTING ELEMENTS
#59SEMICONDUCTOR SENSOR
#60Power conversion apparatus
#61Semiconductor package having an electrically insulating core with exposed glass fibres
#62SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#63INTEGRATED BUFFER AND SEMICONDUCTOR MATERIALS
#64Package and manufacturing method of the same
#65SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
#66SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
#67SEMICONDUCTOR DEVICE
#68Power module
#69Power module with metal substrate
#70Substrate structure, package structure and method for manufacturing electronic package structure
#71Insulated metal substrate and method for manufacturing same
#72Insulated metal substrate and method for manufacturing same
#73ELECTRONIC DEVICE INCLUDING ONE OR MORE MONOLAYER AMORPHOUS FILMS AND METHOD OF FORMING THE SAME
#74Stem for semiconductor package including eyelet and lead
#75CIRCUIT BASE, AND HEAT DISSIPATION BASE OR ELECTRONIC DEVICE PROVIDED WITH SAME
#76Film covers for sensor packages
#77Vertical metal splitting using helmets and wrap-around dielectric spacers
#78Semiconductor module
#79Semiconductor device and manufacturing method thereof
#80Chip card body, method for forming a chip card body and chip card
#81Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate
#82Semiconductor substrate and method of manufacturing semiconductor device
#83Method of producing circuit boards
#84Method for producing package substrate for mounting semiconductor device
#85Metal/ceramic bonding substrate and method for producing same
#86Semiconductor module
#87Power module with metal substrate
#88Semiconductor package and production method thereof, and semiconductor device
#89SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#90Module configurations for integrated III-Nitride devices
#91SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING
#92Semiconductor apparatus
#93Wiring structure and semiconductor module
#94METAL BASE SUBSTRATE
#95Power conversion apparatus
#96SEMICONDUCTOR DEVICE
#97Semiconductor device
#98Semiconductor device including an embedded semiconductor die
#99Wiring substrate and electronic device
#100Semiconductor packages and methods of manufacturing thereof
#101Surface Mount Technology Structure of Power Semiconductor
#102Carrier board and power module using same
#103Package structure and method
#104METHOD FOR EMBEDDING SILICON DIE INTO A STACKED PACKAGE
#105Packages with separate communication and heat dissipation paths
#106Semiconductor device
#107Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module
#108Semiconductor-mounting heat dissipation base plate and production method therefor
#109CERAMIC-METAL JOINED BODY AND METHOD OF MANUFACTURING THE SAME, AND MULTI-PIECE CERAMIC-METAL JOINED BODY AND METHOD OF MANUFACTURING THE SAME
#110Package and printed circuit board attachment
#111Semiconductor device
#112Circuit substrate arrangement with improved electrical contact
#113Barriers for Flexible Substrates and Methods of Making the Same
#114Semiconductor device
#115Method of manufacturing insulating circuit board with heatsink
#116Insulation circuit board with heat sink
#117Semiconductor power module and power conversion device
#118Radio frequency module
#119Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method
#120DEVICE FOR THERMAL CONDUCTION AND ELECTRICAL ISOLATION
#121Power semiconductor module arrangement having a base plate and a contact element
#122Multi-chip package with high thermal conductivity die attach
#123Heat dissipation substrate and fabricating method thereof
#124Bonded body, insulated circuit board with heat sink, and heat sink
#125Semiconductor element bonding body, semiconductor device, and method of manufacturing semiconductor element bonding body
#126Semiconductor package substrate and method for manufacturing same
#127SEMICONDUCTOR DEVICE PACKAGE
#128Method for manufacturing semiconductor package substrate
#129Semiconductor device, electric power conversion apparatus and method for manufacturing semiconductor device
#130Power semiconductor module embedded in a mold compounded with an opening
#131HEAT-DISSIPATION SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT
#132Ceramic circuit plate and method of making same
#133Package and printed circuit board attachment
#134Package structure and method
#135Method for producing power semiconductor module arrangement
#136Magnetic articles
#137Semiconductor device and method for manufacturing the same, and power conversion device
#138Package and printed circuit board attachment
#139Ceramic/aluminum bonded body, insulating substrate, LED module, ceramic member, method for producing ceramic/aluminum bonded body, and method for producing insulating substrate
#140SEALING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#141Semiconductor apparatus
#142Power conversion apparatus
#143Transfer template, display substrate, display panel, and method for manufacturing the same
#144Ceramic circuit plate and method of making same
#145Printed wiring board, printed circuit board, prepreg
#146Power module substrate, power module, and method for manufacturing power module substrate
#147Package structure and method
#148Semiconductor device
#149Magnetic articles
#150Semiconductor chip package for improving freedom of arrangement of external terminals
#151Semiconductor package substrate and manufacturing method therefor
#152Semiconductor package and related methods
#153Semiconductor-mounting heat dissipation base plate and production method therefor
#154Base body with soldered-on ground pin, method for its production and uses thereof
#155Semiconductor device
#156Electronic device packages with attenuated electromagnetic interference signals
#157Semiconductor device package having a mounting plate with protrusions exposed from a resin material
#158WIRING BOARD AND ELECTRONIC DEVICE
#159Semiconductor package substrate and method for manufacturing same
#160METHOD OF MANUFACTURING A CIRCUIT BOARD LAMINATE
#161Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#162Electronic component and method for producing an electronic component
#163Package structure of fingerprint identification chip
#164Mounting component, semiconductor device using same, and manufacturing method thereof
#165Power module based on multi-layer circuit board
#166SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#167Heat-radiating substrate
#168SEMICONDUCTOR DEVICE PACKAGE
#169Semiconductor package and semiconductor process
#170Mount structure
#171Power semiconductor module arrangement and method for producing the same
#172Chip module with spatially limited thermally conductive mounting body
#173METHOD FOR MANUFACTURING A CIRCUIT CARRIER
#174Power semiconductor device and method of manufacturing the same, and power conversion device
#175Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#176SEMICONDUCTOR PACKAGE
#177Semiconductor device
#178Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate
#179Power semiconductor module
#180Method of building an insulation system around a naked conductor section of a power cable
#181Display unit
#182Substrate structures and methods of manufacture
#183Semiconductor device
#184Semiconductor device
#185Substrate for power module, collective substrate for power modules, and method for manufacturing substrate for power module
#186Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#187Method for manufacturing substrate for power module with heat sink
#188Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#189Optical semiconductor device
#190Circuit board and electronic device
#191Magnetic articles
#192Manufacturing method of semiconductor package
#193Semiconductor module
#194Power module with low stray inductance
#195Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material
#196Semiconductor package and manufacturing method of semiconductor package
#197Laminate package of chip on carrier and in cavity
#198METHOD FOR EMBEDDING SILICON DIE INTO A STACKED PACKAGE
#199Semiconductor package and method for manufacturing the same
#200Manufacturing method of semiconductor package
#201Bidirectional semiconductor package
#202Semiconductor device
#203Robust low inductance power module package
#204Bumpless wafer level fan-out package
#205Semiconductor device, and alternator and power converter using the semiconductor device
#206METHOD FOR APPLYING DRIED METAL SINTERING COMPOUND BY MEANS OF A TRANSFER SUBSTRATE ONTO A CARRIER FOR ELECTRONIC COMPONENTS, CORRESPONDING CARRIER, AND THE USE THEREOF FOR SINTERED CONNECTION TO ELECTRONIC COMPONENTS
#207Cooling and power delivery for a wafer level computing board
#208Substrate structures and methods of manufacture
#209Semiconductor device package
#210Printed circuit board assembly forming enhanced biometric module and manufacturing method thereof
#211Method for producing a power semiconductor module
#212PCB based semiconductor package having integrated electrical functionality
#213Semiconductor module and method of manufacturing semiconductor module
#214Semiconductor component and method of manufacture
#215Chip package
#216Chip package
#217Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#218Copper-ceramic bonded body and power module substrate
#219Element-accommodating package and mounting structure
#220Radiofrequency high-output device
#221Semiconductor module having an embedded metal heat dissipation plate
#222Electronic device including a metal substrate and a semiconductor module embedded in a laminate
#223Substrate structures and methods of manufacture
#224Printed circuit board, circuit and method for producing a circuit
#225SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
#226SEMICONDUCTOR DEVICE
#227Methods for forming semiconductor device packages
#228Semiconductor device packages
#229Printed circuit board with thermal via
#230Non-metallic coating and method of its production
#231Low profile reinforced package-on-package semiconductor device
#232Printed circuit board assembly with image sensor mounted thereon
#233Substrate structures and methods of manufacture
#234Substrate structures and methods of manufacture
#235Multilayer wiring substrate
#236Semiconductor module
#237CHIP PACKAGE MODULE AND PACKAGE SUBSTRATE
#238Methods for Manufacturing RFID Tags and Structures Formed Therefrom
#239Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly
#240Package in package (PiP) electronic device and manufacturing method thereof
#241Semiconductor module
#242Mounting substrate and light-emitting device using the same
#243Device including multiple semiconductor chips and multiple carriers
#244POWER SEMICONDUCTOR DEVICE
#245Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof
#246Method for manufacturing semiconductor apparatus
#247Chip package structure and manufacturing method thereof
#248Heat spreading substrate with embedded interconnects
#249Semiconductor package having magnetic substance and related equipment
#250Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
#251Semiconductor device and method for manufacturing the same
#252Semiconductor package having a baseplate with a die attach region and a peripheral region
#253Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
#254Epoxy resin compound and radiant heat circuit board using the same
#255Insulated metal substrate
#256Wiring substrate and method of manufacturing the same
#257Wiring substrate, component embedded substrate, and package structure
#258Wiring material and semiconductor module using the same
#259Package substrate dynamic pressure structure
#260Device mounting board and semiconductor power module
#261Device mounting board, semiconductor module, and method for fabricating the device mounting board
#262Chip package and a method for manufacturing a chip package
#263Semiconductor package structure and method
#264Flip-chip electronic device and production method thereof
#265Power module package with a fastening unit including a non-conductive portion
#266Method of making surface mount stacked semiconductor devices
#267Semiconductor module and manufacturing method thereof
#268PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#269Circuit device and method for manufacturing same
#270Heat dissipation substrate and manufacturing method thereof
#271Metal base substrate and manufacturing method thereof
#272Process of fabricating heat dissipation substrate
#273PCB based RF-power package window frame
#274Method of manufacturing a semiconductor device
#275Heat spreading substrate with embedded interconnects
#276Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
#277Heterogeneous chip integration with low loss interconnection through adaptive patterning
#278Semiconductor Device and Fabrication Method
#279FORMED METALLIC HEAT SINK SUBSTRATE, CIRCUIT SYSTEM, AND FABRICATION METHODS
#280Wiring substrate, light emitting device, and method for manufacturing wiring substrate
#281POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#282STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE
#283Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof
#284Terminal-integrated metal base package module and terminal-integrated metal base packaging method
#285SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#286Electronic module
#287SUBSTRATE FOR POWER MODULE AND POWER MODULE
#288METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION
#289MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES
#290Thermal dissipation substrate
#291Printed wiring board and method for manufacturing printed wiring board
#292Virtually substrate-less composite power semiconductor device
#293MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
#294Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof
#295Semiconductor apparatus, method for manufacturing the same and electric device
#296Metal-based circuit board
#297MULTILAYER PRINTED WIRING BOARD
#298Package carrier and manufacturing method thereof
#299Device including two mounting surfaces
#300Package substrate dynamic pressure structure