Patents-Review.com
ClassID:

207671 ⎘

H01L23/4922 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Bases or plates or solder therefor having a heterogeneous or anisotropic structure

Recent Application in this class:
#1
20260011625
2026-01-08

SEMICONDUCTOR DEVICE

 #2
20250316633
2025-10-09

HIGH THERMAL DISSIPATION, PACKAGED ELECTRONIC DEVICE AND MANUFACTURING PROCESS THEREOF

 #3
20250087561
2025-03-13

POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWER DEVICE CELL

 #4
20250069992
2025-02-27

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

 #5
20240404922
2024-12-05

METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN

 #6
20230326834
2023-10-12

BUSBAR WITH DIELECTRIC COATING

 #7
20230238307
2023-07-27

Dual-side cooling semiconductor packages and related methods

 #8
20230187404
2023-06-15

POWER SEMICONDUCTOR MODULE

 #9
20230154818
2023-05-18

HEADER FOR SEMICONDUCTOR PACKAGE

 #10
20230080004
2023-03-16

Manufacturing a module with solder body having elevated edge

 #11
20230032035
2023-02-02

SEMICONDUCTOR MODULE

 #12
20220238447
2022-07-28

Semiconductor device

 #13
20220208653
2022-06-30

Dual-side cooling semiconductor packages and related methods

 #14
20220199563
2022-06-23

HIGH THERMAL DISSIPATION, PACKAGED ELECTRONIC DEVICE AND MANUFACTURING PROCESS THEREOF

 #15
20220102243
2022-03-31

Element module

 #16
20210249335
2021-08-12

Composite assembly of three stacked joining partners

 #17
20210242132
2021-08-05

Microelectronic device including fiber-containing build-up layers

 #18
20210166952
2021-06-03

Manufacturing a module with solder body having elevated edge

 #19
20210159204
2021-05-27

Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant

 #20
20210013120
2021-01-14

Semiconductor devices and methods of manufacturing the same

 #21
20200303360
2020-09-24

Semiconductor device with a protruding base member

 #22
20200294893
2020-09-17

Component structure, power module and power module assembly structure

 #23
20200294892
2020-09-17

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

 #24
20200286833
2020-09-10

Semiconductor device

 #25
20200227607
2020-07-16

Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member

 #26
20200126890
2020-04-23

Packaging of a semiconductor device with phase-change material for thermal performance

 #27
20200105674
2020-04-02

Microelectronic device including fiber-containing build-up layers

 #28
20200091043
2020-03-19

Terminal plate and semiconductor device

 #29
20200006203
2020-01-02

Core-shell particles for magnetic packaging

 #30
20190067167
2019-02-28

Component structure, power module and power module assembly structure

 #31
20180375061
2018-12-27

Lighting apparatus using organic light-emitting diode and method of fabricating the same

 #32
20180308827
2018-10-25

Power semiconductor arrangement having a stack of connection plates

 #33
20180247882
2018-08-30

Chip-on-film semiconductor packages and display apparatus including the same

 #34
20180197838
2018-07-12

Power semiconductor device

 #35
20180158757
2018-06-07

Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module

 #36
20180130748
2018-05-10

Semiconductor device having a plurality of semiconductor modules connected by a connection component

 #37
20180122723
2018-05-03

Semiconductor device

 #38
20170288107
2017-10-05

Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member

 #39
20170131581
2017-05-11

Low-profile microdisplay module

 #40
20160309589
2016-10-20

Substrate structure and display panel using same

 #41
20160111181
2016-04-21

Anisotropic electroconductive particles

 #42
20160014895
2016-01-14

Substrate structure

 #43
20150054019
2015-02-26

Semiconductor device having electrode interconnections within a conductive adhesive

 #44
20090258161
2009-10-15

Circuitized substrate with P-aramid dielectric layers and method of making same

 #45
20090173426
2009-07-09

Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

 #46
20090075056
2009-03-19

ALUMINUM-SILICON CARBIDE COMPOSITE BODY AND METHOD FOR PROCESSING THE SAME

 #47
20080191354
2008-08-14

Circuitized substrate with continuous thermoplastic support film dielectric layers

 #48
20080191353
2008-08-14

Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

 #49
20070221400
2007-09-27

Multilayer interconnection substrate, semiconductor device, and solder resist

 #50
20070182016
2007-08-09

Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

 #51
20070160817
2007-07-12

Printed circuit board and method of manufacturing semiconductor package using the same

 #52
20060223231
2006-10-05

Packing method for electronic components

 #53
20060180936
2006-08-17

Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same

 #54
20060131755
2006-06-22

Method of making circuitized substrate

 #55
20060125103
2006-06-15

Information handling system including a circuitized substrate having a dielectric layer without continuous fibers

 #56
20050258529
2005-11-24

High-frequency chip packages

 #57
20050224985
2005-10-13

Circuitized substrate

 #58
20050224251
2005-10-13

Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same

 #59
20050218524
2005-10-06

Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

 #60
20050056922
2005-03-17

Expansion constrained die stack

 #61
18446841
2024-09-10

Metal substrates with structures formed therein and methods of making same