207691 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads; Geometry of the lead-frame Insulating layers on lead frames, e.g. bridging members
LEAD FRAME AND A METHOD OF MANUFACTURING THE SAME
#302SEMICONDUCTOR DEVICE
#303LEAD FRAME FOR SEMICONDUCTOR DEVICE
#304Semiconductor device
#305Integrated circuit package system with lead support
#306Resin molded semiconductor device and differential amplifier circuit
#307Manufacturing method of semiconductor device and manufacturing method of lead frame
#308Die package with asymmetric leadframe connection
#309PRE-MOLDED LEAD FRAME AND PROCESS FOR MANUFACTURING THE SAME
#310Lead Frame
#311Semiconductor package for fine pitch miniaturization and manufacturing method thereof
#312Lead frame
#313Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
#314Integrated circuit package system for chip on lead
#315STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#316Process of fabricating a semiconductor package
#317SEMICONDUCTOR-INTEGRATED ELECTRONIC DEVICE HAVING A PLURALITY OF LEADS
#318Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
#319Multiple row exposed leads for MLP high density packages
#320Leadframe IC packages having top and bottom integrated heat spreaders
#321Semiconductor package
#322Integrated circuit package system with integrated circuit support
#323Ultrathin leadframe BGA circuit package
#324METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
#325Packaging for high speed integrated circuits
#326Circuit device and method of manufacturing the same
#327Method and apparatus for decoupling conductive portions of a microelectronic device package
#328Packaging for high speed integrated circuits
#329Packaging for high speed integrated circuits
#330Packaging for high speed integrated circuits
#331Packaging for high speed integrated circuits
#332Packaging for high speed integrated circuits
#333Packaging for high speed integrated circuits
#334Semiconductor device manufacturing method
#335Semiconductor die package and method for making the same
#336Die package with asymmetric leadframe connection
#337Lead frame and method of manufacturing the lead frame
#338Molded stiffener for thin substrates
#339Flashless molding of integrated circuit devices
#340Semiconductor device
#341Semiconductor device and method of manufacturing the same
#342Semiconductor package
#343Leadframe semiconductor package stand and method for making the same
#344Semiconductor device and a manufacturing method of the same
#345Data carrier with a module with a reinforcement strip
#346Lead frame having a lead with a non-uniform width
#347Manufacturing method of semiconductor device and manufacturing method of lead frame
#348Leadless semiconductor package and method for manufacturing the same
#349High density chip scale leadframe package and method of manufacturing the package
#350Method and apparatus for decoupling conductive portions of a microelectronic device package
#351Semiconductor device in which semiconductor chip is mounted on lead frame
#352System for reducing or eliminating semiconductor device wire sweep
#353Semiconductor package with a flip chip on a solder-resist leadframe
#354Semiconductor packaging substrate
#355Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
#356Quad flat flip chip packaging process and leadframe therefor
#357System and method for reducing or eliminating semiconductor device wire sweep
#358Molded stiffener for thin substrates
#359Ultrathin leadframe BGA circuit package
#360Packaged microelectronic devices and methods of forming same
#361Isolated component design
#362Package to die connection system and method therefor
#363Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
#364Bridge rectifier circuit component
#365Universal preformed lead frame device
#366Transistor die with drain via arrangement, and methods of manufacture thereof
#367Lead frame structure for light emitting diode
#368Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
#369Lead frame device
#370Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
#371Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#372Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#373Die support for enlarging die size
#374Lead frame
#375Method for fabricating semiconductor package and semiconductor package using the same
#376Integrated circuit packaging system with unplated leadframe and method of manufacture thereof