207579 ⎘
Details of semiconductor or other solid state devices; Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties Metallic substrates having insulating layers
Power semiconductor module
#302Metal substrate and light source device
#303Insulation circuit board, and power semiconductor device or inverter module using the same
#304LED chip assembly, LED package, and manufacturing method of LED package
#305HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#306Power package module with low and high power chips and method for fabricating the same
#307High power ceramic on copper package
#308Method and system for minimizing carrier stress of a semiconductor device
#309Electrolytic depositon and via filling in coreless substrate processing
#310INSULATING CIRCUIT BOARD, INVERTER DEVICE AND POWER SEMICONDUCTOR DEVICE
#311HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#312Diamond insulated circuits and associated methods
#313Multi-layer circuit assembly and process for preparing the same
#314Circuit device
#315CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER
#316PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#317Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member
#318METHOD FOR MANUFACTURING METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION AND METAL LAMINATED SUBSTRATE FOR SEMICONDUCTOR ELEMENT FORMATION
#319PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#320TRANSISTOR AND TRANSISTOR CONTROL SYSTEM
#321Virtually substrate-less composite power semiconductor device and method
#322Semiconductor device
#323Wiring substrate and method of manufacturing the same
#324Semiconductor device and manufacturing method thereof
#325HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE
#326Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
#327SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES
#328Semiconductor device
#329METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME
#330INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD
#331Circuit board and semiconductor module
#332COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT, ELECTRICAL/ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
#333METHOD FOR ARRANGING COOLING FOR A COMPONENT AND A COOLING ELEMENT
#334POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
#335Microwave module
#336METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#337POWER SEMICONDUCTOR MODULE
#338High power ceramic on copper package
#339Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
#340Circuit board and method for manufacturing semiconductor modules and circuit boards
#341Method for embedding silicon die into a stacked package
#342Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#343Fabricating process of thermal enhanced substrate
#344INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE
#345Microelectronic package with thermal access
#346Circuit device
#347Methods for manufacturing RFID tags and structures formed therefrom
#348Power semiconductor module
#349Electronic Component Module and Method for the Production Thereof
#350Device including two mounting surfaces
#351Method of fabricating a semiconductor device
#352Semiconductor device
#353Semiconductor device
#354Heat conductive plate structure
#355Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method
#356Semiconductor device and method of manufacturing a semiconductor device
#357SURFACE MOUNT PACKAGE
#358Holding jig for electronic parts
#359Metal core circuit element mounting board
#360PROCESS OF PACKAGE SUBSTRATE
#361Electronic module
#362Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
#363Semiconductor module
#364Method of fabricating substrate
#365SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS
#366Leadless package
#367Package for semiconductor device and method of manufacturing the same
#368METAL-CERAMIC COMPOSITE SUBSTRATE AND METHOD OF ITS MANUFACTURE
#369RESIN COMPOSITION AND HYBRID INTEGRATED CIRCUIT BOARD MAKING USE OF THE SAME
#370Package on package structure
#371Method and arrangement for contact-connecting semiconductor chips on a metallic substrate
#372Cu-Mo substrate and method for producing same
#373Low crosstalk substrate for mixed-signal integrated circuits
#374ELECTRONIC APPARATUS
#375Package substrate dynamic pressure structure
#376Insulation paste for a metal core substrate and electronic device
#377Fabricating process and structure of thermal enhanced substrate
#378CIRCUIT ASSEMBLY INCLUDING A METAL CORE SUBSTRATE AND PROCESS FOR PREPARING THE SAME
#379Semiconductor device and method for manufacturing semiconductor device
#380HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF
#381Semiconductor module
#382METHOD OF PREPARING HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE
#383Thermally and electrically conductive apparatus
#384Semiconductor device and method of manufacturing the same
#385Multilayer substrate including components therein
#386Method for producing a metal article intended for at least partially coating with a substance
#387Microelectronic package with thermal access
#388Thinned die integrated circuit package
#389Wiring board manufacturing method
#390High power semiconductor package and method of making the same
#391Microcircuit package having ductile layer
#392Packaging with base layers comprising alloy 42
#393Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
#394High density electronic packages
#395Substrate and process for semiconductor flip chip package
#396Substrate having stiffener fabrication method
#397Package Using Selectively Anodized Metal and Manufacturing Method Thereof
#398Circuit board and method for manufacturing semiconductor modules and circuit boards
#399Method for fabricating semiconductor package free of substrate
#400Aluminum-silicon carbide composite
#401Manufacturing method of wiring substrate and manufacturing method of semiconductor device
#402Circuit device
#403Multi-layer circuit assembly and process for preparing the same
#404Semiconductor device
#405Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#406Substrate for semiconductor device and semiconductor device
#407Hybrid composite material substrate
#408Semiconductor device and electronic control unit using the same
#409Metal-base circuit board and its manufacturing method
#410Metal core, package board, and fabricating method thereof
#411High thermal conducting circuit substrate and manufacturing process thereof
#412Semiconductor chip package with a metal substrate and semiconductor module having the same
#413Semiconductor package including a semiconductor die having redistributed pads
#414Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same
#415Semiconductor heat-transfer method
#416Electronic apparatus
#417Printed circuit board and manufacturing method thereof
#418Power semiconductor module with MOS chip
#419Composite and susceptor for semiconductor manufacturing device and power module with the same
#420Scalable subsystem architecture having integrated cooling channels
#421Methods for manufacturing RFID tags and structures formed therefrom
#422Double-sided wiring board, double sided wiring board manufacturing method, and multilayer wiring board
#423Circuit device and method of manufacturing the same
#424Surface mount package
#425Low crosstalk substrate for mixed-signal integrated circuits
#426Method of manufacturing a metal-ceramic circuit board
#427Electronic assembly including multiple substrates
#428Method of manufacture of ceramic composite wiring structures for semiconductor devices
#429Method for manufacturing a ceramic/metal substrate
#430Structure of substrate
#431Combined chip/heat-dissipating metal plate and method for manufacturing the same
#432Substrate core
#433Wiring board manufacturing method
#434Insulating substrate and semiconductor device having a thermally sprayed circuit pattern
#435IC substrate and manufacturing method thereof and semiconductor element package thereby
#436Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
#437Method and resulting structure for manufacturing semiconductor substrates
#438Solder ball opening protrusion for semiconductor assembly
#439Circuit apparatus provided with asperities on substrate surface
#440Metallic material for electric or electronic parts
#441Circuit device
#442Method and resulting structure for manufacturing semiconductor substrates
#443Multilayer substrate including components therein
#444Electronics unit
#445Die down semiconductor package
#446Semiconductor package free of substrate and fabrication method thereof
#447Nanotube-containing composite bodies, and methods for making same
#448Method for producing an integral ceramic circuit board
#449Method and resulting structure for manufacturing semiconductor substrates
#450Method of manufacturing a metal-ceramic circuit board
#451Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#452Metal article intended for at least partially coating with a substance and a method for producing the same
#453Semiconductor component arrangement with an insulating layer having nanoparticles
#454Thinned die integrated circuit package
#455Substrate and method of manufacture thereof
#456Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
#457Metal/ceramic bonding substrate and method for producing same
#458Semiconductor device including a semiconductor chip mounted on a metal base
#459Circuit board and semiconductor device using the same
#460Device with hybrid microwave circuits shielded by elastic contact members
#461Environmentally robust plating configuration for metal-diamond composites substrate
#462Package and printed circuit board attachment