207612 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements Arrangements for heating
SEMICONDUCTOR PACKAGE WITH ACTIVE THERMAL MANAGEMENT LID
#2MEMORY DEVICE
#3ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#4ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#5ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#6INTEGRATED HEATER AND COLD PLATE FOR TEST APPLICATIONS
#7ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#8SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREO
#9ON-DIE HEATING FOR A MEMORY DEVICE
#10SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#11SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT
#12SEMICONDUCTOR MODULE
#13Photonics IC (PIC) with Extended Operating Temperature Range
#14HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE
#15SEMICONDUCTOR DEVICE INCLUDING HEATING STRUCTURE
#16Component holder with a temperature-control function
#17RADIATOR TYPE HEATING ELEMENT FOR INTEGRATED CIRCUITS
#18BIOFET WITH INCREASED SENSING AREA
#19SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR STORAGE DEVICE
#20THERMAL APPARATUS FOR AN INTEGRATED CIRCUIT AND METHODS OF OPERATION
#21COMPACT HUMIDITY AND PRESSURE SENSOR WITH TEMPERATURE CONTROL
#22TEMPERATURE REGULATION OF INTEGRATED CIRCUIT ELEMENTS
#23Direct Vapor Chamber for Heat Dissipation in Electronic Devices
#24UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND METHOD FOR MANUFACTURING THE SAME
#25Ovenized MEMS
#26MEMORY CELL, THREE-DIMENSIONAL MEMORY, AND METHOD OF OPERATING THREE-DIMENSIONAL MEMORY
#27VOLTAGE REGULATOR HAVING VARIABLE OUTPUT CAPACITANCE AND METHODS FOR FORMING THE SAME
#28HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#29ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES
#30ARRAY SUBSTRATE AND DISPLAY PANEL
#31SEMICONDUCTOR PACKAGE
#32HEATER TERMINAL CONTACTS
#33HEATER ELEMENTS
#34ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE
#35SILICIDE-LAYER-COUPLED DOPED PORTION OF ACTIVE REGION AND METHOD OF FABRICATING SAME
#36ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS
#37Nanoparticle fluoropolymer electrode
#38Method of fabricating semiconductor structure with heating element
#39SEMICONDUCTOR STRUCTURE
#40SENSING SYSTEM ON CHIP AND THE MANUFACTURING METHOD THEREOF
#41FERROELECTRIC MEMORY DEVICE ERASURE
#42METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRIER WAFERS WITH CAVITY REGIONS FOR REDUCED BOND STRENGTH, AND SEMICONDUCTOR DEVICE ASSEMBLIES FORMED BY THE SAME
#43Compact humidity and pressure sensor with temperature control
#44PACKAGE HEATERS FOR COLD TEMPERATURE OPERATION AND METHOD
#45STRUCTURE, SYSTEM AND METHOD FOR A TEMPERATURE REGULATED ELECTRICAL DEVICE
#46Semiconductor apparatus and electronic apparatus
#47THERMOCOMPRESSION DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING SAME
#48Method for manufacturing semiconductor structure with resistive elements
#49INTEGRATED THERMAL SOLUTION TO ENABLE OPERATION OF EMBEDDED PROCESSORS IN SUB-ZERO TEMPERATURES
#50HIGH FREQUENCY CIRCUIT
#51MIDDLE OF THE LINE HEATER AND METHODS
#52Silicide-sandwiched source/drain region and method of fabricating same
#533D FLASH MEMORY MODULE CHIP AND METHOD OF FABRICATING THE SAME
#54Transflective, PCM-based display device
#55Semiconductor package comprising heat dissipation plates
#56TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM
#57Resonator Device
#58MICROELECTRONIC ASSEMBLIES HAVING DIES WITH BACKSIDE BACK-END-OF-LINE HEATER TRACES
#59Integrated Circuit Device
#60Integrated Circuit Device
#61OPTICAL ELEMENT WITH HEATER LAYER
#62Ovenized MEMS
#63Power allocation to heat a processing chip of a network device
#64Semiconductor structure with heating element
#65Temperature-assisted device with integrated thin-film heater
#66On-die heater devices for memory devices and memory modules
#67Plurality of vertical heat conduction elements attached to metal film
#68FATIGUE FAILURE RESISTANT ELETRONIC PACKAGE
#69On-die thermal management for VLSI applications
#70Storage device unit
#71Thermal management system for electronic components with thermoelectric element
#72Closed loop temperature controlled circuit to improve device stability
#73CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD
#74Heater elements for processor devices
#75SYSTEM AND METHOD FOR PROVIDING A SIMPLE AND RELIABLE INERTIA MEASUREMENT UNIT (IMU)
#76Optical adjustable filter sub-assembly
#77Silicide-sandwiched source/drain region and method of fabricating same
#78THERMAL MANAGEMENT STRUCTURES FOR NITRIDE-BASED HEAT GENERATING SEMICONDUCTOR DEVICES
#79Compact humidity and pressure sensor with temperature control
#80CERAMIC STRUCTURE AND WAFER SYSTEM
#81Semiconductor device structure with resistive elements
#82DETACHABLE THERMAL LEVELER
#83Electrostatic discharge protection in integrated circuits using positive temperature coefficient material
#84Electronic device temperature test on strip film frames
#85Semiconductor device with heating structure
#86Micro heater chip, wafer-level electronic chip assembly and chip assembly stacking system
#87INTERPOSER BOARD HAVING HEATING FUNCTION AND ELECTRONIC DEVICE USING THE SAME
#88Vibration device
#89Electrostatically controlled gallium nitride based sensor and method of operating same
#90Display device and electronic device
#91BioFET device having a metal crown structure as a sensing layer disposed on an oxide layer formed under a channel region of a transistor
#92Micro-heaters in a film structure mounted on a substrate between a plurality of electronic components
#93Integrated heat spreader (IHS) with heating element
#94Electronic-component-mounted module design to reduce linear expansion coefficient mismatches
#95Method for manufacturing an electrically operable heating body for an inhaler
#96Heated pins to couple with solder elements
#97Multi-Phase Thermal Control Apparatus, Evaporators and Methods of Manufacture Thereof
#98Cryogenic on-chip microwave filter for quantum devices
#99Semiconductor device comprising a monitor including a second semiconductor layer in which dark current is changed by a heater
#100Surface mount passive component shorted together and a die
#101Heat exchange plate with slotted airfoil fins
#102Electronic device mounting structure and mounting device to mount such electronic device
#103System and method for providing a simple and reliable inertia measurement unit (IMU)
#104System and method for allowing restoration of interconnection of die of power module
#105Method and apparatus to control temperature of a semiconductor die in a computer system
#106Carrier structure and carrier device
#107Display panel, array substrate, display device and method for fabricating array substrate
#108HEATING ELEMENT AND SUPPORTING CIRCUITRY FOR ADAPTING A NOMINALLY RATED SEMICONDUCTOR CHIP TO AN EXTREMELY COLD ENVIRONMENT
#109Reflowable grid array to support grid heating
#110Interposer and electronic package
#111Element substrate, liquid discharge head, and printing apparatus
#112Ovenized MEMS
#113Semiconductor device
#114Silicon heater bonded to a test wafer
#115Semiconductor structure and method of forming a semiconductor structure
#116Chip structure operating method including heating elements to reduce temperature variation
#117Image sensor package having multi-level stack structure
#118Initiation of one or more processors in an integrated circuit
#119Transflective, PCM-based display device
#120Cryogenic on-chip microwave filter for quantum devices
#121Oven controlled crystal oscillator
#122Lid with embedded water detection and heater
#123Semiconductor device and power convertor
#124CMOS thermal fluid flow sensing device employing a flow sensor and a pressure sensor on a single membrane
#125Thermal conductive member and heat dissipation structure including the same
#126Oscillator, electronic apparatus and vehicle
#127Chip on carrier
#128Self-heating test structure
#129Enhancing memory yield and performance through utilizing nanowire self-heating
#130Logic timing and reliability repair for nanowire circuits
#131Apparatus having a cavity structure and method for producing same
#132Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods
#133Semiconductor packages
#134Film carrier, film application apparatus, film application method, and film to be applied used in display panel
#135Reducing thermal cycling fatigue
#136Oven controlled crystal oscillator consisting of heater-embedded ceramic package
#137Low cycle fatigue prevention
#138Activatable electronic component destruction device
#139POWER SEMICONDUCTOR MODULE, SNUBBER CIRCUIT, AND INDUCTION HEATING POWER SUPPLY APPARATUS
#140Integrated circuit package with partitioning based on environmental sensitivity
#141Semiconductor device
#142Apparatus, system and method of a temperature sensor
#143Method of forming a photodiode
#144Strain-Tolerant Die Attach with Improved Thermal Conductivity, and Method of Fabrication
#145Optical adjustable filter sub-assembly
#146Closed loop temperature controlled circuit to improve device stability
#147Method of operating a semiconductor image sensor with integrated pixel heating
#148Optical device with thermally switching phase change material
#149Chip structure including heating element
#150Integrated circuit device with adaptations for multiplexed biosensing
#151Semiconductor packages
#152Electronic device
#153System and method for providing a simple and reliable inertia measurement unit (IMU)
#154Semiconductor package with programmable signal routing
#155Gas sensor
#156Thermal hardware-based data security device that permanently erases data by using local heat generation phenomenon and method thereof
#157Semiconductor device, method of manufacturing same, liquid discharge head, and liquid discharge apparatus
#158Transistor implemented heat source
#159Phase changing on-chip thermal heat sink
#160BALL GRID ARRAY SOLDER ATTACHMENT
#161TFT substrate, scanning antenna using same, and method for manufacturing TFT substrate
#162Self-heating test structure
#163THREE-DIMENSIONAL HEAT-ABSORBING DEVICE
#164Method of fabricating a biological field-effect transistor (BioFET) with increased sensing area
#165Apparatus having a cavity structure and method for producing same
#166Bonding junction structure
#167Self-healing semiconductor transistors
#168REDUCING THERMAL CYCLING FATIGUE
#169Reducing thermal cycling fatigue
#170Phase changing on-chip thermal heat sink
#171Electronic device and joined member
#172FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
#173Image sensor package having multi-level stack structure
#174Separation of integrated circuit structure from adjacent chip
#175Sensing device, sensing apparatus and sensing system
#176Apparatus for manufacturing a thermoelectric module
#177Gas sensor
#178INTERPOSER HEATER FOR HIGH BANDWIDTH MEMORY APPLICATIONS
#179Semiconductor device
#180PHOTODETECTOR WITH INTEGRATED TEMPERATURE CONTROL ELEMENT
#181Temperature sensing circuit with temperature coefficient estimation and compensation using time variable substrate heating
#182Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation
#183Chip mounting structure
#184Heatable interposer for temperature-controlled testing of semiconductor devices
#185Thin film transistor and method of manufacturing the same, and display device
#186Activating reactions in integrated circuits through electrical discharge
#187CMOS thermal-diffusivity temperature sensor based on polysilicon
#188Sensor and heater for stimulus-initiated fracture of a substrate
#189Array substrate and activation method for TFT elements in array substrate
#190Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
#191Enhancing memory yield and performance through utilizing nanowire self-heating
#192Logic timing and reliability repair for nanowire circuits
#193Embedded temperature control system for a biosensor
#194Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device
#195Strain-tolerant die attach with improved thermal conductivity, and method of fabrication
#196Thermo-electrically pumped light-emitting diodes
#197Semiconductor device and manufacturing method thereof
#198Apparatus and method to support thermal management of semiconductor-based components
#199Extended temperature operation for electronic systems using induction heating
#200Oven controlled crystal oscillator consisting of heater-embedded ceramic package
#201Integrated circuit device with adaptations for multiplexed biosensing
#202Three-dimensional production method for functional element structure body and functional element structure body
#203CMOS integrated microheater for a gas sensor device
#204Rework grid array interposer with direct power
#205BALL GRID ARRAY SOLDER ATTACHMENT
#206INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
#207Thermal clutch for thermal control unit and methods related thereto
#208Integrated circuit packages with temperature sensor traces
#209Controller for an electric heating device and method for producing same
#210Semiconductor image sensor with integrated pixel heating and method of operating a semiconductor image sensor
#211Integrated circuit device, electronic device, electronic apparatus, and base station
#212Photodetector with integrated temperature control element formed at least in part in a semiconductor layer
#213System and method for providing a simple and reliable inertia measurement unit (IMU)
#214Chip mounting structure
#215Electronic device for heating an integrated structure, for example an MOS transistor
#216Integrated circuit device with adaptations for multiplexed biosensing
#217Activating reactions in integrated circuits through electrical discharge
#218Semiconductor device packages with improved thermal management and related methods
#2193D VLSI interconnection network with microfluidic cooling, photonics and parallel processing architecture
#220Non-contacting inductive interconnects
#221Cooling device for a current converter module
#222Activating reactions in integrated circuits through electrical discharge
#223Flow sensor package
#224Method to match SOI transistors using a local heater element
#225Activating reactions in integrated circuits through electrical discharge
#226Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit
#227SEMICONDUCTOR DEVICE
#228Integrated power module with improved isolation and thermal conductivity
#229Fabricating pillar solder bump
#230Integrated circuit chip with corrected temperature drift
#231Semiconductor device having a fuse element
#232ESTABLISHING A THERMAL PROFILE ACROSS A SEMICONDUCTOR CHIP
#233Closed loop temperature controlled circuit to improve device stability
#234Systems and methods for configuring a semiconductor device
#235Phonon-recycling light-emitting diodes
#236Semiconductor device and electronic device
#237Semiconductor device with integrated hot plate and recessed substrate and method of production
#238Method and system for optimizing performance of a PCD while mitigating thermal generation
#239Establishing a thermal profile across a semiconductor chip
#240Package of power dies and three-phase power converter
#241Semiconductor device having a switch that expands and contracts by temperature change
#242Semiconductor device with a multiple nanowire channel structure and methods of variably connecting such nanowires for current density modulation
#243Structure for optical waveguide and contact wire intersection
#244Electronic component module and an assembly including the same
#245Fabricating pillar solder bump
#246Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#247Semiconductor device and selective heating thereof
#248Thermal treatment of flash memories
#249Electronic component assembly apparatus
#250Closed loop temperature controlled circuit to improve device stability
#251Semiconductor package and method of fabricating the same
#252Temperature control device and method and electronic device
#253Heating element and circuit module stack structure
#254Slotted configuration for optimized placement of micro-components using adhesive bonding
#255Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device
#256HEAT SLUG HAVING THERMOELECTRIC ELEMENTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#257Electronic fuse with resistive heater
#258Semiconductor test device and method for fabricating the same
#259Flip-chip hybridization of microelectronic components by local heating of connecting elements
#260SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME
#261Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
#262Integrated circuit to operate in an area of ionizing radiation, and having an output for a radiation dose-dependent way damage information, and alarm indicators and corresponding method
#263Crystal oscillator emulator with externally selectable operating configurations
#264Semiconductor device having a fuse element
#265Distributed heating transistor devices providing reduced self-heating
#266Circuits, systems and methods for integrating sensing and heating functions
#267POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#268Integrated chip with heating element and reference circuit
#269Method for limiting the variation in the temperature of an electrical component
#270Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
#271HEATER FOR SEMICONDUCTOR DEVICE
#272Temperature stabilitized MEMS
#273PCB based RF-power package window frame
#274APPARATUS AND METHOD TO TEST EMBEDDED THERMOELECTRIC DEVICES
#275METHODS OF HEATING INTEGRATED CIRCUITS AT LOW TEMPERATURES AND DEVICES USING THE METHODS
#276Temperature management circuit, system on chip including the same and method of managing temperature
#277Capacitance trimming with an integrated heater
#278Method and apparatus for maintaining operational temperature of an integrated circuit
#279Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods
#280Integrated circuit
#281Integrated circuit with temperature increasing element and electronic system having the same
#282Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
#283Electronic trimming circuit with reduced number of dedicated trimming pins
#284Thermal treatment of flash memories
#285Electronic component and electronic component assembly apparatus
#286Calibration of temperature sensitive circuits with heater elements
#287Dual thin film precision resistance trimming
#288Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element
#289Loop heat pipe system and information processing apparatus
#290Porous thermoplastic foams as heat transfer materials
#291Semiconductor device and assembling method thereof
#292Heater design for heat-trimmed thin film resistors
#293Vialess integration for dual thin films—thin film resistor and heater
#294Method to match SOI transistors using a local heater element
#295Closed loop temperature controlled circuit to improve device stability
#296Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems
#297Battery heating circuits and methods with resonance components in series using voltage inversion based on predetermined conditions
#298Battery heating circuits and methods with resonance components in series using voltage inversion and freewheeling circuit components
#299Battery heating circuits and methods based on battery discharging and charging using resonance components in series and current limiting components
#300Battery heating circuits and methods using resonance components in series and bridge charge storage components