207699 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon Insulating layers on lead frames
Semiconductor device package having features formed by stamping
#302Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
#303Semiconductor package and methods of fabricating the same
#304Semiconductor package
#305Semiconductor device and method for manufacturing a semiconductor device
#306Electronic device
#307Semiconductor device
#308Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#309Semiconductor package, method for fabricating the same, and semiconductor device
#310Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure
#311Lead structure for a semiconductor component and method for producing the same
#312Leadframe treatment for enhancing adhesion of encapsulant thereto
#313Module with silicon-based layer
#314Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
#315Semiconductor device package
#316Semiconductor device and method for manufacturing a semiconductor device
#317Semiconductor device and method for manufacturing same
#318Electrical components including abrasive powder coatings for inhibiting tin whisker growth
#319Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
#320Integrated circuit device with semiconductor device components embedded in plastic housing composition
#321Semiconductor Housings Having Coupling Coatings
#322Semiconductor device having an adhesion promoting layer and method for producing it
#323Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
#324Layer between interfaces of different components in semiconductor devices
#325Semiconductor device and method for producing it, and use of an electrospinning method
#326Conductor substrate, semiconductor device and production method thereof
#327Method and apparatus for decoupling conductive portions of a microelectronic device package
#328Copper base for electronic component, electronic component, and process for producing copper base for electronic component
#329Conductive contamination reliability solution for assembling substrates
#330Fabricating surface mountable semiconductor components with leadframe strips
#331Leadframe and method for reducing mold compound adhesion problems
#332Semiconductor package, method for fabricating the same, and semiconductor device
#333Method and apparatus for decoupling conductive portions of a microelectronic device package
#334Method for maintaining solder thickness in flipchip attach packaging processes
#335Semiconductor component arrangement with an insulating layer having nanoparticles
#336Quad flat flip chip packaging process and leadframe therefor
#337Semiconductor package capable of absorbing electromagnetic wave
#338Preformed lead frame device
#339Lead frame structure for light emitting diode
#340Sensor package and method of manufacture
#341Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
#342Semiconductor package with multiple molding routing layers and a method of manufacturing the same
#343Lead frame
#344Power device and preparation method thereof
#345Power device and preparation method thereof
#346Method for preventing die pad delamination
#347Leadframe system with warp control mechanism and method of manufacture thereof
#348Integrated circuit packaging system with unplated leadframe and method of manufacture thereof