207682 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads; Additional leads the additional leads being a tape carrier or flat leads
Semiconductor device having corrugated leads and method for forming
#302Semiconductor device
#303Semiconductor device
#304Semiconductor device
#305Semiconductor device and manufacturing method thereof
#306Integrated circuit connection arrangement for minimizing crosstalk
#307Connection arrangements for integrated lateral diffusion field effect transistors
#308Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package
#309Leadframe and integrated circuit connection arrangement
#310Semiconductor chip package having heat dissipating structure
#311Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
#312Semiconductor device
#313Semiconductor package device
#314Stack frame for electrical connections and the method to fabricate thereof
#315Electro-optical device having flexible wiring substrate, and electronic apparatus
#316Semiconductor device
#317Semiconductor device
#318Interdigit device on leadframe for evenly distributed current flow
#319SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#320Clip and related methods
#321Conductive clip connection arrangements for semiconductor packages
#322Multi-die integrated circuit device with capacitive overvoltage protection
#323Method of manufacturing semiconductor products, corresponding semiconductor product and device
#324Rectifier package module for vehicle and connection status detection method for temperature sensor thereof
#325Semiconductor device and method with clip arrangement in IC package
#326Method for die and clip attachment
#327Semiconductor device
#328FLIP-CHIP PACKAGING DIODE WITH A MULTICHIP STRUCTURE
#329Integrated circuit package for assembling various dice in a single IC package
#330Leadframe and method of manufacturing the same
#331POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS
#332Cascode semiconductor package and related methods
#333Method of manufacturing a semiconductor power package
#334Single or multi chip module package and related methods
#335Package structures
#336Lead and lead frame for power package
#337Molded resin-sealed power semiconductor device
#338Semiconductor device
#339Semiconductor module
#340SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#341Leadframe
#342Multi-die integrated circuit device with capacitive overvoltage protection
#343Semiconductor chip package having a repeating footprint pattern
#344Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#345Semiconductor device
#346Method of manufacturing a semiconductor device
#347Electronic device
#348Semiconductor chip package having heat dissipating structure
#349Power module and motor drive circuit
#350Electronic device including a HEMT
#351Method and apparatus for making integrated circuit packages
#352Semiconductor component and method of manufacture
#353Semiconductor device
#354Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#355Semiconductor device fabricated by flux-free soldering
#356Semiconductor device
#357Bonding structure and method
#358Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#359Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#360Signal block and double-faced cooling power module using the same
#361Leadframe with vertically spaced die attach pads
#362Semiconductor device
#363Package with vertical interconnect between carrier and clip
#364Stack frame for electrical connections and the method to fabricate thereof
#365Leadframe for a semiconductor component
#366Electronic part mounting heat-dissipating substrate
#367Electronic part mounting heat-dissipating substrate
#368Semiconductor device and corresponding method
#369Semiconductor device
#370Semiconductor package having a source-down configured transistor die and a drain-down configured transistor die
#371Power semiconductor device
#372Method for manufacturing semiconductor device
#373Dual lead frame semiconductor package and method of manufacture
#374Semiconductor device and semiconductor device mounting structure having conductor plates
#375Direct selective adhesion promotor plating
#376EMI/RFI shielding for semiconductor device packages
#377Semiconductor package and a method for manufacturing a semiconductor device
#378Package structure
#379Semiconductor device including a clip
#380Semiconductor module and semiconductor driving device
#381Semiconductor package with plurality of leads and sealing resin
#382Integrated clip and lead and method of making a circuit
#383Integrated circuit chip with a vertical connector
#384Power semiconductor device with small contact footprint and the preparation method
#385Perforated conductive material for EMI shielding of semiconductor device and components
#386Semiconductor devices with improved thermal and electrical performance
#387Wiring circuit board and method of manufacturing the same
#388Semiconductor device
#389Electronic packages for flip chip devices
#390Method for fabricating stack die package
#391Semiconductor package including a device and lead frame used for the same
#392Semiconductor device, corresponding methods of production and use and corresponding apparatus
#393Leadframe and semiconductor device
#394Metal pad for laser marking
#395Semiconductor device
#396Clip and related methods
#397Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#398Single or multi chip module package and related methods
#399Semiconductor device and manufacturing method thereof
#400Package structure
#401Direct selective adhesion promotor plating
#402Semiconductor device having terminals directly attachable to circuit board
#403Cascode semiconductor package and related methods
#404Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#405Semiconductor devices and methods of making the same
#406Stack frame for electrical connections and the method to fabricate thereof
#407STRUCTURES AND METHODS FOR SEMICONDUCTOR PACKAGING
#408Semiconductor leadframes and packages with solder dams and related methods
#409Semiconductor component and method of manufacture
#410Semiconductor component and method of manufacture
#411Semiconductor component and method of manufacture
#412Semiconductor component and method of manufacture
#413Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame
#414Semiconductor component and method of manufacture
#415Semiconductor component and method of manufacture
#416Semiconductor component and method of manufacture
#417Semiconductor module
#418Semiconductor device
#419Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#420LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME
#421Semiconductor package with embedded output inductor
#422Diffusion solder bonding using solder preforms
#423Semiconductor power package and method of manufacturing the same
#424Semiconductor device
#425Semiconductor module and drive device equipped with semiconductor module
#426Semiconductor package with clip structure
#427Half-bridge HEMT circuit and an electronic package including the circuit
#428Bidirectional HEMT and an electronic package including the bidirectional HEMT
#429Electronic device including a bidirectional HEMT
#430Semiconductor device and power converter using the same
#431Semiconductor device
#432Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#433Semiconductor module with conductive pin
#434Electronic components with integral lead frame and wires
#435Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding
#436Combined packaged power semiconductor device
#437Packaging solutions for devices and systems comprising lateral GaN power transistors
#438Vehicle power module assemblies
#439Plated terminals with routing interconnections semiconductor device
#440Plated terminals with routing interconnections semiconductor device
#441Plated terminals with routing interconnections semiconductor device
#442Manufacturing method of chip package structure
#443Semiconductor devices including control and load leads of opposite directions
#444Semiconductor device including conductive clip with flexible leads and related methods
#445Method for manufacturing semiconductor device
#446Thin semiconductor device packages
#447Semiconductor package for a lateral device and related methods
#448Packaging solutions for devices and systems comprising lateral GaN power transistors
#449Packaging solutions for devices and systems comprising lateral GaN power transistors
#450Stacked half-bridge package
#451Method of manufacturing semiconductor package and semiconductor package
#452Electronic packages for flip chip devices
#453Semiconductor package with multi-section conductive carrier
#454DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#455Manufacturing method of semiconductor device and semiconductor device
#456Method of producing a semiconductor package
#457EMI/RFI shielding for semiconductor device packages
#458Power semiconductor package having reduced form factor and increased current carrying capability
#459Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
#460SYSTEM, APPARATUS, AND METHOD FOR SEMICONDUCTOR PACKAGE GROUNDS
#461Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#462Semiconductor module
#463Semiconductor device and manufacturing method thereof
#464Semiconductor device
#465Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#466SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#467Semiconductor package
#468Semiconductor device with a plate-shaped lead terminal
#469Compact multi-die power semiconductor package
#470Compact single-die power semiconductor package
#471Methods of fabricating tape film packages
#472Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#473Embedded package and method thereof
#474Semiconductor packages and modules with integrated ferrite material
#475Single or multi chip module package and related methods
#476Power device having reduced thickness
#477Integrating multi-output power converters having vertically stacked semiconductor chips
#478Integrating multi-output power converters having vertically stacked semiconductor chips
#479ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK, AND METHOD OF MANUFACTURING ELECTRONIC MODULE USING ORGANIC SOLDERABILITY PRESERVATIVE AND OXIDE SURFACE FINISH PROCESSES
#480Semiconductor package for a lateral device and related methods
#481Power converter package using driver IC
#482Dual power converter package
#483Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#484Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#485Semiconductor device
#486Semiconductor device having low on resistance
#487Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#488Thin film RDL for nanochip package
#489Power module semiconductor device
#490Power semiconductor device with small contact footprint and the preparation method
#491Combined packaged power semiconductor device
#492Metal pad for laser marking
#493Semiconductor device
#494Power semiconductor package with multi-section conductive carrier
#495Connectable package extender for semiconductor device package
#496Stack frame for electrical connections and the method to fabricate thereof
#497Molded chip package and method of manufacturing the same
#498Gang clips having distributed-function tie bars
#499Semiconductor device with notched main lead
#500Semiconductor device with step portion having shear surfaces
#501Devices and systems comprising drivers for power conversion circuits
#502DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#503Semiconductor package with switch node integrated heat spreader
#504Semiconductor device and production method for same
#505Module comprising a semiconductor chip
#506Method of manufacturing resin-encapsulated semiconductor device, and lead frame
#507Conductive pads and methods of formation thereof
#508Chip package structure and manufacturing method thereof
#509Lead for connection to a semiconductor device
#510Protection devices
#511Power semiconductor package with a common conductive clip
#512Chip package and method for manufacturing the same
#513Semiconductor module package and method of manufacturing the same
#514Semiconductor module
#515Semiconductor device having semiconductor chip mounted on lead frame
#516High power electronic component with multiple leadframes
#517SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#518Exposed die power semiconductor device
#519Semiconductor package with sidewall contacting bonding tape
#520High reliability semiconductor package structure
#521Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#522Power semiconductor module
#523Semiconductor device having multiple contact clips
#524Semiconductor device
#525Reduced-noise reference voltage platform for a voltage converter device
#526Semiconductor device with webbing between leads
#527Method Of Manufacturing Semiconductor Device And The Semiconductor Device
#528Semiconductor apparatus
#529Semiconductor package with conductive clips
#530Semiconductor package including a connecting member
#531Port spreading
#532Method of making stacked multi-chip packaging structure
#533Three-dimensional package structure and the method to fabricate thereof
#534Array based fabrication of power semiconductor package with integrated heat spreader
#535Power semiconductor package with integrated heat spreader and partially etched conductive carrier
#536Semiconductor device and semiconductor device mounting structure
#537Electronic device with first and second contact pads and related methods
#538Electronic component
#539Electronic component with electronic chip between redistribution structure and mounting structure
#540Leadless surface mount assembly package and method of manufacturing the same
#541Semiconductor package and method for producing the same
#542Semiconductor module and method for manufacturing the same
#543Semiconductor device package
#544Quad flat no lead package and production method thereof
#545Semiconductor device and method for manufacturing the same
#546Transistor arrangement with semiconductor chips between two substrates
#547Semiconductor device
#548Semiconductor device and method of manufacturing the same
#549Multichip power semiconductor device
#550Power semiconductor package with gate and field electrode leads
#551Electronic device
#552Encapsulated semiconductor device
#553Substrateless power device packages
#554Multichip device including a substrate
#555Semiconductor device and method for manufacturing the same
#556Bond pad stack for transistors
#557Power semiconductor module and power module
#558Semiconductor package
#559Semiconductor component having a lateral semiconductor device and a vertical semiconductor device
#560Power semiconductor package with non-contiguous, multi-section conductive carrier
#561Semiconductor device
#562Dual lead frame semiconductor package and method of manufacture
#563Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
#564Packaged semiconductor device having an embedded system
#565Electronic device and manufacturing method of electronic device
#566Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip
#567Bonding structure and method
#568Dual lead frame semiconductor package and method of manufacture
#569Semiconductor device including DC-DC converter
#570Semiconductor device
#571III-nitride rectifier package
#572Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#573Molding material and method for packaging semiconductor chips
#574Lead and lead frame for power package
#575Semiconductor power device having a heat sink
#576Integrating multi-output power converters having vertically stacked semiconductor chips
#577Method for making contact with a semiconductor and contact arrangement for a semiconductor
#578Multi-level semiconductor package
#579Semiconductor device and method of manufacturing the same
#580Method for fabricating stack die package
#581Semiconductor chip package
#582Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#583Power transistor arrangement and package having the same
#584Half-bridge package with a conductive clip
#585Stacked half-bridge package
#586Stacked power semiconductor device using dual lead frame
#587Semiconductor package with multiple conductive clips
#588Devices and systems for power conversion circuits
#589Power module
#590Semiconductor device carrier and semiconductor package using the same
#591Method for top-side cooled semiconductor package with stacked interconnection plates
#592Axial semiconductor package
#593Semiconductor device and method of manufacturing the same
#594Semiconductor packages and methods of formation thereof
#595Power module and method of manufacturing the power module
#596Semiconductor device having sensing functionality
#597Dual-leadframe multi-chip package
#598Semiconductor device with step portion having shear surfaces
#599Power semiconductor housing with redundant functionality
#600Semiconductor device and method of manufacturing same