207682 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads; Additional leads the additional leads being a tape carrier or flat leads
Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#902SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS
#903Semiconductor device
#904Semiconductor Device And Production Method For Semiconductor Device
#905Semiconductor package structure for vertical mount and method
#906PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE
#907SEMICONDUCTOR DEVICE
#908Semiconductor package having a bridged plate interconnection
#909SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
#910Method of producing a semiconductor package
#911Semiconductor device
#912SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE
#913Multi-chip module
#914Integrated circuit including clip
#915WIREBOND-LESS SEMICONDUCTOR PACKAGE
#916Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
#917Surface mount multichip devices
#918Semiconductor device and method of manufacturing the same
#919Method of Manufacturing a Semiconductor Device
#920Semiconductor package having dimpled plate interconnections
#921Power semiconductor device connected in distinct layers of plastic
#922Semiconductor package structure
#923Semiconductor package structure having enhanced thermal dissipation characteristics
#924Semiconductor package structure
#925Copper straps
#926Dual side cooling integrated power device module and methods of manufacture
#927Integrated circuit device with semiconductor device components embedded in plastic housing composition
#928Method of manufacturing semiconductor apparatus
#929Semiconductor die package including multiple dies and a common node structure
#930Power semiconductor component, power semiconductor device as well as methods for their production
#931Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#932Power semiconductor component with a power semiconductor chip and method for producing the same
#933Semiconductor device including a DC-DC converter
#934Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#935Semiconductor device and manufacturing the same
#936Semiconductor device having through contact blocks with external contact areas
#937Semiconductor device
#938Electronic component and method for its assembly
#939Clipless and wireless semiconductor die package and method for making the same
#940Vertical power semiconductor component, semiconductor device and methods for the production thereof
#941Semiconductor device and method for producing the same
#942Semiconductor package structure and method of manufacture
#943Semiconductor package structure for vertical mount and method
#944Semiconductor package structure and method of manufacture
#945Method of forming a leaded molded array package
#946Integrated circuit package system including ribbon bond interconnect
#947Electronic module and method of assembling the same
#948Power semiconductor device in lead frame employing connecting element with conductive film
#949Method of forming a molded array package device having an exposed tab and structure
#950Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die
#951Semiconductor package having plate interconnections
#952Semiconductor component and method of assembling the same
#953Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#954Semiconductor device and method of manufacturing the same
#955Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#956Power semiconductor device comprising a semiconductor chip stack and method for producing the same
#957Semiconductor power component with a vertical current path through a semiconductor power chip
#958Semiconductor connection component
#959Semiconductor component and method of manufacture
#960Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
#961Methods of making integrated circuits
#962Semiconductor device having surface mountable external contact areas and method for producing the same
#963Semiconductor device
#964Semiconductor device with semiconductor chip mounted in package
#965Semiconductor package with plated connection
#966Electrical-interference-isolated transistor structure
#967Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
#968Lead frame and semiconductor device having the lead frame
#969Semiconductor device and a manufacturing method of the same
#970Strap bonding machine and method of manufacturing a semiconductor device
#971Surface mount multichip devices
#972Semiconductor device and method of manufacturing the same
#973Semiconductor device
#974Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
#975Surface mount multichip devices
#976Package structures
#977Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
#978Integrated circuit with connectivity error detection
#979Multi-drain gallium-nitride module with multiple voltage ratings
#980Semiconductor package with partial plating on contact side surfaces
#981Semiconductor package with partial plating on contact side surfaces