207691 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads; Geometry of the lead-frame Insulating layers on lead frames, e.g. bridging members
METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DEVICE WITH A DIELECTRIC SPACER AND METHOD OF MANUFACTURING
#3ELECTRONIC COMPONENT BRACKET, MANUFACTURING PROCESS THEREOF, AND ENCAPSULATED PRODUCT
#4SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#5SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#6INTEGRATED CIRCUIT PACKAGING WITH INSULATION STRUCTURE TO CONTROL GAP HEIGHT AND DIE TILT
#7SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR DEVICE
#9SEMICONDUCTOR MODULE
#10SEMICONDUCTOR DEVICES INCLUDING ROUNDED COMPONENTS AND RELATED MANUFACTURING METHODS
#11METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE
#12FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE
#13ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MOLD FLASH AND METHODS FOR REDUCING ADHESION OF MOLD FLASH TO METAL LEADFRAMES
#14CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
#15LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#16MULTI-CHIP MODULE LEADLESS PACKAGE
#17SEMICONDUCTOR MODULE
#18METHOD FOR PRODUCING A PACKAGE FOR A SEMICONDUCTOR CHIP, PACKAGE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#19SEMICONDUCTOR MODULE
#20SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
#21Power Electronics Assembly
#22SEMICONDUCTOR DEVICE
#23LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND ASSEMBLY USING THE SAME
#24HYBRID QUAD FLAT NO-LEADS (QFN) INTEGRATED CIRCUIT PACKAGE
#25SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
#26SEMICONDUCTOR DEVICE
#27POWER SEMICONDUCTOR MODULE AND DISCRETE POWER SEMICONDUCTOR DEVICE HAVING AN ACTIVE TEMPERATURE SENSOR DIE, AND CORRESPONDING METHODS OF PRODUCTION
#28Semiconductor Package with Insert
#29SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#30SEMICONDUCTOR EQUIPMENT
#31PACKAGE FOR POWER ELECTRONICS
#32SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#33Charging Base Lead Frame, Charging Base Lead Frame Assembly and Charging Base
#34SEMICONDUCTOR DEVICE
#35SEMICONDUCTOR MODULE
#36ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
#37SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#38SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD
#39SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL
#40Package substrate having integrated passive device(s) between leads
#41Semiconductor device including a bidirectional switch
#42Lead frame assembly having a plurality of dicing holes
#43Coated semiconductor devices
#44SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#45Multi-chip module leadless package
#46Semiconductor package having routable encapsulated conductive substrate and method
#47INTEGRATION OF GLASS CORE INTO ELECTRONIC SUBSTRATES FOR FINE PITCH DIE TILING
#48METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR DEVICE AND ASSORTMENT OF SEMICONDUCTOR DEVICES
#49METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE
#50METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE
#51SEMICONDUCTOR DEVICE
#52SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
#53Method of manufacturing semiconductor devices and corresponding semiconductor device
#54LEAD FRAME, AND SEMICONDUCTOR DEVICE
#55Microelectronics package assemblies and processes for making
#56Semiconductor module and semiconductor apparatus
#57Isolated temperature sensor device package
#58Semiconductor device
#59SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#60Semiconductor device and method for manufacture of semiconductor device
#61Stem for semiconductor package
#62CURRENT SENSOR
#63Package comprising inter-substrate gradient interconnect structure
#64Semiconductor package structure including an encapsulant having a cavity exposing an interposer
#65Leadframe package with isolation layer
#66Semiconductor device
#67Package for power electronics
#68Semiconductor device including a bidirectional switch
#69Semiconductor package structure having a lead frame and a passive component
#70Semiconductor devices and methods of manufacturing semiconductor devices
#71Leadframes in semiconductor devices
#72Coated semiconductor devices
#73Multi-die-package and method
#74Wiring structure having stacked first and second electrodes
#75Package substrate having integrated passive device(s) between leads
#76Package for power electronics
#77Multi-chip module leadless package
#78Pre-molded leadframes in semiconductor devices
#79RELIABLE SEMICONDUCTOR PACKAGES
#80Substrate having a plurality of slit portions between semiconductor devices
#81Lead frame and method for manufacturing the same
#82Semiconductor die, semiconductor wafer, semiconductor device including the semiconductor die and method of manufacturing the semiconductor device
#83Double-sided cooled molded semiconductor package
#84Molded semiconductor package with double-sided cooling
#85Device with chemical reaction chamber
#86Isolated component design
#87Package for power electronics
#88HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS
#89Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement
#90Semiconductor module and power converter
#91Semiconductor package having routable encapsulated conductive substrate and method
#92Three-dimensional package structure
#93Semiconductor device and power converter
#94Stack frame for electrical connections and the method to fabricate thereof
#95Semiconductor device and method of manufacturing the same
#96Thermal capacity control for relative temperature-based thermal shutdown
#97Leads for leadframe and semiconductor package
#98Lead frame array for carrying chips and LED package structure with multiple chips
#993-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
#100Semiconductor device
#101HV converter with reduced EMI
#102Spot-solderable leads for semiconductor device packages
#103HV converter with reduced EMI
#104Semiconductor device, inverter unit and automobile
#105Lead frame with bendable leads
#106Semiconductor device package
#107Current sensor isolation
#108Semiconductor module and semiconductor device
#109Semiconductor systems having dual leadframes
#110Pre-molded leadframe device
#111Multi-die-package and method
#112Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bonding
#113Semiconductor device package
#114Semiconductor package substrate and manufacturing method therefor
#115Semiconductor device with a bridge insulation layer
#116Shaped interconnect bumps in semiconductor devices
#117Pre-molded leadframes in semiconductor devices
#118Molded air cavity packages and methods for the production thereof
#119Leadframes in semiconductor devices
#120Power module for vehicle
#121Tapeless leadframe package with underside resin and solder contact
#122Substrate with multi-layer resin structure and semiconductor device including the substrate
#123Method of assembling QFP type semiconductor device
#124Power module and power conversion system including same
#125Molded air cavity packages and methods for the production thereof
#126Semiconductor device with first and second transistors and support part
#127Molded air cavity packages and methods for the production thereof
#128Molded air cavity packages and methods for the production thereof
#129Package with component connected at carrier level
#130Packaged integrated circuit device and methods
#131Semiconductor package having routable encapsulated conductive substrate and method
#132Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
#133Stack frame for electrical connections and the method to fabricate thereof
#134SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#135Method of manufacturing semiconductor products, corresponding semiconductor product and device
#136Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
#137ELECTRONIC DEVICE
#138Semiconductor device including a bidirectional switch
#139Semiconductor device having a plurality of top surface connection terminals
#140Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#141PLATED DITCH PRE-MOLD LEAD FRAME, SEMICONDUCTOR PACKAGE, AND METHOD OF MAKING SAME
#142Molded lead frame device
#143Tapeless leadframe package with underside resin and solder contact
#144Chip carrier configured for delamination-free encapsulation and stable sintering
#145Leadframe having organic, polymerizable photo-imageable adhesion layer
#146Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer
#147Semiconductor module
#148Method of manufacturing semiconductor device
#149Lead frame and electronic component device
#150Spot-solderable leads for semiconductor device packages
#151Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#152Method of manufacturing semiconductor device
#153SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#154Semiconductor device and method of manufacturing the same
#155Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#156Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#157Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#158Signal block and double-faced cooling power module using the same
#159Stack frame for electrical connections and the method to fabricate thereof
#160Leadframe for a semiconductor component
#161Electronic part mounting heat-dissipating substrate
#162Lead frame surface modifications for high voltage isolation
#163Leads frames with crossing leads
#164Power semiconductor device and method for manufacturing the same
#165Package structure
#166SEMICONDUCTOR DEVICE
#167Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device
#168LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE
#169Semiconductor devices with improved thermal and electrical performance
#170Wiring circuit board and method of manufacturing the same
#171Three-dimensional package structure
#172Semiconductor device and leadframe
#173Semiconductor systems having premolded dual leadframes
#174Power module and fabrication method for the same
#175SEMICONDUCTOR PACKAGE STRUCTURE
#176Semiconductor package having routable encapsulated conductive substrate and method
#177Semiconductor device
#178REDUCING LEAD STRESS IN MICRO-ELECTRONIC PACKAGES
#179Stack frame for electrical connections and the method to fabricate thereof
#180Semiconductor component and method of manufacture
#181Semiconductor component and method of manufacture
#182Devices and methods related to high power diode switches with low DC power consumption
#183Electronic component package including electronic component, metal member, and sealing resin
#184Semiconductor module and drive device equipped with semiconductor module
#185SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#186SEMICONDUCTOR DEVICE
#187Method for fabricating an advanced routable quad flat no-lead package
#188Method of fabricating a lead frame by additive process
#189Combined packaged power semiconductor device
#190Semiconductor package with conductive clip
#191Current sensor isolation
#192MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS
#193Integrated circuit package and method of making the same
#194Semiconductor package with multi-section conductive carrier
#195Package structure
#196Semiconductor device
#197Semiconductor pressure sensor
#198Semiconductor package with die paddle
#199Semiconductor device and its manufacturing method
#200Wiring substrate, method of manufacturing the same and electronic component device
#201FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-IN-PACKAGE STRUCTURE AND PROCESSING METHOD THEREFOR
#202Fan-out wafer level chip package structure and manufacturing method thereof
#203Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof
#204SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#205Package assembly and method for manufacturing the same
#206Electronic devices with semiconductor die coupled to a thermally conductive substrate
#207Semiconductor packages and modules with integrated ferrite material
#208NON-INSULATED POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#209Resin composition, resin sheet, and production method for semiconductor device
#210Chip package and chip assembly
#211Semiconductor device
#212Chip having a pillar electrode offset from the bonding pad
#213Heat sink in the aperture of substrate
#214Semiconductor device and method for producing same
#215Power semiconductor package with multi-section conductive carrier
#216Stack frame for electrical connections and the method to fabricate thereof
#217Semiconductor package
#218SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#219Method and apparatus for mounting solder balls to an exposed pad or terminal of a semiconductor package
#220Method for manufacturing semiconductor device
#221Semiconductor package with lead mounted power bar
#222Semiconductor package with conductive clip
#223Power semiconductor package with conductive clip and related method
#224Heat radiation structure for semiconductor device
#225Encapsulated semiconductor device and method for manufacturing the same
#226Integrated circuit package
#227Semiconductor device package and method of manufacture
#228Semiconductor device with combined power and ground ring structure
#229Printed circuit board and stacked semiconductor device
#230Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes
#231Semiconductor device
#232Lead frame strips with electrical isolation of die paddles
#233Chip carrier structure, chip package and method of manufacturing the same
#234Semiconductor package with cantilever leads
#235Lead frame and a method of fabrication thereof
#236Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
#237Semiconductor die package and method for making the same
#238Semiconductor memory card
#239Semiconductor device with embedded interconnect pad
#240SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern
#241Semiconductor device package and method of manufacture
#242Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe
#243Lead frame for assembling semiconductor device
#244Integrated circuit packaging system with pad and method of manufacture thereof
#245Encapsulated semiconductor device and method for manufacturing the same
#246Chip package structure and manufacturing method thereof
#247MULTI-CHIP PACKAGE HAVING LEADERFRAME-TYPE CONTACT FINGERS
#248Three-dimensional package structure
#249Stack frame for electrical connections and the method to fabricate thereof
#250Semiconductor memory card
#251Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof
#252Semiconductor device and method of manufacturing same
#253SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#254Semiconductor package with cantilever leads
#255Semiconductor device including one or more stiffening elements
#256Semiconductor die package and method for making the same
#257Semiconductor packages having lead frames
#258Method for manufacturing semiconductor device
#259Semiconductor device packages with protective layer and related methods
#260Power semiconductor package
#261Lead frame for semiconductor device
#262Semiconductor storage device and a method of manufacturing the semiconductor storage device
#263LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#264Semiconductor device
#265HOUSING FOR AN ELECTRICAL CIRCUIT
#266METHOD OF PACKAGING SEMICONDUCTOR DEVICE
#267Methods and devices for manufacturing cantilever leads in a semiconductor package
#268Semiconductor device and manufacturing method of the same
#269Multi-Connect Lead
#270Semiconductor device with embedded interconnect pad
#271Semiconductor element for package miniaturization
#272Semiconductor die package and method for making the same
#273Lead frame
#274Lead frame
#275Lead frames with improved adhesion to plastic encapsulant
#276Semiconductor device
#277Interconnection of lead frame to die utilizing flip chip process
#278Chip package and manufacturing method thereof
#279Semiconductor package having isolated inner lead
#280Method for forming an isolated inner lead from a leadframe
#281Low stress cavity package
#282Method of manufacturing semiconductor element
#283Interconnection of lead frame to die utilizing flip chip process
#284Method of making and designing lead frames for semiconductor packages
#285COL SEMICONDUCTOR PACKAGE
#286Integrated circuit package system with isloated leads
#287CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#288LEADFRAME FOR LEADLESS PACKAGE
#289Electrically enhanced wirebond package
#290Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof
#291Method of forming premolded lead frame
#292Air cavity package for flip-chip
#293Manufacturing process for a quad flat non-leaded chip package structure
#294Manufacturing process for a quad flat non-leaded chip package structure
#295Manufacturing process for a Quad Flat Non-leaded chip package structure
#296Semiconductor device and manufacturing method of the same
#297Stackable microelectronic device carriers, stacked device carriers and methods of making the same
#298Semiconductor device
#299Quad flat non-leaded chip package
#300Semiconductor packages including thermal stress buffers and methods of manufacturing the same