207672 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Bases or plates or solder therefor characterised by the materials
Sub-classes:MULTILAYER ASSEMBLY, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME
#2POWER CIRCUIT MODULE
#3PACKAGING STRUCTURE AND PACKAGING METHOD FOR KILOAMPERE-LEVEL SINGLE-SWITCH SIC POWER SEMICONDUCTOR MODULE
#4POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWER DEVICE CELL
#5POWER MODULE PACKAGE BASEPLATE WITH STEP RECESS DESIGN
#6METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
#7THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPREADER CONFIGURED AS A BACKSIDE POWER PLANE
#8FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
#9DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#10POWER MODULE AND MANUFACTURING METHOD THEREFOR
#11SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#12SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STANCHION
#13DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
#14SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#15SEMICONDUCTOR DEVICE AND A METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE
#16SEMICONDUCTOR MODULE
#17Semiconductor device arrangement with compressible adhesive
#18Power module package baseplate with step recess design
#19BUSBAR WITH DIELECTRIC COATING
#20Semiconductor device and method for manufacturing semiconductor device
#21HYBRID BONDED CAPACITORS
#22POWER SEMICONDUCTOR MODULE
#23System in package with flip chip die over multi-layer heatsink stanchion
#24POWER CIRCUIT MODULE
#25SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#26SEMICONDUCTOR MODULE
#27TERMINAL MEMBER AND SEMICONDUCTOR DEVICE
#28Multi-chip package with reinforced isolation
#29Semiconductor device
#30Power module package baseplate with step recess design
#31Semiconductor package having a chip carrier with a pad offset feature
#32Soldering structure with groove portion and power module comprising the same
#33Hermetic metallized via with improved reliability
#34Semiconductor package and production method thereof, and semiconductor device
#35Semiconductor device with connecting member for electrode and method of manufacturing
#36Semiconductor device including resin-insulated copper base plate and manufacturing method of semiconductor device
#37Multi-chip package with reinforced isolation
#38Apparatuses exhibiting enhanced stress resistance and planarity, and related microelectronic devices and memory devices
#39Power semiconductor apparatus
#40METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#41LIGHT-EMITTING APPARATUS INCLUDING SACRIFICIAL PATTERN
#42Semiconductor device and method of manufacturing semiconductor device
#43Semiconductor device
#44Apparatuses exhibiting enhanced stress resistance and planarity, and related methods
#45Semiconductor device
#46Discrete power transistor package having solderless DBC to leadframe attach
#47Light-emitting apparatus including sacrificial pattern and manufacturing method thereof
#48Semiconductor device
#49Hermetic metallized via with improved reliability
#50Semiconductor device, method for manufacturing the same, and power converter
#51Semiconductor sub-assembly and semiconductor power module
#52Wiring board
#53Package with component connected with carrier via spacer particles
#54Core-shell particles for magnetic packaging
#55POWER DEVICE FOR RECTIFIER
#56Hermetic metallized via with improved reliability
#57Packaged semiconductor components having substantially rigid support members
#58Semiconductor device including conductive spacer with small linear coefficient
#59Thermosonically bonded connection for flip chip packages
#60Power semiconductor device and method for manufacturing power semiconductor device
#61Semiconductor device
#62Package with component connected with carrier via spacer particles
#63Integrated circuit package with microstrip routing and an external ground plane
#64Lead frame
#65Power electronics module
#66Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#67Semiconductor device and power electronics apparatus
#68Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
#69SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#70Integrated circuit package having pin up interconnect
#71Power semiconductor device module having mechanical corner press-fit anchors
#72Bidirectional semiconductor package
#73Baseplate for an electronic module
#74Thermosonically bonded connection for flip chip packages
#75Heat sink for cooling of power semiconductor modules
#76Stress reduction interposer for ceramic no-lead surface mount electronic device
#77Microwave and millimeter wave package
#78Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device
#79SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#80Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#81Reinforcement structure and method for controlling warpage of chip mounted on substrate
#82Semiconductor package with conductive clip
#83Power semiconductor device
#84Methods for forming semiconductor device packages
#85Semiconductor device packages
#86Semiconductor device
#87Power semiconductor module and composite module
#88Tape for electronic devices with reinforced lead crack
#89Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#90Semiconductor device module with solder layer
#91Semiconductor device
#92Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#93Power module and fabrication method for the same
#94Method of attaching an electronic part to a copper plate having a surface roughness
#95SEMICONDUCTOR POWER MODULE USING DISCRETE SEMICONDUCTOR COMPONENTS
#96Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#97Semiconductor device
#98Double-sided cooling power module and method for manufacturing the same
#99Cold Plate, Device Comprising a Cold Plate and Method for Fabricating a Cold Plate
#100Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#101Power module semiconductor device
#102SEMICONDUCTOR DEVICE AND MODULE
#103Package structure and packaging method of wafer level chip scale package
#104Semiconductor package with conductive clip
#105Power semiconductor package with conductive clip and related method
#106SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#107Semiconductor device
#108Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#109SEMICONDUCTOR DEVICE
#110Chip assembly system
#111DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH
#112POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES
#113Conductive connecting member and manufacturing method of same
#114HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE
#115Power semiconductor package
#116Silicon carbide semiconductor
#117GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#118Semiconductor arrangement and method for producing a semiconductor arrangement
#119Semiconductor device
#120BASE PLATE WITH TAILORED INTERFACE
#121PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS
#122High temperature, stable SiC device interconnects and packages having low thermal resistance
#123ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#124Rectifier for automotive alternator
#125Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#126High temperature, stable SiC device interconnects and packages having low thermal resistance
#127Microcircuit package having ductile layer
#128Semiconductor chip, semiconductor device and methods for producing the same
#129Process of fabricating a semiconductor package
#130GaAs integrated circuit device and method of attaching same
#131Semiconductor package
#132Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor
#133Solder composition for electronic devices
#134Semiconductor package
#135High temperature, stable SiC device interconnects and packages having low thermal resistance
#136Press pack power semiconductor module
#137Layer sequence for producing a composite material for electromechanical components
#138Nano-metal composite made by deposition from colloidal suspensions
#139Metal substrates with structures formed therein and methods of making same