207650 ⎘
Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling; Auxiliary members in containers characterised by their shape, e.g. pistons Pistons, e.g. spring-loaded members
THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM
#2DISC CELL ASSEMBLY CLAMP
#3POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
#4Distributing heatsink load across a processor module with separable input/output (I/O) connectors
#5Flexible heat transfer mechanism configurations
#6Device for removing heat
#7Thermal conduction device and associated heat dissipation system
#8Expanding thermal device and system for effecting heat transfer within electronics assemblies
#9MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
#10Dynamic mounting thermal management for devices on board
#11Expanding thermal device and system for effecting heat transfer within electronics assemblies
#12FLEXIBLE METALLIC HEAT CONNECTOR
#13Systems and methods for coupling a semiconductor device of an automation device to a heat sink
#14Multi-chip self adjusting cooling solution
#15Heat transferring device
#16Circuit arrangement for the thermal protection of a power semiconductor
#17Backside initiated uniform heat sink loading
#18Method and system for thermomechanically decoupling heatsink
#19Semiconductor device, and on-board power conversion device
#20Signal transmission device
#21Adjustable heat pipe thermal unit
#22Adjustable heat sink assembly
#23Multichip electronic packages and methods of manufacture
#24Flexible metallic heat connector
#25THERMAL SOLUTION WITH SPRING-LOADED INTERFACE
#26Multichip electronic packages and methods of manufacture
#27Lower profile heat dissipating system embedded with springs
#28Multichip electronic packages and methods of manufacture
#29OVERHEAD-MOUNTED HEATSINK
#30Cold plate having blades that interleave with memory modules
#31Semiconductor cooling apparatus
#32Multichip electronic packages and methods of manufacture
#33Electrical component assembly for thermal transfer
#34Multichip electronic packages and methods of manufacture
#35Chip cooling device having wedge element
#36THERMAL PLUG FOR USE WITH A HEAT SINK AND METHOD OF ASSEMBLING SAME
#37FIXING MOUNT AND THERMAL MODULE THEREOF
#38ELECTRONIC APPARATUS
#39Void reduction in indium thermal interface material
#40ELECTRONIC APPARATUS
#41Electronic package with a thermal interposer and method of manufacturing the same
#42THERMALLY BALANCED HEAT SINKS
#43Mounting device for mounting heat sink onto electronic component
#44HEAT-CONDUCTING ASSEMBLY
#45Cooling assembly
#46Piston reset apparatus for a multichip module and method for resetting pistons in the same
#47THERMAL TRANSFER DEVICE
#48Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled
#49Printed circuit board unit and electronic apparatus
#50Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
#51Guided pin and plunger
#52Void reduction in indium thermal interface material
#53Heatspreader for single-device and multi-device modules
#54Semiconductor chip assembly with flexible metal cantilevers
#55Gimballed attachment for multiple heat exchangers
#56Heat dissipation apparatus
#57Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
#58Adjustable height liquid cooler in liquid flow through plate
#59Thermal transfer device
#60Cooling apparatus for electronic device
#61Thermal conductor and use thereof
#62Refrigeration system
#63Apparatus for controlling thermal interface between cold plate and integrated circuit chip
#64Electronic apparatus and display apparatus equipped with the electric apparatus
#65Heat-transfer devices
#66Heat-transfer devices
#67Method and apparatus for providing an integrated circuit cover
#68Integrated-circuit cooling system
#69Double-sided cooling type semiconductor module
#70Method of assembly of a wedge thermal interface to allow expansion after assembly
#71Variable height thermal interface
#72Thermally enhanced electronic module
#73Device for cooling memory modules