METAL GATE STRUCTURE CUTTING PROCESS

TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-22NM PITCH METALS

Semiconductor device having sense amplifier

THREE-DIMENSIONAL MEMORY DEVICE WITH WORD LINES EXTENDING THROUGH SUB-ARRAYS, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE SAME

Memory device including different dielectric structures between blocks

Semiconductor memory

Floating gate test structure for embedded memory device

Method of making a multi-tier memory device with rounded joint structures

Display device and display driving method

Method for manufacturing semiconductor structure and semiconductor structure thereof

INTEGRATED CIRCUIT DEVICES

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING

Semiconductor device, and associated method and system

Semiconductor devices and methods of fabricating the same

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

FIELD EFFECT TRANSISTOR WITH SOURCE/DRAIN VIA AND METHOD

INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATTERN OR VIA STRUCTURE WITH SIDEWALL SPACER STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING SPACER VIA STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

Integrated chip having a back-side power rail

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE HAVING THROUGH SUBSTRATE VIA AND MANUFACTURING METHOD THEREOF

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM UP GAP FILL

FILM SCHEME TO REDUCE PLASMA-INDUCED DAMAGE

METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE HARD MASKS FOR FORMATION OF DEEP VIA OPENINGS

METHOD FOR FORMING CONDUCTIVE FEATURE

Etch stop detection structure and etch stop detection method

SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

Low voltage one-time-programmable memory and array thereof

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES

NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE

Semiconductor device with source/drain contact

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

RADIO FREQUENCY (RF) SWITCH WITH DRAIN/SOURCE CONTACTS

Memory device including staircase structure having conductive pads

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING GRAPHENE INTERCONNECT AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE

Semiconductor device with liner structure

MEMORY DEVICES INCLUDING CONDUCTIVE RAILS, AND RELATED METHODS AND ELECTRONIC SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INTEGRATED CIRCUITS (ICS) EMPLOYING MULTI-PATTERN METALLIZATION TO OPTIMIZE METAL INTERCONNECT SPACING FOR IMPROVED PERFORMANCE AND RELATED FABRICATION METHODS

SEMICONDUCTOR STRUCTURE WITH RESISTOR AND CAPACITOR

Hybrid interconnect structure for self aligned via

SEMICONDUCTOR DEVICE INCLUDING POWER MESH

LOCAL INTERCONNECT POWER RAILS AND UPPER POWER RAILS

SEMICONDUCTOR PACKAGES

Manufacturing method of semiconductor structure

Semiconductor device including penetration via structure

Interconnect Structure and Method of Forming the Same

Memory device, semiconductor device, and method of fabricating semiconductor device

Capping layer over FET FeRAM to increase charge mobility

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SOURCE RAILS AND METHOD OF MAKING THE SAME

Memory device including support structures

Method of forming stacked trench contacts and structures formed thereby

INTERCONNECT STRUCTURE INCLUDING TOPOLOGICAL MATERIAL

Power delivery network for CFET with buried power rails

POWER DISTRIBUTION NETWORKS FOR SEMICONDUCTOR CHIP

Semiconductor device having L-shaped conductive pattern

Semiconductor device and method of manufacture

CONTACT STRUCTURES FOR REDUCING ELECTRICAL SHORTS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MASSIVE DATA STORAGE SYSTEM INCLUDING THE SAME

Methods of forming contact features in field-effect transistors

Memory device including self-aligned conductive contacts

Semiconductor device and method for fabricating the same

Power line design modification to mitigate vertical band crosstalk

RECESSED TRANSISTOR TERMINAL VIA JUMPERS

STACKED DIE RF CIRCUITS AND PACKAGE METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER

SEMICONDUCTOR DEVICE

PASSIVE DEVICE STRUCTURE STRESS REDUCTION

HYBRID ETCH STOP LAYERS

BACKSIDE ELECTRICAL CONTACT FOR PMOS EPITAXIAL VOLTAGE SUPPLY

CELL OPTIMIZATION THROUGH SOURCE RESISTANCE IMPROVEMENT

Three-dimensional memory device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS WITH NARROW WIDTH INTERCONNECTS AND REDUCED RC DELAY

MICROELECTRONIC DEVICES WITH DIFFERENT STAIRCASED STADIUMS HAVING CONSISTENT MULTI-TIER STEP RISER HEIGHT, AND RELATED SYSTEMS AND METHODS

SEMICONDUCTOR MEMORY DEVICE WITH 3D STRUCTURE

INTEGRATED CIRCUIT STRUCTURES WITH CONTOURED INTERCONNECTS

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT STRUCTURES WITH PRE-EPITAXIAL DEEP VIA STRUCTURE

DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT IN ARCHITECTURE OF BACKSIDE POWER DELIVERY

HIGH VOLTAGE PASSIVE DEVICE STRUCTURE

Metal loss prevention using implantation

Methods of forming microelectronic devices, and related electronic systems

Metal Surface Blocking Molecules for Selective Deposition

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FOR FABRICATING THE SAME

FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE GROWN MATERIALS

Method for fabricating semiconductor device and reworking process

Reworking process of a failed hard mask for fabricating a semiconductor device

Method of preparing semiconductor structure having low dielectric constant layer

Three-dimensional memory device and method

Three-dimensional memory containing a staircase with dummy steps and method of making thereof with step length control

Metal-insulator-metal device capacitance enhancement

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device having antenna and manufacturing method thereof

REDISTRIBUTION LAYER FEATURES

Backside signal interconnection

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COMPONENT WITH HIGH ELECTRON MOBILITY

SEMICONDUCTOR MEMORY DEVICE

Integrated device and integrated passive device comprising magnetic material

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

Semiconductor device and massive data storage system including the same

AIRGAPS USED IN BACKEND MEMORY STRUCTURES

Passivation layer for integrated circuit structure and forming the same

IMPLANTATION THROUGH AN ETCH STOP LAYER

Word line structures for three-dimensional memory arrays

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES HAVING THROUGH STAIR CONTACTS AND METHODS FOR FORMING THE SAME

NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE

MEMORY DEVICE

Memory device

Memory array circuit and method of manufacturing same

SEMICONDUCTOR DEVICE WITH CONDUCTIVE LINERS OVER SILICIDE STRUCTURES AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

INTEGRATED CIRCUIT STRUCTURES WITH DEEP VIA STRUCTURE

COMPOUND SEMICONDUCTOR DEVICES COMBINED IN A FACE-TO-FACE ARRANGEMENT

CAPACITOR WITH CONTACT STRUCTURES FOR CAPACITANCE DENSITY BOOST

High density capacitor

Control Signal Route Through Backside Layers for High Performance Standard Cells

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

MEMORY DEVICE HAVING WORD LINE WITH DUAL CONDUCTIVE MATERIALS

Semiconductor memory device and manufacturing method of the semiconductor memory device

Through vias of semiconductor structure and method of forming thereof

Etch profile control of gate contact opening

Pit-less chemical mechanical planarization process and device structures made therefrom

Selective removal of an etching stop layer for improving overlay shift tolerance

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Vertical semiconductor device and method for fabricating the same

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Air gap type semiconductor device package structure

COMMON RAIL CONTACT

Semiconductor device including cumulative sealing structures

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

MEMORY DEVICE INCLUDING SUPPORT STRUCTURES AND CONTACT STRUCTURES HAVING DIFFERENT MATERIALS

Chip package and method of forming the same

SEMICONDUCTOR CIRCUIT FOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE VIA STRUCTURES FOR FAR-END CROSSTALK CANCELLATION

PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CAPACITORS OF MULTI-LEVEL MEMORY ARRAYS

Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells And Memory Arrays Comprising Strings Of Memory Cells

SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION

INTERCONNECT STRUCTURE

Dielectric Layers Having Nitrogen-Containing Crusted Surfaces

Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same

IMAGING DEVICE

LAYOUT DESIGN FOR RF CIRCUIT

SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT AND METHOD FOR FABRICATING THE SAME

Semiconductor device structure including overlay mark structure

Semiconductor device and method for forming the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Metal-oxide-metal cell semiconductor device and method

3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

ENGINEERED DIELECTRIC PROFILE FOR HIGH ASPECT-RATIO 3D NAND STRUCTURES

SELF-ALIGNED INTERCONNECT FEATURES FOR TRANSISTOR CONTACTS

INTERCONNECT FEATURE CONTACTED WITHIN A RECESS

Hybrid metal line structure

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICES

Nonvolatile memory device and method for fabricating the same

Three-dimensional memory device containing etch-stop structures and self-aligned insulating spacers and method of making the same

CONNECTOR VIA STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FORMING THE SAME

Connector via structures for nanostructures and methods of forming the same

Integrated circuit device

Semiconductor device and method of forming the same

Air channel formation in packaging process

Graphite-Based Interconnects And Methods Of Fabrication Thereof

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS OF FORMING THE SAME

Semiconductor device having a contact structure

METAL LINES OF HYBRID HEIGHTS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Processes for reducing leakage and improving adhesion

Semiconductor structure and manufacturing method thereof

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR SPACER

SEMICONDUCTOR DEVICE WITH EMBEDDED MAGNETIC FLUX CONCENTRATOR

Three-dimensional memory device with contact via structures located over support pillar structures and method of making thereof

GaN-based high electron mobility transistors and fabrication method thereof

Metal-insulator-metal (MIM) capacitor module with outer electrode extension

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERENT DIES TO EACH OTHER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Interconnect structure and method for manufacturing the interconnect structure

TOP VIA INTERCONNECT WITH AN EMBEDDED ANTIFUSE

Structures and methods for heat dissipation of semiconductor devices

Method for manufacturing semiconductor structure with resistive elements

Non-volatile memory device and manufacturing method thereof

MRAM INTERCONNECT INTEGRATION WITH SUBTRACTIVE METAL PATTERNING

Three-dimensional memory array with local line selector

SEMICONDUCTOR DEVICE HAVING SELECTION LINE STUD CONNECTED TO STRING SELECTION LINE

Semiconductor device

Methods for manufacturing a plurality of semiconductor structures and system in package

Trench contact structures for advanced integrated circuit structure fabrication

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING A STACK OF CHIPS, AND CHIPS FOR SUCH A STACK

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

Vertical conductive structure surrounded by guard ring and method of making

Semiconductor device including back side power supply circuit

Semiconductor device and method of fabricating same

Packed terminal transistors

Interconnect structures and methods of fabrication thereof

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Semiconductor structure having an anchor-shaped backside via

INTEGRATED CIRCUIT PACKAGE AND METHOD

TOP VIA INTERCONNECT WITH AIRGAP

SEMICONDUCTOR DEVICE

Heat dispersion layers for double sided interconnect

CONTACT FOR ELECTRONIC COMPONENT

Conformal low temperature hermetic dielectric diffusion barriers

Semiconductor device having metallization layer with low capacitance and method for manufacturing the same

System and method of forming a porous low-k structure

Memory devices

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES HAVING THROUGH ARRAY CONTACTS AND METHODS FOR FORMING THE SAME

Contact for semiconductor device and method of forming thereof

EPITAXIAL SOURCE/DRAIN FEATURE WITH ENLARGED LOWER SECTION INTERFACING WITH BACKSIDE VIA

TRANSISTOR WITH INTERDIGIT ELECTRODES, COMPRISING A GATE TERMINAL CONNECTED BY A PLURALITY OF VERTICAL VIAS TO THE GATE ELECTRODES

Semiconductor package

CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME

HYBRID SUPER VIA STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit and method for forming the same

Staircase structure in three-dimensional memory device and method for forming the same

METALLIZATION STACK AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING METALLIZATION STACK

Integrated circuit structure with backside via

Interconnect structure having a barrier layer along the sidewall of self-aligned via structures

Semiconductor device and method for manufacturing the semiconductor device preliminary class

Semiconductor device and method of fabricating the same

Interconnect structure and method for forming the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

FORMING LINE END VIAS

INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS

Semiconductor device and method of manufacturing a semiconductor device

METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES

AIR GAP THROUGH AT LEAST TWO METAL LAYERS, AND RELATED METHOD

Via-first process for connecting a contact and a gate electrode

Reducing spacing between conductive features through implantation

SEMICONDUCTOR DEVICE

MEMORY DEVICE HAVING IMPROVED MEMORY CELL STRUCTURES TO PREVENT FORMATION OF VOIDS THEREIN

Semiconductor device structure

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Method of forming integrated chip structure having slotted bond pad in stacked wafer structure

Semiconductor device

Semiconductor package and method of fabricating the same

Integrated circuit package and method

SELECTIVE DEPOSITION USING GRAPHENE AS AN INHIBITOR

METHOD AND APPARATUS FOR FORMING RUTHENIUM SILICIDE FILM ON SURFACE OF SUBSTRATE

CURRENT-DISTRIBUTING PIN STRUCTURE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF FAILURE ANALYSIS FOR SEMICONDUCTOR DEVICE

Three-dimensional resistive random access memory structure

Three-dimensional semiconductor memory device

COMPACT ELECTRICAL CONNECTION THAT CAN BE USED TO FORM AN SRAM CELL AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE

Hyperchip

Delamination sensor

Power delivery for embedded bridge die utilizing trench structures

Trench power rail in cell circuits to reduce resistance and related power distribution networks and fabrication methods

Contact features and methods of fabricating the same in semiconductor devices

Method of forming bottom electrode via for memory device

MEMORY STRUCTURE HAVING NOVEL CIRCUIT ROUTING AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method of package structure of electronic device

Semiconductor device

SELECTIVE DEPOSITION AND CROSS-LINKING OF POLYMERIC DIELECTRIC MATERIAL

Memory array

METHOD AND APPARATUS TO MITIGATE WORD LINE STAIRCASE ETCH STOP LAYER THICKNESS VARIATIONS IN 3D NAND DEVICES

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

METHOD FOR MANUFACTURING CAPACITOR ARRAY, CAPACITOR ARRAY, AND SEMICONDUCTOR DEVICE

Method for fabricating an integrated circuit device

Semiconductor package and method of manufacturing the same

Semiconductor device

METAL SPACERS WITH HARD MASKS FORMED USING A SUBTRACTIVE PROCESS

Semiconductor package

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

Structure and formation method of semiconductor device with carbon-containing conductive structure

Integrated circuit interconnect structure having discontinuous barrier layer and air gap

METHOD OF FORMING A CAP LAYER FOR SEALING AN AIR GAP, AND SEMICONDUCTOR DEVICE

MEMORY DEVICES AND METHODS OF FORMING THE SAME

MEMORY STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR DEVICE

Connection structure and electronic device

3D semiconductor device and structure with oxide bonding

RADIO FREQUENCY SWITCH

Semiconductor device with stacked structure

LOW VIA RESISTANCE INTERCONNECT STRUCTURE

Method for preparing a semiconductor device with interconnect part

MIDDLE OF THE LINE HEATER AND METHODS