Patents-Review.com
ClassID:

207699 ⎘

H01L23/49586 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered constructions; Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon Insulating layers on lead frames

Recent Application in this class:
#1
20260053003
2026-02-19

METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE

 #2
20260047447
2026-02-12

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

 #3
20260033347
2026-01-29

SEMICONDUCTOR PACKAGE CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF

 #4
20260026366
2026-01-22

Bi-Layer Nanoparticle Adhesion Film

 #5
20260026365
2026-01-22

PACKAGED LATERAL POWER ELECTRONIC DEVICE AND A METHOD THEREOF

 #6
20260026354
2026-01-22

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE

 #7
20250364381
2025-11-27

INTERCONNECT FOR IC PACKAGE

 #8
20250336778
2025-10-30

IC PACKAGE WITH CONNECTION PADS FOR DIE

 #9
20250293195
2025-09-18

SEMICONDUCTOR DEVICE

 #10
20250285944
2025-09-11

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #11
20250236955
2025-07-24

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

 #12
20250210476
2025-06-26

SEMICONDUCTOR MODULE

 #13
20250192090
2025-06-12

SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES

 #14
20250183130
2025-06-05

Multi-Layered Metal Frame Power Package

 #15
20250122413
2025-04-17

Multifunctional Adhesion Promoter for Semiconductor Device Packages

 #16
20250105110
2025-03-27

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

 #17
20250105107
2025-03-27

ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MOLD FLASH AND METHODS FOR REDUCING ADHESION OF MOLD FLASH TO METAL LEADFRAMES

 #18
20250105102
2025-03-27

POWER SEMICONDUCTOR DEVICE HAVING A SOLDER BLEED OUT PREVENTION LAYER AND METHOD FOR FABRICATING THE SAME

 #19
20250105079
2025-03-27

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME

 #20
20250079269
2025-03-06

POWER MODULE

 #21
20250070000
2025-02-27

LEAD FRAME FOR A PACKAGE FOR A SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE

 #22
20250029904
2025-01-23

SEMICONDUCTOR FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

 #23
20240429137
2024-12-26

DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR

 #24
20240404902
2024-12-05

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD

 #25
20240387305
2024-11-21

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TRENCHES AND METHOD FOR FABRICATING THE SAME

 #26
20240371733
2024-11-07

LEAD FRAME

 #27
20240363499
2024-10-31

LEAD FRAME SUBSTRATE HAVING CIRCUITRY ON DUAL DIELECTRIC LAYERS AND ASSEMBLY USING THE SAME

 #28
20240319234
2024-09-26

INTEGRATED CURRENT SENSOR WITH MAGNETIC FLUX CONCENTRATORS

 #29
20240234331
2024-07-11

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #30
20240178109
2024-05-30

Semiconductor Package with Insert

 #31
20240170454
2024-05-23

SEMICONDUCTOR DEVICE

 #32
20240170374
2024-05-23

Semiconductor Package with Current Sensing

 #33
20240136302
2024-04-25

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #34
20240120250
2024-04-11

Semiconductor Device

 #35
20240096766
2024-03-21

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

 #36
20240021582
2024-01-18

HIGH CONNECTIVITY DEVICE STACKING

 #37
20240014104
2024-01-11

Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor

 #38
20230402364
2023-12-14

LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

 #39
20230402356
2023-12-14

INTERDIGITAL CAPACITOR

 #40
20230360988
2023-11-09

POTTED ELECTRONIC CIRCUIT

 #41
20230298979
2023-09-21

ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE

 #42
20230272536
2023-08-31

Chemically anchored mold compounds in semiconductor packages

 #43
20230268253
2023-08-24

Packaged electronic device with film isolated power stack

 #44
20230170285
2023-06-01

INTERCONNECT FOR IC PACKAGE

 #45
20230163050
2023-05-25

Coated semiconductor devices

 #46
20230163049
2023-05-25

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

 #47
20230163037
2023-05-25

Semiconductor device and method of manufacturing the same

 #48
20230131821
2023-04-27

HEAT DISSIPATION STRUCTURE AND HIGH THERMAL CONDUCTION ELEMENT

 #49
20230090848
2023-03-23

Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor device

 #50
20230083412
2023-03-16

Semiconductor package having routable encapsulated conductive substrate and method

 #51
20230031356
2023-02-02

METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE

 #52
20230028808
2023-01-26

SEMICONDUCTOR DEVICE

 #53
20230012200
2023-01-12

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

 #54
20230010770
2023-01-12

High performance semiconductor device

 #55
20220392830
2022-12-08

Method of manufacturing semiconductor devices and corresponding semiconductor device

 #56
20220384285
2022-12-01

Package and manufacturing method of the same

 #57
20220384209
2022-12-01

Method of manufacturing semiconductor devices and corresponding semiconductor device

 #58
20220375833
2022-11-24

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

 #59
20220367326
2022-11-17

Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame

 #60
20220359351
2022-11-10

Microelectronics package assemblies and processes for making

 #61
20220357369
2022-11-10

Integrated current sensor with magnetic flux concentrators

 #62
20220319966
2022-10-06

Isolated temperature sensor device package

 #63
20220310473
2022-09-29

Chip package

 #64
20220301988
2022-09-22

SEMICONDUCTOR DEVICE

 #65
20220293497
2022-09-15

Circuit module having a plurality of lead frames connected to a substrate by metal posts

 #66
20220285251
2022-09-08

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #67
20220157678
2022-05-19

Integrated circuit packages with cavities and methods of manufacturing the same

 #68
20220139884
2022-05-05

High connectivity device stacking

 #69
20220122905
2022-04-21

Leadframe package with isolation layer

 #70
20220115353
2022-04-14

Semiconductor device

 #71
20220068772
2022-03-03

Semiconductor device and maunfacturing method of semiconductor device

 #72
20220059443
2022-02-24

Vertical and horizontal circuit assemblies

 #73
20220037277
2022-02-03

Leadframes in semiconductor devices

 #74
20220028765
2022-01-27

Coated semiconductor devices

 #75
20220018879
2022-01-20

Integrated current sensor with magnetic flux concentrators

 #76
20210407894
2021-12-30

Semiconductor device and corresponding method

 #77
20210288027
2021-09-16

High connectivity device stacking

 #78
20210280554
2021-09-09

Semiconductor apparatus

 #79
20210265246
2021-08-26

Packaged electronic device with film isolated power stack

 #80
20210249338
2021-08-12

Package structures

 #81
20210233877
2021-07-29

Package with different types of semiconductor dies attached to a flange

 #82
20210210453
2021-07-08

Pre-molded leadframes in semiconductor devices

 #83
20210202339
2021-07-01

RELIABLE SEMICONDUCTOR PACKAGES

 #84
20210167000
2021-06-03

Method of manufacturing semiconductor devices and corresponding semiconductor device

 #85
20210119097
2021-04-22

Light emitting device, resin-attached lead frame, and methods of manufacturing the same

 #86
20210074613
2021-03-11

Flippable leadframe for packaged electronic system having vertically stacked chip and components

 #87
20210074612
2021-03-11

Semiconductor device

 #88
20210035894
2021-02-04

Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor device

 #89
20200411419
2020-12-31

Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame

 #90
20200402900
2020-12-24

Method of manufacturing semiconductor devices and corresponding semiconductor device

 #91
20200402894
2020-12-24

Packaged electronic device with film isolated power stack

 #92
20200347509
2020-11-05

Insulation systems and methods of depositing insulation systems

 #93
20200335431
2020-10-22

SEMICONDUCTOR DEVICE PACKAGE

 #94
20200279799
2020-09-03

Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangement

 #95
20200273720
2020-08-27

LASER ABLATION SURFACE TREATMENT FOR MICROELECTRONIC ASSEMBLY

 #96
20200258803
2020-08-13

Semiconductor package having routable encapsulated conductive substrate and method

 #97
20200227344
2020-07-16

Semiconductor package substrate and method for manufacturing same

 #98
20200227278
2020-07-16

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

 #99
20200211953
2020-07-02

Leadframe with a metal oxide coating and method of forming the same

 #100
20200203246
2020-06-25

Chip package

 #101
20200194381
2020-06-18

Semiconductor package

 #102
20200194327
2020-06-18

SEMICONDUCTOR DEVICE PACKAGE

 #103
20200168545
2020-05-28

Semiconductor device and method of manufacturing the same

 #104
20200161228
2020-05-21

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #105
20200135628
2020-04-30

Leadframe and leadframe package

 #106
20200135627
2020-04-30

Substrates with solder barriers on leads

 #107
20200123665
2020-04-23

BONDING SUBSTRATE AND METHOD FOR PROTECTING SURFACES INTENDED FOR WIRE BONDING

 #108
20200083149
2020-03-12

Packaged semiconductor device with a particle roughened surface

 #109
20200058598
2020-02-20

Semiconductor device and method of manufacturing the same

 #110
20200043836
2020-02-06

Package with component connected with carrier via spacer particles

 #111
20200043834
2020-02-06

Semiconductor device

 #112
20190371625
2019-12-05

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #113
20190348350
2019-11-14

Semiconductor device and corresponding method

 #114
20190326492
2019-10-24

Light emitting device, resin-attached lead frame, and methods of manufacturing the same

 #115
20190318983
2019-10-17

Spot-solderable leads for semiconductor device packages

 #116
20190312188
2019-10-10

Base member, and method of manufacturing light emitting device using same

 #117
20190287907
2019-09-19

Chip package with cross-linked thermoplastic dielectric

 #118
20190259691
2019-08-22

Integrated capacitors on lead frame in semiconductor devices

 #119
20190252301
2019-08-15

Power device having a substrate with metal layers exposed at surfaces of an insulation layer and manufacturing method thereof

 #120
20190237396
2019-08-01

Direct selective adhesion promotor plating

 #121
20190237395
2019-08-01

Semiconductor systems having dual leadframes

 #122
20190229042
2019-07-25

Semiconductor device and method for manufacturing semiconductor device

 #123
20190221505
2019-07-18

Substrate-with-support

 #124
20190206768
2019-07-04

Integrated circuit packages with wettable flanks and methods of manufacturing the same

 #125
20190206752
2019-07-04

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME

 #126
20190181083
2019-06-13

Vertical and horizontal circuit assemblies

 #127
20190172781
2019-06-06

Fan-out semiconductor package

 #128
20190157196
2019-05-23

Lead frame and semiconductor device

 #129
20190157195
2019-05-23

Packaged semiconductor device with a particle roughened surface

 #130
20190157193
2019-05-23

Semiconductor device and method for manufacturing semiconductor device

 #131
20190115288
2019-04-18

Lead frame and electronic component device

 #132
20190109110
2019-04-11

Shaped interconnect bumps in semiconductor devices

 #133
20190109076
2019-04-11

Pre-molded leadframes in semiconductor devices

 #134
20190109064
2019-04-11

Chip package

 #135
20190109016
2019-04-11

Leadframes in semiconductor devices

 #136
20190103343
2019-04-04

Power module for vehicle

 #137
20190088578
2019-03-21

Substrate with multi-layer resin structure and semiconductor device including the substrate

 #138
20190080988
2019-03-14

Semiconductor device with external terminal

 #139
20190067170
2019-02-28

Surface mounted type leadframe and photoelectric device with multi-chips

 #140
20190057930
2019-02-21

Semiconductor package substrate and method for manufacturing same

 #141
20190057921
2019-02-21

Electronic device and method of manufacturing the same

 #142
20190051586
2019-02-14

Power module and power conversion system including same

 #143
20190013262
2019-01-10

Electronic component device

 #144
20180358276
2018-12-13

SEMICONDUCTOR DEVICE PACKAGE

 #145
20180331024
2018-11-15

Electronic component having a lead frame consisting of an electrically conductive material

 #146
20180323129
2018-11-08

Semiconductor package having routable encapsulated conductive substrate and method

 #147
20180301400
2018-10-18

Heat resistant and shock resistant integrated circuit

 #148
20180294210
2018-10-11

Package with component connected with carrier via spacer particles

 #149
20180254253
2018-09-06

Package with different types of semiconductor dies attached to a flange

 #150
20180240741
2018-08-23

Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer

 #151
20180211953
2018-07-26

Integrated packaging structure

 #152
20180208820
2018-07-26

THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE

 #153
20180190608
2018-07-05

Packaged semiconductor device with a reflow wall

 #154
20180190577
2018-07-05

Packaged semiconductor device with a particle roughened surface

 #155
20180166369
2018-06-14

Bi-Layer Nanoparticle Adhesion Film

 #156
20180160569
2018-06-07

Power module, thermal dissipation structure of the power module and contact method of the power module

 #157
20180138110
2018-05-17

Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids

 #158
20180122730
2018-05-03

Producing wafer level packaging using leadframe strip and related device

 #159
20180102321
2018-04-12

Chip package and method for forming the same

 #160
20180096919
2018-04-05

Chip carrier configured for delamination-free encapsulation and stable sintering

 #161
20180096860
2018-04-05

Leadframe having organic, polymerizable photo-imageable adhesion layer

 #162
20180096859
2018-04-05

Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer

 #163
20180090338
2018-03-29

Power module and fabrication method for the same

 #164
20180076118
2018-03-15

SEMICONDUCTOR DEVICE PACKAGE

 #165
20180076116
2018-03-15

Spot-solderable leads for semiconductor device packages

 #166
20180068935
2018-03-08

Vertical and horizontal circuit assemblies

 #167
20180061667
2018-03-01

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

 #168
20180040543
2018-02-08

LEAD FRAME AND METHOD FOR MANUFACTURING SAME

 #169
20170352611
2017-12-07

Producing wafer level packaging using leadframe strip and related device

 #170
20170352610
2017-12-07

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

 #171
20170352555
2017-12-07

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

 #172
20170352554
2017-12-07

Semiconductor package with multiple molding routing layers and a method of manufacturing the same

 #173
20170345742
2017-11-30

Semiconductor device and manufacturing method thereof

 #174
20170330981
2017-11-16

Component and method for producing a component

 #175
20170323839
2017-11-09

Molded package

 #176
20170317015
2017-11-02

Power module package having patterned insulation metal substrate

 #177
20170317014
2017-11-02

Power module package having patterned insulation metal substrate

 #178
20170294395
2017-10-12

SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS

 #179
20170271245
2017-09-21

Direct selective adhesion promotor plating

 #180
20170263542
2017-09-14

Preformed lead frame device and lead frame package including the same

 #181
20170250128
2017-08-31

Method of integrating capacitors on lead frame in semiconductor devices

 #182
20170236774
2017-08-17

Semiconductor module and semiconductor driving device

 #183
20170236773
2017-08-17

Device with top-side base plate

 #184
20170207149
2017-07-20

High density integrated circuit package structure and integrated circuit

 #185
20170162486
2017-06-08

Semiconductor device and method for manufacturing semiconductor device

 #186
20170162483
2017-06-08

Electronic packages for flip chip devices

 #187
20170162481
2017-06-08

Substrate structures and methods of manufacture

 #188
20170158926
2017-06-08

LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF SAME

 #189
20170148746
2017-05-25

Semiconductor device package

 #190
20170125327
2017-05-04

Semiconductor package with coated bonding wires and fabrication method thereof

 #191
20170125324
2017-05-04

Semiconductor systems having premolded dual leadframes

 #192
20170092569
2017-03-30

Direct selective adhesion promotor plating

 #193
20170069558
2017-03-09

Semiconductor package having routable encapsulated conductive substrate and method

 #194
20170053854
2017-02-23

Packaged device with additive substrate surface modification

 #195
20170047275
2017-02-16

REDUCING LEAD STRESS IN MICRO-ELECTRONIC PACKAGES

 #196
20170025332
2017-01-26

Flippable leadframe for packaged electronic system having vertically stacked chips and components

 #197
20170025329
2017-01-26

Lead frame and method for manufacturing same

 #198
20170005058
2017-01-05

Chip package

 #199
20170005057
2017-01-05

Chip package

 #200
20170004979
2017-01-05

Method for manufacturing a chip arrangement including a ceramic layer

 #201
20160343636
2016-11-24

Waterproof electronic device and manufacturing method thereof

 #202
20160343590
2016-11-24

Power module and fabrication method for the same

 #203
20160336277
2016-11-17

Semiconductor device and method for manufacturing the same

 #204
20160329260
2016-11-10

Electronic device including a metal substrate and a semiconductor module embedded in a laminate

 #205
20160293531
2016-10-06

Semiconductor packages and related manufacturing methods

 #206
20160293529
2016-10-06

Manufacturing method of chip package structure

 #207
20160293528
2016-10-06

Semiconductor devices including control and load leads of opposite directions

 #208
20160260658
2016-09-08

Source down semiconductor devices and methods of formation thereof

 #209
20160247748
2016-08-25

Electronic packages for flip chip devices

 #210
20160233152
2016-08-11

Package structure

 #211
20160211226
2016-07-21

Integrated circuit and method of manufacturing an integrated circuit

 #212
20160181183
2016-06-23

Method for preventing die pad delamination

 #213
20160093562
2016-03-31

NON-INSULATED POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

 #214
20160079188
2016-03-17

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND MOUNTING METHOD OF SEMICONDUCTOR DEVICE

 #215
20160064252
2016-03-03

ELECTRONIC MODULE HAVING AN OXIDE SURFACE FINISH AS A SOLDER MASK, AND METHOD OF MANUFACTURING ELECTRONIC MODULE USING ORGANIC SOLDERABILITY PRESERVATIVE AND OXIDE SURFACE FINISH PROCESSES

 #216
20160035700
2016-02-04

Chip package and chip assembly

 #217
20160035654
2016-02-04

Source down semiconductor devices and methods of formation thereof

 #218
20150371931
2015-12-24

Semiconductor device and method for producing same

 #219
20150357289
2015-12-10

Semiconductor device

 #220
20150340307
2015-11-26

Molded chip package and method of manufacturing the same

 #221
20150332982
2015-11-19

Metal base substrate, power module, and method for manufacturing metal base substrate

 #222
20150294952
2015-10-15

Semiconductor device and method for manufacturing semiconductor device

 #223
20150294870
2015-10-15

Method for manufacturing semiconductor device

 #224
20150287667
2015-10-08

Chip package structure and manufacturing method thereof

 #225
20150262924
2015-09-17

Semiconductor package with lead mounted power bar

 #226
20150255370
2015-09-10

Heat radiation structure for semiconductor device

 #227
20150235928
2015-08-20

Encapsulated semiconductor device and method for manufacturing the same

 #228
20150235926
2015-08-20

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

 #229
20150228567
2015-08-13

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME

 #230
20150228560
2015-08-13

Semiconductor device package and method of manufacture

 #231
20150221585
2015-08-06

Housing for an electronic component, an electronic assembly, method of producing a housing for an electronic component and method of producing an electronic assembly

 #232
20150214177
2015-07-30

Coating layer for a conductive structure

 #233
20150194377
2015-07-09

Chip arrangement and method of manufacturing the same

 #234
20150188008
2015-07-02

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

 #235
20150155217
2015-06-04

Semiconductor device packages and methods of manufacturing the same

 #236
20150108623
2015-04-23

Coated lead frame bond finger

 #237
20150054147
2015-02-26

Lead frame having a perimeter recess within periphery of component terminal

 #238
20150027767
2015-01-29

System and method for lead frame package degating

 #239
20140252577
2014-09-11

Chip carrier structure, chip package and method of manufacturing the same

 #240
20140248747
2014-09-04

Chip-on-lead package and method of forming

 #241
20140231976
2014-08-21

Method for producing a solder joint

 #242
20140210060
2014-07-31

Manufacturing and evaluation method of a semiconductor device

 #243
20140197527
2014-07-17

CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

 #244
20140196938
2014-07-17

Lead frame

 #245
20140076613
2014-03-20

Method for electrophoretically depositing a film on an electronic assembly

 #246
20140027891
2014-01-30

Semiconductor device and method for manufacturing semiconductor device

 #247
20140001628
2014-01-02

Air cavity packages having high thermal conductivity base plates and methods of making

 #248
20140001624
2014-01-02

Semiconductor packages having metal composite base plates

 #249
20140001616
2014-01-02

Semiconductor device package and method of manufacture

 #250
20140001613
2014-01-02

SEMICONDUCTOR PACKAGE

 #251
20130337613
2013-12-19

Power module package and method for manufacturing the same

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