207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Semiconductor device
#2702Printed circuit board and method for manufacturing printed circuit board
#2703Semiconductor integrated circuit device
#2704Integrated circuit packages with sandwiched capacitors
#2705Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
#2706Stacked IC device having functions for selecting and counting IC chips
#2707Semiconductor device having capacitors for reducing power source noise
#2708Circuit
#2709FLIP CHIP PACKAGE STRUCTURE AND CHIP STRUCTURE THEREOF
#2710Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#2711Power supply connection structure to a semiconductor device
#2712Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#2713I/O architecture for integrated circuit package
#2714Array capacitors with voids to enable a full-grid socket
#2715Thin film capacitors on ceramic
#2716Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device
#2717Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument
#2718Method and apparatus for applying body bias to integrated circuit die
#2719Semiconductor device and electronic equipment using the same
#2720Semiconductor integrated circuit device
#2721Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
#2722Semiconductor integrated circuit device
#2723Repatterned integrated circuit chip package
#2724Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same
#2725Capacitor having an anodic metal oxide substrate
#2726Capacitor having an anodic metal oxide substrate
#2727System and method for delivering power to a semiconductor device
#2728Printed circuit board and inkjet head
#2729Method and apparatus for trace shielding and routing on a substrate
#2730Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device
#2731Circuits and methods that attenuate coupled noise
#2732Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
#2733Ball grid array package substrates with a modified central opening and method for making the same
#2734SRAM device having high aspect ratio cell boundary
#2735Crossed power strapped layout for full CMOS circuit design
#2736Package substrate for integrated circuit and method of making the substrate
#2737Damping of LC ringing in IC (integrated circuit) power distribution systems
#2738Multi-concentric pad arrangements for integrated circuit pads
#2739High performance chip carrier substrate
#2740Methods and apparatus for integrated circuit device power distribution via internal wire bonds
#2741Semiconductor/printed circuit board assembly, and computer system
#2742Microtransformer for system-on-chip power supply
#2743Semiconductor chip package having decoupling capacitor and manufacturing method thereof
#2744Semiconductor chip package and method
#2745Semiconductor integrated circuit
#2746Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode
#2747Flip chip interconnection pad layout
#2748Tape circuit substrate and semiconductor apparatus employing the same
#2749Semiconductor device and method of fabricating the same
#2750Technique for attaching die to leads
#2751Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device
#2752Constructing of an electronic assembly having a decoupling capacitor
#2753Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#2754RF circuit electrostatic discharge protection
#2755Depopulation of a ball grid array to allow via placement
#2756Cavity-down semiconductor package with heat spreader
#2757Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
#2758Wiring substrate for mounting semiconductor components
#2759Semiconductor device
#2760STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP
#2761Optimization of routing layers and board space requirements for a ball grid array package
#2762Optimization of routing layers and board space requirements for a ball grid array land pattern
#2763Active phase cancellation for power delivery
#2764Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#2765Structure and method for forming a capacitively coupled chip-to-chip signaling interface
#2766Metallic dam and method of forming therefor
#2767Integrated circuit incorporating flip chip and wire bonding
#2768BGA package and printed circuit board for supporting the package
#2769Input/output structure and integrated circuit using the same
#2770Apparatus for connecting an IC terminal to a reference potential
#2771Power delivery using an integrated heat spreader
#2772Memory expansion and chip scale stacking system and method
#2773Circuit carrier and production thereof
#2774Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#2775Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
#2776Semiconductor integrated circuit and electronic apparatus having the same
#2777Memory expansion and chip scale stacking system and method
#2778Integrated circuit suitable for use in radio receivers
#2779Semiconductor device, and wiring-layout design system for automatically designing wiring-layout in such semiconductor device
#2780Semiconductor device
#2781Semiconductor apparatus with decoupling capacitor
#2782Apparatus and method for stacking integrated circuits
#2783Method of manufacturing thin film capacitor
#2784Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board
#2785Integrated circuit package
#2786I/O architecture for integrated circuit package
#2787Stackable electronic assembly
#2788Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same
#2789Integrated circuit packaging architecture
#2790Wafer-level chip scale package
#2791Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations
#2792Flip chip die bond pads, die bond pad placement and routing optimization
#2793Die-up ball grid array package including a substrate having an opening and method for making the same
#2794Chip package structure
#2795Chip packaging and connection for reduced EMI
#2796Rectifying charge storage element
#2797Semiconductor memory module
#2798Enhanced die-up ball grid array and method for making the same
#2799Integrated circuit package with overlapping bond fingers
#2800Semiconductor device and an electronic device
#2801Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure
#2802High density chip carrier with integrated passive devices
#2803Methods and devices for providing bias to a monolithic microwave integrated circuit
#2804Semiconductor device
#2805Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices
#2806Method for optimizing routing layers and board space requirements for a ball grid array land pattern
#2807Capacitor device and method of manufacturing the same
#2808Chip package structure
#2809Enhanced die-down ball grid array and method for making the same
#2810Semiconductor device
#2811Bonding pad for a packaged integrated circuit
#2812Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
#2813Semiconductor integrated circuit device, mounting board, and device and board assembly
#2814Multiple chip semiconductor arrangement having electrical components in separating regions
#2815Ultra wideband BGA
#2816Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
#2817Integrated circuit package differential pin pattern for cross-talk reduction
#2818High-density microbump and probe pad arrangement for semiconductor components
#2819High current solid-state bidirectional relay
#2820High electric-thermal performance and high-power density power module
#2821Solid state power switch with optimized heat sink configuration
#2822Embedded shield for protection of memory cells
#2823Semiconductor module with external power sensor
#2824Selectable reconfiguration for dynamically reconfigurable IP cores
#2825Interposer with interconnects and methods of manufacturing the same
#2826Structure and method for flexible power staple insertion
#2827Reduced area efuse cell structure
#2828Flash memory device having flame resistant
#2829Package stiffener for protecting semiconductor die
#2830Electro-static discharge protection device and method of making
#2831Integrated circuit structure incorporating stacked field effect transistors
#2832Chip package assembly with enhanced interconnects and method for fabricating the same
#2833Method for manufacturing memory having stacked integrated circuit chip
#2834Molded package with chip carrier comprising brazed electrically conductive layers
#2835Underfill stop using via bars in semiconductor packages
#2836Selectable reconfiguration for dynamically reconfigurable IP cores
#2837Multi-layer filled gate cut to prevent power rail shorting to gate structure
#2838Compensation of temperature effects in semiconductor device structures
#2839Gallium nitride semiconductor device with isolated fingers
#2840Pixel unit and pixel array
#2841Integrated circuit die decoupling system with reduced inductance
#2842Integrated circuit package having voltage regulation circuitry
#2843Power filtering circuit and method
#2844Structure of ESD protection circuits on BEOL layer
#2845Semiconductor device with dynamic low voltage triggering mechanism
#2846Semiconductor device, structure and methods
#2847Methods of forming coaxial feedthroughs for 3D integrated circuits
#2848Memory metal scheme
#2849Low resistance power switching device
#2850Integrated circuit system with external resistor to provide constant current bias and method of manufacture thereof
#2851Integrated circuit device substrates having packaged inductors thereon
#2852Encapsulated semiconductor package
#2853Flexible and robust power grid connectivity
#2854Semiconductor devices and structures
#2855Package substrate with current flow shaping features
#2856Sidewall image transfer for heavy metal patterning in integrated circuits
#2857Flexible, space-efficient I/O circuitry for integrated circuits
#2858Bonding pad arrangment design for multi-die semiconductor package structure
#2859Power distribution network
#2860Packaging of electronic circuitry