ClassID:

207612

H01L23/345 - page 2 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements Arrangements for heating

Recent Application in this class:
#301
20120025781
2012-02-02

Battery heating circuits and methods based on battery discharging and charging using resonance components in series and multiple charge storage components

#302
20120025780
2012-02-02

Heating circuits and methods based on battery discharging and charging using resonance components in series and freewheeling circuit components

#303
20120025779
2012-02-02

Battery heating circuits and methods using resonance components in series based on current limiting and voltage inversion with bi-directionality and common inductance

#304
20120025778
2012-02-02

Battery heating circuits and methods with resonance components in series using energy transfer and voltage inversion

#305
20120025777
2012-02-02

Battery heating circuits and methods with resonance components in series using energy transfer

#306
20120025776
2012-02-02

Battery heating circuits and methods with resonance components in series using voltage inversion

#307
20120025775
2012-02-02

Battery heating circuits and methods using resonance components in series based on current limiting and voltage inversion with bi-directionality

#308
20120025774
2012-02-02

Battery heating circuits and methods using resonance components in series

#309
20120025772
2012-02-02

Battery heating circuits and methods based on battery discharging and charging using resonance components in series

#310
20120025756
2012-02-02

Circuits and methods for heating batteries in series using resonance components in series

#311
20120025754
2012-02-02

Battery heating circuits and methods using resonance components in series based on charge balancing

#312
20120024838
2012-02-02

Battery heating circuits and methods based on battery discharging using resonance components in series

#313
20110266653
2011-11-03

Semiconductor device having a fuse element

#314
20110127633
2011-06-02

Slotted configuration for optimized placement of micro-components using adhesive bonding

#315
20110121292
2011-05-26

Calibration of temperature sensitive circuits with heater elements

#316
20100320187
2010-12-23

Heat Sink and Thermal Plate Apparatus for Electronic Components

#317
20100319876
2010-12-23

Semiconductor element cooling structure

#318
20100278211
2010-11-04

Method and system of testing a semiconductor device

#319
20100230807
2010-09-16

Repairing defects in a nonvolatile semiconductor memory device utilizing a heating element

#320
20100200953
2010-08-12

On-chip heater and methods for fabrication thereof and use thereof

#321
20100182729
2010-07-22

Method of operating transistors and structures thereof for improved reliability and lifetime

#322
20100073122
2010-03-25

Dual thin film precision resistance trimming

#323
20100060328
2010-03-11

Reduction of semiconductor stresses

#324
20100060193
2010-03-11

METHOD AND CIRCUIT ARRANGEMENT FOR INCREASING THE DIELECTRIC STRENGTH OF METAL OXIDE TRANSISTORS AT LOW TEMPERATURES

#325
20100025811
2010-02-04

INTEGRATED CIRCUIT WITH BUILT-IN HEATING CIRCUITRY TO REVERSE OPERATIONAL DEGENERATION

#326
20090295457
2009-12-03

Cold temperature control in a semiconductor device

#327
20090283248
2009-11-19

Temperature Managing For Electronic Components

#328
20090236081
2009-09-24

DEVICE FOR PREHEATING A COMPONENT COOLED BY CONDUCTION AND/OR BY CONVECTION

#329
20090198387
2009-08-06

Portable computer and method for preheating portable computer before booting

#330
20090195296
2009-08-06

Method for recovering an on-state forward voltage and, shrinking stacking faults in bipolar semiconductor devices, and the bipolar semiconductor devices

#331
20090183131
2009-07-16

Design structure for semiconductor on-chip repair scheme for negative bias temperature instability

#332
20090179689
2009-07-16

Semiconductor on-chip repair scheme for negative bias temperature instability

#333
20090178275
2009-07-16

Silicon Carrier Including An Integrated Heater For Die Rework And Wafer Probe

#334
20090160908
2009-06-25

Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip

#335
20090018708
2009-01-15

Method for pre-heating high power devices to enable low temperature start-up and operation

#336
20090016408
2009-01-15

Extending the operating temperature range of high power devices

#337
20080204115
2008-08-28

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

#338
20080187772
2008-08-07

Electronic board incorporating a heating resistor

#339
20080130237
2008-06-05

Wafer having thermal circuit and power supplier therefor

#340
20080036075
2008-02-14

Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components

#341
20080012042
2008-01-17

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

#342
20070284360
2007-12-13

Heating element for microfluidic and micromechanical applications

#343
20070268736
2007-11-22

On-chip heater and methods for fabrication thereof and use thereof

#344
20070262069
2007-11-15

Heating Device for Electronic Components in Military Vehicles

#345
20070222029
2007-09-27

Semiconductor device having a fuse element

#346
20070172991
2007-07-26

Microstructure sealing tool and methods of using the same

#347
20070158781
2007-07-12

Electrical fuses comprising thin film transistors (TFTS), and methods for programming same

#348
20060278950
2006-12-14

Semiconductor device having first and second insulation separation regions

#349
20060267194
2006-11-30

Integrated circuit package with air gap

#350
20060267170
2006-11-30

Integrated circuit package with air gap

#351
20060262623
2006-11-23

Phase locked loop with temperature compensation

#352
20060255457
2006-11-16

Integrated circuit package with glass layer and oscillator

#353
20060249840
2006-11-09

Integrated circuit with low dielectric loss packaging material

#354
20060208276
2006-09-21

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

#355
20060202304
2006-09-14

Integrated circuit with temperature-controlled component

#356
20060186435
2006-08-24

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

#357
20060138605
2006-06-29

Method for attaching chips in a flip-chip arrangement

#358
20060131001
2006-06-22

Boiling and cooling device

#359
20060128059
2006-06-15

Compact system module with built-in thermoelectric cooling

#360
20060103007
2006-05-18

Heater for annealing trapped charge in a semiconductor device

#361
20060063292
2006-03-23

Method for producing a packaged integrated circuit

#362
20060051517
2006-03-09

Thermally controlled fluidic self-assembly method and support

#363
20060048384
2006-03-09

Method for assembling micro-components to binding sites

#364
20050285228
2005-12-29

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

#365
20050274989
2005-12-15

Integrated test circuit arrangement and test method

#366
20050270049
2005-12-08

Semiconductor device

#367
20050258990
2005-11-24

On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits

#368
20050224849
2005-10-13

Metal heater for in situ heating and crystallization of ferroelectric polymer memory film

#369
20050194174
2005-09-08

Electrical feedthrough assembly for a sealed housing

#370
20050178529
2005-08-18

Cooling system or electronic apparatus, and electronic apparatus using the same

#371
20050151240
2005-07-14

Radio frequency module

#372
20050029620
2005-02-10

Semiconductor device

#373
20050020007
2005-01-27

Semiconductor element and method for its production

#374
18383009
2025-03-11

Photon number resolving detector with thermal diode

#375
17705201
2023-10-24

Thermal diode switch

#376
16773921
2022-03-29

Thermal diode switch

#377
16226675
2019-12-10

Heating-cooling module

#378
16003074
2019-08-06

Chip on carrier

#379
15968013
2020-04-14

Systems and methods for on-die heat generation and temperature sensing

#380
15916174
2020-06-30

Self-healing microchip

#381
15789108
2018-09-25

Memory having thermoelectric heat pump and related IC chip package and method

#382
15460049
2019-01-15

Thermally insulating adhesive

#383
15385098
2017-09-12

Integrated circuits with thermal isolation and temperature regulation

#384
15247912
2017-09-12

Overheat prevention for annealing non-volatile memory

#385
15099341
2017-03-28

Low power, temperature regulated circuit for precision integrated circuits

#386
15057959
2017-01-17

Multi-chip non-volatile semiconductor memory package including heater and sensor elements

#387
14982096
2016-10-18

Calibration-free temperature measurement

#388
14963466
2017-02-14

Near-chip compliant layer for reducing perimeter stress during assembly process

#389
14962857
2016-12-06

Embedded air core inductors for integrated circuit package substrates with thermal conductor

#390
14835534
2017-06-06

Heat spreader for package-on-package (PoP) type packages

#391
14639313
2018-03-27

Multi-chip non-volatile semiconductor memory package including heater and sensor elements

#392
14076889
2014-12-23

Semiconductor device with electrode structure including graphene pattern formed over metal pattern

#393
13719883
2016-03-01

Self-heating integrated circuit

#394
13489257
2013-06-11

Circuit having integrated heating structure for parametric trimming