207674 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Bases or plates or solder therefor characterised by the materials the materials containing carbon
Semiconductor device and method of manufacturing semiconductor device
#2Interconnect structure having a graphene layer
#3Method for capping Cu layer using graphene in semiconductor
#4Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
#5Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#6Conductive compositions and methods of using them
#7Methods and configuration for manufacturing flip chip contact (FCC) power package
#8Conductive compositions and methods of using them
#9Mono-acid hybrid conductive composition and method
#10Carbon nanotube-dispersed composite material, method for producing same and article same is applied to
#11Method for producing carbon nanotube-dispersed composite material
#12Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device