Semiconductor device and method of manufacturing the same

Semiconductor device having a clip contact

Semiconductor packaging method using connecting plate for internal connection

Wireless module with active devices

Common drain power clip for battery pack protection mosfet

Semiconductor package with connecting plate for internal connection

Stacked die power converter

Method of manufacturing semiconductor device

Stacked dual chip package having leveling projections

Multi-chip module power clip

Top exposed semiconductor chip package

Measuring current in a power regulator system

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Reduced-noise reference voltage platform for a voltage converter device

Thermally enhanced semiconductor package

Lead Frame Packages and Methods of Formation Thereof

Thermally enhanced semiconductor package with conductive clip

Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device

Semiconductor device

Wiring member and semiconductor module having the same

Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements

Multi-chip module including stacked power devices with metal clip

Electronic Module

Dual power converter package using external driver IC

Semiconductor packages and methods of formation thereof

Multichip power semiconductor device

Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package

Process of making a stacked semiconductor package having a clip

Integrated dual power converter package having internal driver IC

Semiconductor device

Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

Power semiconductor module and power unit device

Power module

Semiconductor device and method of manufacturing the same

Stacked half-bridge package with a common leadframe

Power semiconductor module

Semiconductor device using diffusion soldering

Connector and resin-sealed semiconductor device

Power semiconductor module and manufacturing method thereof

Chip on film package including test pads and semiconductor devices including the same

Module including a discrete device mounted on a DCB substrate

Method of forming a semiconductor device and leadframe therefor

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed

Monolithic semiconductor switches and method for manufacturing

Multi-transistor exposed conductive clip for semiconductor packages

Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor package and method for manufacturing the same and semiconductor package module having the same

Package structure and the method to fabricate thereof

Semiconductor device

Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method

Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices

Semiconductor device

High performance power transistor having ultra-thin package

Semiconductor arrangement

Power semiconductor chip having two metal layers on one face

Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages

Semiconductor device

Method of manufacturing a semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

Semiconductor device including a contact clip having protrusions and manufacturing thereof

Four MOSFET full bridge module

Semiconductor device

Power device having reduced thickness

Power Semiconductor Package

Semiconductor die package and method for making the same

DC/DC CONVERTOR POWER MODULE PACKAGE INCORPORATING A STACKED CONTROLLER AND CONSTRUCTION METHODOLOGY

Stack frame for electrical connections and the method to fabricate thereof

Power package including multiple semiconductor devices

Semiconductor device and driving apparatus including semiconductor device

Semiconductor device including Schottky barrier diode

Stacked power semiconductor device using dual lead frame and manufacturing method

Common drain exposed conductive clip for high power semiconductor packages

Multi-transistor exposed conductive clip for high power semiconductor packages

Thermally enhanced semiconductor package with exposed parallel conductive clip

Manufacturing electronic device having contact elements with a specified cross section

Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof

High voltage cascoded III-nitride rectifier package utilizing clips on package surface

Module comprising a semiconductor chip

POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF

Semiconductor device and manufacturing method of the same

Semiconductor device

Semiconductor device

Package structure for DC-DC converter

Lead component and method for manufacturing the same, and semiconductor package

Flip chip semiconductor device

Power converter having integrated capacitor

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

Manufacturing method of semiconductor device

Power device with bottom source electrode

STACKED DIE POWER CONVERTER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor device mounting structure

Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing

Multi chip module, method for operating the same and DC/DC converter

Power semiconductor package structure and manufacturing method thereof

Stacked half-bridge package with a current carrying layer

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

Stacked half-bridge package with a common conductive leadframe

Stacked half-bridge package with a common conductive clip

Device including two mounting surfaces

Semiconductor device and method for manufacturing the same

Chip assembly with frequency extending device

High power semiconductor package with conductive clip and flip chip driver IC with integrated control transistor

High power semiconductor package with conductive clips and flip chip driver IC

High power semiconductor package with multiple conductive clips

High power semiconductor package with conductive clip on multiple transistors

High power semiconductor package with conductive clip

Power semiconductor device package method

Dual-leadframe multi-chip package and method of manufacture

FOUR MOSFET FULL BRIDGE MODULE

Semiconductor device including a DC-DC converter with schottky barrier diode

Top exposed package and assembly method

Die arrangement and method of forming a die arrangement

Clip interconnect with encapsulation material locking feature

Dual lead frame semiconductor package and method of manufacture

Substrateless power device packages

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Semiconductor die package including low stress configuration

SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE

Electronic device comprising a chip disposed on a pin

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

Package structure for DC-DC converter

Manufacturing method for semiconductor device carrier and semiconductor package using the same

Semiconductor device integrated with converter and package structure thereof

SEMICONDUCTOR DEVICE

Self-aligning structures and method for integrated chips

Compact semiconductor package with integrated bypass capacitor

Semiconductor encapsulation and method thereof

BONDING STRUCTURE AND METHOD

Semiconductor device package and method of assembly thereof

Internal packaging of a semiconductor device mounted on die pads

Semiconductor module and method of manufacturing the same

Semiconductor device attached to island having protrusion

Semiconductor Device

Combined packaged power semiconductor device

Semiconductor component and method of manufacture

Electronic device and method for connecting a die to a connection terminal

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor module device and driving apparatus having the same

Stacked-die package for battery power management

Pre-molded clip structure

Semiconductor device packages including a semiconductor device and a redistribution element

DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE

Semiconductor device and lead frame used for the same

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Power semiconductor module

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and manufacturing method of the same

Dual-leadframe multi-chip package and method of manufacture

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Stacked dual chip package and method of fabrication

Multi-layer lead frame package and method of fabrication

Semiconductor packaging and fabrication method using connecting plate for internal connection

High Frequency Power Supply Module Having High Efficiency and High Current

Method of manufacturing a semiconductor device

Semiconductor device including a DC-DC converter having a metal plate

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor connection component

Semiconductor die package including IC driver and bridge

Semiconductor device and method of manufacturing the same

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Semiconductor package with metal straps

Wirebond-less semiconductor package

Self locking and aligning clip structure for semiconductor die package

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Semiconductor device package having features formed by stamping

Dual side cooling integrated power device module and methods of manufacture

Power semiconductor device and method for its production

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Semiconductor device

Semiconductor device

Semiconductor device

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE INCLUDING HEAT SINKS

Semiconductor device and method for manufacturing the same

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device and manufacturing method therefor

FLMP buck converter with a molded capacitor and a method of the same

Mounted body and method for manufacturing the same

Lead and lead frame for power package

Semiconductor package with ribbon with metal layers

Semiconductor die package and method for making the same

Semiconductor device and method of manufacturing the same

Monolithic semiconductor switches and method for manufacturing

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

Semiconductor device package and method of assembly thereof

PACKAGED POWER SWITCHING DEVICE

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Thermally enhanced thin semiconductor package

Semiconductor die package including low stress configuration

Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same

Semiconductor die package with clip interconnection

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Compact semiconductor package with integrated bypass capacitor and method

Top-side cooled semiconductor package with stacked interconnection plates and method

Electronic package structure and method

Semiconductor device including a DC-DC converter having a metal plate

ELECTRONIC PACKAGE STRUCTURE AND METHOD

Electronic package structure having conductive strip and method

Semiconductor device and manufacturing method thereof

Semiconductor device and a manufacturing method of the same

Semiconductor die package including lead with end portion

Pre-molded, clip-bonded multi-die semiconductor package

SEMICONDUCTOR DEVICE

Semiconductor die package including multiple dies and a common node structure

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

Top exposed clip with window array

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Electronic device and method of manufacturing same

Semiconductor device

Method of forming a molded array package device having an exposed tab and structure

Electronic device having contact elements with a specified cross section and manufacturing thereof

Semiconductor device

Electrode structure and semiconductor device

Flex chip connector for semiconductor device

Method of forming a leaded molded array package

Four mosfet full bridge module

Conductive clip for semiconductor device package

Multi-chip discrete devices in semiconductor packages

Electronic circuit device and method for manufacturing same

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

Apparatus and method for a chip assembly including a frequency extending device

Semiconductor device package having features formed by stamping

Integrated circuit package system with planar interconnect

Semiconductor device

Semiconductor package having a bridged plate interconnection

Semiconductor Device

Semiconductor die package including IC driver and bridge

Semiconductor die package including exposed connections

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

SEMICONDUCTOR DEVICE

Semiconductor package having a bridge plate connection

Semiconductor package and methods of fabricating the same

Semiconductor device and manufacturing method of the same

Method of manufacturing electronic device on leadframe

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

Flex clip connector for semiconductor device

Semiconductor device and manufacturing method of the same

Stacked-die package for battery power management

Self-aligning structures and method for integrated circuits

Clip mount for integrated circuit leadframes

Device with a plurality of semiconductor chips

Semiconductor device

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Wireless semiconductor package for efficient heat dissipation

Method of manufacturing a semiconductor device

Integrated circuit device having a gas-phase deposited insulation layer

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Semiconductor device

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Semiconductor connection component

Semiconductor device including a coupling conductor having a concave and convex

Semiconductor die package including heat sinks

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Semiconductor device with semiconductor chip and method for producing it

Semiconductor device with welded leads and method of manufacturing the same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Semiconductor device including semiconductor chips having contact elements

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Methods of packaging a semiconductor die and package formed by the methods

Semiconductor device

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Mounted body and method for manufacturing the same

Integrated circuit device and method for the production thereof

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method of making semiconductor package with plated connection

Module comprising a semiconductor chip

Semiconductor module with multiple semiconductor chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Electronic package structure and method

Electronic component and method for manufacturing an electronic component

Multi-chip module

Pre-molded clip structure

Semiconductor power device