207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Integrated circuit chip and integrated device
#2402Semiconductor device having capacitors for reducing power source noise
#2403Packaged integrated circuit with enhanced thermal dissipation
#2404IC with on-die power-gating circuit
#2405Via/BSM pattern optimization to reduce DC gradients and pin current density on single and multi-chip modules
#2406Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
#2407High frequency electronic component
#2408Reduced inductance in ball grid array packages
#2409Ball grid array package and substrate within
#2410Integrated circuit chip module
#2411Packaging for high speed integrated circuits
#2412Packaging for high speed integrated circuits
#2413Packaging for high speed integrated circuits
#2414Packaging for high speed integrated circuits
#2415Packaging for high speed integrated circuits
#2416Packaging for high speed integrated circuits
#2417Electronic device and carrier substrate for same
#2418Split control pad for multiple signal
#2419Tape wiring substrate and chip-on-film package using the same
#2420Integrated circuit device including interface circuit and electronic apparatus
#2421SEMICONDUCTOR MULTI-CHIP PACKAGE
#2422Parallel chip embedded printed circuit board and manufacturing method thereof
#2423System and method for ESD protection
#2424Cavity ball grid array apparatus having improved inductance characteristics
#2425Semiconductor device with improved signal transmission characteristics
#2426Adhesive layer forming a capacitor dielectric between semiconductor chips
#2427Three-dimensional semiconductor module having multi-sided ground block
#2428Auto connection assignment system and method
#2429Electronic component and method for manufacturing the same
#2430Embedding thin film resistors in substrates in power delivery networks
#2431Semiconductor integrated circuit device with independent power domains
#2432Display device and manufacturing method thereof
#2433Signal isolation in a package substrate
#2434Wiring board and method for manufacturing the same
#2435Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same
#2436Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors
#2437Decoupling capacitor for an integrated circuit and method of manufacturing thereof
#2438Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#2439Substrate structure of semiconductor package
#2440Wiring board and manufacturing method of wiring board
#2441Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring
#2442Through-hole arrangement for a ball grid array package
#2443Chip structure with bevel pad row
#2444Chip structure with arrangement of side pads
#2445SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
#2446Package cap with bypass capacitance
#2447Semiconductor device with non-intersecting power and ground wiring patterns
#2448Capacitor structure
#2449Semiconductor device
#2450Ball grid array assignment
#2451Processing device on which processing elements having same function are embedded in one chip
#2452Package substrate with built-in capacitor and manufacturing method thereof
#2453Methods for providing bias to a monolithic microwave integrated circuit
#2454Multilayer printed wiring board
#2455Semiconductor device with a rewiring level and method for producing the same
#2456Multilayer printed wiring board
#2457Gap control between interposer and substrate in electronic assemblies
#2458Method and apparatus for flip-chip packaging providing testing capability
#2459Method to align mask patterns
#2460Circuit device
#2461Semiconductor device and electronic device
#2462Semiconductor device with electrically isolated ground structures
#2463Bonding pad for a packaged integrated circuit
#2464Semiconductor module and method of forming a semiconductor module
#2465Systems and methods for reducing simultaneous switching noise in an integrated circuit
#2466Structure and assembly method of integrated circuit package
#2467Routing vias in a substrate from bypass capacitor pads
#2468Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same
#2469Semiconductor device and an image sensing device
#2470Semiconductor device to be applied to various types of semiconductor package
#2471Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same
#2472Embedded capacitor structure
#2473Integrated circuit package
#2474Signal transmission arrangement and method
#2475Electronic package with integrated capacitor
#2476Printed wiring board and method for manufacturing the same
#2477Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
#2478Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
#2479Chip-packaging with bonding options having a plurality of package substrates
#2480MULTI-CHIP BALL GRID ARRAY PACKAGE
#2481Thin multi-terminal capacitor and method of manufacturing the same
#2482System and method for reducing voltage drops in integrated circuits
#2483Semiconductor device
#2484Semiconductor device package, method of manufacturing the same, and semiconductor device
#2485Method of manufacturing semiconductor device
#2486Memory device power distribution in memory assemblies
#2487Semiconductor device
#2488Universal pattern of contact pads for semiconductor reflow interconnections
#2489Semiconductor device with micro connecting elements and method for producing the same
#2490Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
#2491Semiconductor device and method of manufacturing the same
#2492Ground arch for wirebond ball grid arrays
#2493IC package with signal land pads
#2494Perimeter matrix ball grid array circuit package with a populated center
#2495Interposer for decoupling integrated circuits on a circuit board
#2496Semiconductor device
#2497Wiring board and capacitor to be built into wiring board
#2498Flip chip interconnection pad layout
#2499Semiconductor device and method of manufacturing the same
#2500Chip packaging structure adapted to reduce electromagnetic interference
#2501Electronic assembly with integrated IO and power contacts
#2502Off-grid decoupling of ball grid array (BGA) devices and method
#2503Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
#2504Flip chip interconnection pad layout
#2505Interconnection structure through passive component
#2506Semiconductor device including multiple rows of peripheral circuit units
#2507Chip package with embedded component
#2508Semiconductor integrated circuit and method of manufacturing the same
#2509Tile-based routing method of a multi-layer circuit board and related structure
#2510Integrated packaged having magnetic components
#2511Ballout for buffer
#2512Mounting pad structure for wire-bonding type lead frame packages
#2513Multilayer board and a semiconductor device
#2514Printed circuit board structure for mobile terminal
#2515Method of manufacturing wiring board
#2516Semiconductor device
#2517Capacitor pad network to manage equivalent series resistance
#2518Substrate for semiconductor devices and semiconductor device
#2519Stacked-type semiconductor device
#2520INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER
#2521IC substrate with over voltage protection function
#2522IC substrate with over voltage protection function
#2523Ball grid array IC substrate with over voltage protection function
#2524IC substrate with over voltage protection function
#2525IC substrate with over voltage protection function
#2526Power core devices
#2527Package that integrates passive and active devices with or without a lead frame
#2528Module
#2529System for implementing a configurable integrated circuit
#2530Package and method for saving space required by I/O of chip
#2531Method of manufacturing wiring substrate to which semiconductor chip is mounted
#2532Method for manufacturing wiring board
#2533Wafer bonded MOS decoupling capacitor
#2534Thin film capacitor for reducing power supply noise
#2535Transceiver using low temperature co-fired ceramic method
#2536Semiconductor apparatus
#2537Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
#2538Semiconductor device
#2539Integrated circuit with stacked-die configuration utilizing substrate conduction
#2540Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure
#2541Ball assignment schemes for integrated circuit packages
#2542Capacitor having an anodic metal oxide substrate
#2543Designated MOSFET and driver design to achieve lowest parasitics in discrete circuits
#2544Semiconductor device
#2545Integrated circuit component and mounting method thereof
#2546System-in-package type semiconductor device
#2547Wiring board having connecting wiring between electrode plane and connecting pad
#2548Configuration terminal for integrated devices and method for configuring an integrated device
#2549Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#2550Integrated circuit chip package having a ring-shaped silicon decoupling capacitor
#2551Integrated circuit die with logically equivalent bonding pads
#2552System to control effective series resistance of decoupling capacitor
#2553Circuitized substrate with trace embedded inside ground layer
#2554Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#2555Power distribution within a folded flex package method and apparatus
#2556Ceramic thin film on base metal electrode
#2557Array capacitor with resistive structure
#2558Method and system for a pad structure for use with a semiconductor package
#2559Method and system for an improved power distribution network for use with a semiconductor device
#2560Multilayer semiconductor device
#2561System to control effective series resistance of power delivery circuit
#2562Capacitor device and method of manufacturing the same
#2563Circuit carrier and production thereof
#2564Multilayer core board and manufacturing method thereof
#2565Fine pitch grid array type semiconductor device
#2566Integrated capacitor on packaging substrate
#2567Array capacitor apparatuses to filter input/output signal
#2568Power LED package
#2569Decoupling capacitor for an integrated circuit and method of manufacturing thereof
#2570Array capacitor with IC contacts and applications
#2571Semiconductor device
#2572Input/output routing on an electronic device
#2573Die down ball grid array package
#2574Multi-terminal device and printed wiring board
#2575Structure and method of high performance two layer ball grid array substrate
#2576Packaging method, packaging structure and package substrate for electronic parts
#2577Method of manufacturing capacitor device
#2578Rectifying charge storage element
#2579Circuit board with a thin-film layer configured to accommodate a passive element
#2580Power network reconfiguration using MEM switches
#2581Semiconductor device and a method of assembling a semiconductor device
#2582Routing vias in a substrate from bypass capacitor pads
#2583Method of fabricating a semiconductor die package having improved inductance characteristics
#2584Routing power and ground vias in a substrate
#2585Technique for attaching die to leads
#2586High density interconnect power and ground strap and method therefor
#2587System and method for providing scalability in an integrated circuit
#2588Semiconductor device
#2589Capacitor placement for integrated circuit packages
#2590Wiring substrate and semiconductor device using the same
#2591Method to align mask patterns
#2592Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages
#2593Apparatus for improved power distribution in wirebond semiconductor packages
#2594Routing differential signal lines in a substrate
#2595Semiconductor device
#2596Semiconductor device substrate, semiconductor device, and manufacturing method thereof
#2597Method and resulting structure for manufacturing semiconductor substrates
#2598Semiconductor integrated circuit having noise detect circuits detecting noise on power supply nets
#2599Stacked packages
#2600Power gridding scheme
#2601Power gridding scheme
#2602Method of creating electrostatic discharge protection in a microelectronic module
#2603Multi-functional energy conditioner
#2604Voltage droop suppressing circuit
#2605Multi-chip module and single-chip module for chips and proximity connectors
#2606Layout method of decoupling capacitors
#2607Electronic assemblies and systems comprising interposer with embedded capacitors
#2608Circuit device with at least partial packaging and method for forming
#2609Heat dissipation device for integrated circuits
#2610Semiconductor package and method for its manufacture
#2611Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
#2612Silicon building block architecture with flex tape
#2613Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
#2614Special contact points for accessing internal circuitry of an intergrated circuit
#2615Method of forming printed circuit card
#2616Method for fabricating an electronic component embedded substrate
#2617Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#2618Memory device power distribution in memory assemblies
#2619Power delivery using an integrated heat spreader
#2620Universal energy conditioning interposer with circuit architecture
#2621Pad-limited integrated circuit
#2622Voltage droop suppressing active interposer
#2623Method and system for expanding flash storage device capacity
#2624Integrated circuit packages, systems, and methods
#2625Mirror image electrical packages and system for using same
#2626Extended thin film capacitor (TFC)
#2627Interposer containing bypass capacitors for reducing voltage noise in an IC device
#2628Semiconductor die package with internal bypass capacitors
#2629Ground plane for integrated circuit package
#2630Apparatus for providing capacitive decoupling between on-die power and ground conductors
#2631Stacking system and method
#2632Multi-frequency noise suppression capacitor set
#2633High frequency multilayer integrated circuit
#2634High density chip scale leadframe package and method of manufacturing the package
#2635Active phase cancellation for inductor/capacitor networks
#2636Buried array capacitor and microelectronic structure incorporating the same
#2637Intermediate substrate
#2638Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
#2639Semiconductor device
#2640Wire bonding method and apparatus for integrated circuit
#2641Programming semiconductor dies for pin map compatibility
#2642Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
#2643Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
#2644Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#2645Semiconductor device power interconnect striping
#2646Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#2647Electronic circuit package
#2648Chip-packaging with bonding options having a plurality of package substrates
#2649Array capacitors in interposers, and methods of using same
#2650Selectable decoupling capacitors for integrated circuits and associated methods
#2651Integrated circuit ground system
#2652Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#2653Integrated circuit package with improved power signal connection
#2654High-frequency amplification device
#2655System and method for ESD protection
#2656Thermal dissipating capacitor and electrical component comprising same
#2657Capacitor-embedded substrate
#2658Portable telephone
#2659Power semiconductor switching devices and power semiconductor devices
#2660Multilayer printed board, electronic apparatus, and packaging method
#2661Thermal dissipating capacitor and electrical component comprising same
#2662Circuit board, device mounting structure, device mounting method, and electronic apparatus
#2663Integrated circuit package and method having wire-bonded intra-die electrical connections
#2664Semiconductor device with a plurality of ground planes
#2665Circuit and method for enhanced low frequency switching noise suppression in multilayer printed circuit boards using a chip capacitor lattice
#2666Wiring board mounting a capacitor
#2667Semiconductor device with non-overlapping chip mounting sections
#2668Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#2669Extended thin film capacitor (TFC)
#2670Trench capacitor power supply system and method
#2671Electronic assembly with integrated IO and power contacts
#2672Method of creating solder bar connections on electronic packages
#2673System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
#2674Delivery regions for power, ground and I/O signal paths in an IC package
#2675Intermediate substrate
#2676Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
#2677Wiring board and process for producing the same
#2678Protection circuit in semiconductor circuit device comprising a plurality of chips
#2679Semiconductor package
#2680Semiconductor element and wafer level chip size package therefor
#2681Semiconductor device and electronic device
#2682Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#2683Current controlling circuit arrangement and associated method for reducing crosstalk
#2684Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
#2685Bonding pad arrangement method for semiconductor devices
#2686Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications
#2687Flip chip MMIC on board performance using periodic electromagnetic bandgap structures
#2688Semiconductor integrated circuit device
#2689Daisy chaining of serial I/O interface on stacking devices
#2690Semiconductor device
#2691Optimized power delivery to high speed, high pin-count devices
#2692Multi-layer substrate module and wireless terminal device
#2693Semiconductor device with capacitor
#2694Integrated circuit redistribution package
#2695High-frequency power amplifier module
#2696Microelectronic assembly having array including passive elements and interconnects
#2697Semiconductor module
#2698Power plane system of high-speed digital circuit for suppressing ground bounce noise
#2699High-power LGA socket
#2700Semiconductor device and manufacturing method of them