ENHANCED VIDEO BANDWIDTH DEVICE PACKAGES

MULTILAYER ASSEMBLY, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SAME

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

DEVICE PACKAGE HAVING SIGNAL PADS CONFIGURED TO PROMOTE SELF ALIGNMENT OF LEADS AND PROCESS OF IMPLEMENTING THE SAME

DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER

Embedded Power Semiconductor Package with Sidewall Contacts

POWER STAGE DEVICE CLIP

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

Lead Frame

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE HAVING A SOLDER BLEED OUT PREVENTION LAYER AND METHOD FOR FABRICATING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

DUAL PACKAGE SWITCHING POWER DEVICE

POWER ELECTRONIC SYSTEM HAVING A POWER SEMICONDUCTOR MODULE AND A CURRENT SENSOR AND POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDUCTOR DEVICE

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method

ELECTRONIC DEVICE WITH LEAD LOCK

MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELECTRONIC DEVICES

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICALLY WELDED CONTACT REGIONS AND METHOD OF PRODUCING THE POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

Semiconductor device including semiconductor chip having power transistor and temperature sensing diode

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

Semiconductor device package assemblies with direct leadframe attachment

METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLY, AND APPLICATION OF SEMICONDUCTOR DEVICE ASSEMBLY

PROCESS FOR THIN FILM CAPACITOR INTEGRATION

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR POWER MODULE

Semiconductor Package Providing an Even Current Distribution and Stray Inductance Reduction and a Semiconductor Device Module

DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPPER NICKEL TIN METALLIZATION STACK AND DIFFUSION SOLDERING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPONENT, SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE

Leadframe spacer for double-sided power module

SEMICONDUCTOR DEVICE

CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND METHOD OF FORMING A CHIP SYSTEM

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor package having a metal clip and related methods of manufacturing

SEMICONDUCTOR DEVICE PACKAGE

Semiconductor device

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Thin semiconductor packaging unit having a plurality of bridging layers

Molded semiconductor package having an embedded inlay

ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

Semiconductor device

DISCRETE POWER SEMICONDUCTOR PACKAGE

Semiconductor package structures and methods of manufacture

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS

POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD

Dual cool power module with stress buffer layer

Semiconductor device and fabrication method of the semiconductor device

SEMICONDUCTOR MODULE

HBI DIE FIDUCIAL ARCHITECTURE WITH CANTILEVER FIDUCIALS FOR SMALLER DIE SIZE AND BETTER YIELDS

SIC MOSFET SEMICONDUCTOR PACKAGES AND RELATED METHODS

Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

High current packages with reduced solder layer count

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of manufacture for a cascode semiconductor device

Semiconductor device having a metal clip with a solder volume balancing reservoir

Semiconductor device with reduced thermal resistance for improved heat dissipation

Package including multiple semiconductor devices

Semiconductor package with wettable flank and related methods

Semiconductor package with wettable flank

SEMICONDUCTOR DEVICES AND PROCESSES

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE

CONDUCTIVE METAL FRAME FOR A POWER ELECTRONIC MODULE AND ASSOCIATED MANUFACTURING PROCESS

Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production

Process for thin film capacitor integration

Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

Method of forming a semiconductor package with connection lug

Split tie bar for clip stability

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and semiconductor module using same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Double-sided coolable semiconductor package

Semiconductor device and production method for semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor package with plurality of leads and sealing resin

Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact

ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM

Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor device

Semiconductor device

PACKAGED POWER SEMICONDUCTOR DEVICE

Metal clip with solder volume balancing reservoir

SEMICONDUCTOR MODULE

Semiconductor packages with vertical passive components

Semiconductor package with wettable flank

Dual cool power module with stress buffer layer

Leadframe package with adjustable clip

Semiconductor device

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof

POWER MODULE

Semiconductor package

Semiconductor apparatus mounted electrically connected to a plurality of external terminals by a lead

Three level interconnect clip

Stacked transistor chip package with source coupling

Semiconductor device having a metallization structure

Sense MOSFET electrically connected to a source pad via a plurality of source extraction ports

Plurality of lead frames for cooling a power device

Semiconductor package structures and methods of manufacture

Plurality of leads between MOSFET chips

Semiconductor power module

Semiconductor device

Semiconductor device

Multi-layer interconnection ribbon

Semiconductor device having second connector that overlaps a part of first connector

Semiconductor device and fabrication method of the semiconductor device

FLIP-STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Spacer frame for semiconductor packages

Semiconductor module

Leadframe spacer for double-sided power module

Integrated circuit package electronic device

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

Wiring structure having stacked first and second electrodes

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Cascode semiconductor

Source electrode and connector lead with notched portions for a semiconductor package

Pressurizing members for semiconductor package

Semiconductor device

Semiconductor device

Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member

Power module including lead frame unit connecting first substrate and second substrate

Semiconductor package with heat radiation board

Semiconductor device and method of manufacturing the same

Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Semiconductor package with a plurality of chips having a groove in the encapsulation

Power module package and packaging techniques

Semiconductor module

Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

Semiconductor module and semiconductor device container

Package including multiple semiconductor devices

Double side heat dissipation for silicon chip package

Semiconductor device package assemblies with direct leadframe attachment

Semiconductor device

Double sided semiconductor package

Semiconductor device

Clips for semiconductor package and related methods

Semiconductor device

Microelectronic device with floating pads

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR AND METHOD OF MAKING THE SAME

Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field

Method of manufacturing a semiconductor device

Multi-chip package

Integrated circuit chip with a vertical connector

Semiconductor device

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED CONDUCTIVE CONNECTIVE ASSEMBLY AND STRUCTURE

Lead frame assembly for a semiconductor device

Semiconductor device assemblies

Semiconductor device having second connector that overlaps a part of first connector

Wiring member and semiconductor module including same

Semiconductor device

Semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame

Semiconductor package with multi-level conductive clip for top side cooling

Semiconductor device and fabrication method of the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor package with integrated passive electrical component

Electronic module with a groove and press hole on the surface of a conductor

Semiconductor device and power converter

Plurality of transistor packages with exposed source and drain contacts mounted on a carrier

Semiconductor devices and methods of making the same

Semiconductor power device with corresponding package and related manufacturing process

Semiconductor package device and method of manufacturing the same

Electronic module, method of manufacturing connector, and method of manufacturing electronic module

Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture

Semiconductor device

Surface mount semiconductor device with a plurality of lead frames

High current packages with reduced solder layer count

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Electronic module with press hole to expose surface of a conductor

Microelectronic device with floating pads

Semiconductor module and semiconductor device container

Power module and motor drive circuit

Electronic module

Electronic module

SEMICONDUCTOR MODULE

Semiconductor device and method for producing semiconductor device

Electro-optical device and electronic apparatus

Semiconductor die package including a one-body clip

Shrinkable package assembly

Die attach surface copper layer with protective layer for microelectronic devices

Thin profile power semiconductor device package having face-to-face mounted dice and no internal bond wires

Stack frame for electrical connections and the method to fabricate thereof

Integrated trench capacitor formed in an epitaxial layer

Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and method of manufacturing a semiconductor device

Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact

SiC MOSFET semiconductor packages and related methods

Integrated electronic device having a dissipative package, in particular dual side cooling package

Semiconductor device and method of manufacturing the same

Packaged device having selective lead pullback for dimple depth control

Semiconductor device

Semiconductor package having overlapping electrically conductive regions and method for producing the same

Semiconductor package having symmetrically arranged power terminals and method for producing the same

Integrated circuit package electronic device including pillar contacts and electrical terminations

Electronic device and connection body

Semiconductor package structures and methods of manufacture

Semiconductor module

Semiconductor device with integrated shunt resistor

Multi-stacked die package with flexible interconnect

Semiconductor device comprising a composite material clip

Electronic device

High performance multi-component electronics power module

Semiconductor power device with corresponding package and related manufacturing process

Low-cost semiconductor package using conductive metal structure

Power module and manufacturing method thereof

Package including multiple semiconductor devices

Semiconductor component and method of manufacture

Cascode semiconductor package and related methods

Semiconductor device

Semiconductor device

Direct selective adhesion promotor plating

Semiconductor device

Method of manufacturing a semiconductor device

Integrated circuit package with conductive clips

Method of manufacturing a semiconductor device

Method of manufacturing a package having a power semiconductor chip

Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires

Electronic device

Semiconductor package

Integrated circuit connection arrangement for minimizing crosstalk

Semiconductor device

Semiconductor package with integrated passive electrical component

Clip for semiconductor package

Semiconductor device and method for producing semiconductor device

Semiconductor package

Semiconductor device

Semiconductor memory device

Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad

Method of manufacturing power semiconductor module including a power semiconductor chip and a control chip formed according to different process rules, and power semiconductor module

Package including multiple semiconductor devices

Power semiconductor device

Semiconductor device and method of manufacture

Semiconductor package having inspection structure and related methods

Semiconductor leadframes and packages with solder dams and related methods

Semiconductor device with a bridge insulation layer

Lead structure of circuit with increased gaps between adjacent leads

Multi-chip module including stacked power devices with metal clip

Semiconductor device

Conductive clip connection arrangements for semiconductor packages

Semiconductor package with a heat spreader and method of manufacturing thereof

Semiconductor device

Semiconductor package device and method of manufacturing the same

Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact

Semiconductor device and fabrication method of the semiconductor device

Manufacturing method for semiconductor device and semiconductor device

Solid top terminal for discrete power devices

Power semiconductor device including a spacer

Multi-phase power converter with common connections

Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure

Semiconductor component and method of manufacture

Semiconductor package with leadframe

Semiconductor package and a method for manufacturing a semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package

Die package component with jumper structure and manufacturing method thereof

Die package component with jumper structure

ELECTRONIC DEVICE

Semiconductor device and method of manufacturing the same

SMD package with flat contacts to prevent bottleneck

Power apparatus

Semiconductor device and lead frame