Extended via semiconductor structure and device

INTERCONNECT STRUCTURE

INTEGRATED CIRCUIT WITH GETTER LAYER FOR HYDROGEN ENTRAPMENT

Semiconductor memory device

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR MEMORY DEVICE

Hybrid integrated circuit package

Photonic semiconductor device and method

LOGIC DRIVE BASED ON CHIP SCALE PACKAGE COMPRISING STANDARDIZED COMMODITY PROGRAMMABLE LOGIC IC CHIP AND MEMORY IC CHIP

STRUCTURES AND METHODS FOR REDUCING THERMAL EXPANSION MISMATCH DURING INTEGRATED CIRCUIT PACKAGING

Chemical direct pattern plating method

Semiconductor devices including line identifier

CONDUCTIVE STRUCTURES AND METHODS OF FABRICATION THEREOF

Interconnection structure and manufacturing method thereof

ENHANCED LINERLESS VIAS

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNGS MODULUS

Air gaps in memory array structures

SEMICONDUCTOR STORAGE DEVICE

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG AND SEMICONDUCTOR DEVICE

Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package

Buried power rail formation for vertical field effect transistors

TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

SEMICONDUCTOR DEVICE, NONVOLATILE MEMORY DEVICE INCLUDING THE SAME, AND ELECTRONIC SYSTEM INCLUDING THE SAME

Metal-insulator-metal (MIM) capacitor module including a cup-shaped structure with a rounded corner region

Metal-insulator-metal (MIM) capacitor including an insulator cup and laterally-extending insulator flange

STANDARD CELL ARCHITECTURE WITHOUT POWER DELIVERY SPACE ALLOCATION

INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION

INTERCONNECTOR AND ELECTRONIC APPARATUS INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

Semiconductor device structure and methods of forming the same

Methods of forming a microelectronic device

Semiconductor device with multi-stacking carrier structure

Multi-stacking carrier structure and method for fabricating the same

Method to create MIMcap designs across changing MIMcap structures

3D semiconductor device and structure

Surface modification layer for conductive feature formation

FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE STRUCTURES

CIRCUIT INTERCONNECT STRUCTURE

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

MULTIPORT MEMORY CELLS INCLUDING STACKED ACTIVE LAYERS

THREE-DIMENSIONAL NON-VOLATILE MEMORY DEVICE WITH FILAMENT CONFINEMENT

EMBEDDED MEMORY WITH FERROELECTRIC CAPACITORS & INDEPENDENT TOP PLATE LINES

Semiconductor device and manufacturing method of semiconductor device

INTEGRATED CIRCUIT DEVICE

TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY

REPLACEMENT DEEP VIA AND BURIED OR BACKSIDE POWER RAIL WITH BACKSIDE INTERCONNECT STRUCTURE

BACKSIDE POWER DELIVERY NETWORK AND SIGNAL ROUTING

Semiconductor device for RF integrated circuit

ISO-LEVEL VIAS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

LINE FORMATION WITH SMALL TIP SPACING

BACK-END-OF-LINE THIN FILM RESISTOR

Interconnect structure for logic circuit

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICES WITH A LOW DIELECTRIC CONSTANT

STAGGERED VERTICALLY SPACED INTEGRATED CIRCUIT LINE METALLIZATION WITH DIFFERENTIAL VIAS & METAL-SELECTIVE DEPOSITION

FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASSEMBLED MONOLAYER

Package structure with interposer encapsulated by an encapsulant

BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE

INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS

Configurable metal—insulator—metal capacitor and devices

VIA FORMATION IN AN INTEGRATED CIRCUIT

ISOLATION OF SEMICONDUCTOR DEVICES BY BURIED SEPARATION RAILS

Metallization Process for an Integrated Circuit

INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS

DECOUPLED INTERCONNECTS

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Back end of line nanowire power switch transistors

ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT

Back-end-of-line passive device structure having common connection to ground

Methods of manufacturing semiconductor packages

Package and method of fabricating the same

Memory device

Method and apparatus for electromigration reduction

SEMICONDUCTOR MEMORY DEVICE

Multilayer-type on-chip inductor structure

Apparatuses including device structures including pillar structures

Redistribution substrate, method of fabricating the same, and semiconductor package including the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS

DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS

BARRIER LINER FREE INTERFACE FOR METAL VIA

Through via structure

Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate

VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE

Method and IC design with non-linear power rails

Semiconductor device and a method of manufacturing the same

DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LAYERS

ETCH STOP LAYER FOR BACKSIDE PROCESSING ARCHITECTURE

METHOD FOR FORMING CONTACT STRUCTURE, SEMICONDUCTOR STRUCTURE AND MEMORY

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

Modified top electrode contact for MRAM embedding in advanced logic nodes

Integrated circuit including standard cells, method of manufacturing the integrated circuit, and computing system for performing the method

TOP ELECTRODE TO METAL LINE CONNECTION FOR MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY STACK HEIGHT REDUCTION

Guard Ring Design For Through Via

Semiconductor device including vertical routing structure and method for manufacturing the same

Package structure and method of manufacturing the same

Semiconductor device having integral alignment marks with decoupling features and method for fabricating the same

Semiconductor device and manufacturing method thereof

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

VIA MANUFACTURING METHOD

INTERCONNECT STRUCTURE OF A SEMICONDUCTOR COMPONENT AND METHODS FOR PRODUCING THE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

DELAMINATION CONTROL OF DIELECTRIC LAYERS OF INTEGRATED CIRCUIT CHIPS

BEOL INTERCONNECT SUBTRACTIVE ETCH SUPER VIA

Semiconductor device structure with stacked conductive plugs and method for preparing the same

Etch Back and Film Profile Shaping of Selective Dielectric Deposition

ADVANCED METAL INTERCONNECT

ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE SAME

VIA PROFILE SHRINK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

TOP VIA WITH PROTECTIVE LINER

LINER-LESS VIA CONTACT

SUBTRACTIVE LINE WITH DAMASCENE TOP VIA

Semiconductor device

METHOD OF FORMING LOW-RESISTIVITY RU ALD THROUGH A BI-LAYER PROCESS AND RELATED STRUCTURES

Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR COMPONENT INCLUDING BACK SIDE INPUT/OUTPUT SIGNAL ROUTING

SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELECTRIC DAMAGE, CAPACITANCE, AND RESISTANCE

BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY

Flexible transistors with near-junction heat dissipation

Interconnection Structure for a Semiconductor Device

DUAL-DAMASCENE FAV INTERCONNECTS WITH DIELECTRIC PLUG

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

TESTING STRUCTURE FOR AN INTEGRATED CHIP HAVING A HIGH-VOLTAGE DEVICE

MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLYING DIELECTRIC LAYER

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Semiconductor memory devices and methods for fabricating the same

Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof

Semiconductor device and manufacturing method thereof including a conductive-material etching process to further adjust a via shape

Semiconductor apparatus and equipment

Method of forming semiconductor device including deep vias

STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Partial subtractive supervia enabling hyper-scaling

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE

Wet Cleaning with Tunable Metal Recess for Via Plugs

METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES

Reliability Macros for Contact Over Active Gate Layout Designs

Monitoring copper corrosion in an integrated circuit device

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Vertical memory devices

Four CPP wide memory cell with buried power grid, and method of fabricating same

Dual damascene structure in forming source/drain contacts

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE

Forming Dielectric Film With High Resistance to Tilting

Graphene liners and caps for semiconductor structures

Layouts for conductive layers in integrated circuits

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Interconnect Structures

Stacked field-effect transistors with a shielded output

Semiconductor device with integrated metal-insulator-metal capacitors

CELL HAVING STACKED PICK-UP REGION

Seal ring between interconnected chips mounted on an integrated circuit

Self-aligned contacts

Conductive structures with barriers and liners of varying thicknesses

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

Semiconductor device structure and methods of forming the same

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP

Memory devices including strings of memory cells, and related electronic systems

SEMICONDUCTOR MEMORY DEVICES, ELECTRONIC SYSTEMS INCLUDING THE SAME AND FABRICATING METHODS OF THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Via Structures

Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate

INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETCH PROCESSING

Maskless alignment scheme for BEOL memory array manufacturing

Semiconductor device and fabrication method thereof

MEMORY CELL ARRAY INCLUDING PARTITIONED DUAL LINE STRUCTURE AND DESIGN METHOD THEREOF

DAMASCENE INTERCONNECT SPACER TO FACILITATE GAP FILL

Electronic fuse structure embedded in top via

Contact over active gate structures for advanced integrated circuit structure fabrication

3D NAND flash memory devices, and related electronic systems

Memory arrays and methods used in forming a memory array comprising strings of memory cells

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS

3D NAND MEMORY DEVICE AND FORMING METHOD THEREOF

Method for preparing semiconductor device structure with silicide portion between conductive plugs

Preparation method for leads of semiconductor structure, and semiconductor structure

DUMMY PATTERN STRUCTURE FOR REDUCING DISHING

Semiconductor device structure with stacked conductive plugs and method for preparing the same

Semiconductor structures and methods of forming the same

Integrated circuit device and method of manufacturing the same

Logic drive based on standardized commodity programmable logic semiconductor IC chips

DUAL DAMASCENE FULLY-ALIGNED VIA INTERCONNECTS WITH DUAL ETCH LAYERS

Power delivery for embedded bridge die utilizing trench structures

Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory Cells, And Method Of Forming Integrated Circuitry

SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION

SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SPACING

INTERCONNECT SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR APPARATUS

FULLY-ALIGNED AND DIELECTRIC DAMAGE-LESS TOP VIA INTERCONNECT STRUCTURE

Three-dimensional memory device having staircase structure and method for forming the same

INTERCONNECTS WITH LINER THAT RESONATES DURING MICROWAVE ANNEAL

Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer

Semiconductor device with early buried power rail (BPR) and backside power distribution network (BSPDN)

Semiconductor device and layout method of the same

GATE LINE PLUG STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Localized high density substrate routing

Skip level vias in metallization layers for integrated circuit devices

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Integrated inductor with inductor wire formed in an integrated circuit layer stack

INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR ELEMENT

HIGH ASPECT RATIO VIA FILL PROCESS EMPLOYING SELECTIVE METAL DEPOSITION AND STRUCTURES FORMED BY THE SAME

SEMICONDUCTOR DEVICE WITH POLYGONAL INDUCTIVE DEVICE

FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

DIFFUSION PREVENTION SPACER

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

DEVICES INCLUDING CAPACITOR COUPLING POWER PATH TO GROUND PATH AND ASSOCIATED COMPONENTS AND SYSTEMS

Interconnect including integrally formed capacitor

Semiconductor device including interconnection structure including MXene and method of manufacturing the same

3D RAM SL/BL contact modulation

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect

Integrated circuit and method of generating integrated circuit layout

Memory device, semiconductor device, and manufacturing method thereof

Interconnect substrate having groove around pad

Device layout design for improving device performance

COPPER INTERCONNECTS WITH AN EMBEDDED DIELECTRIC CAP BETWEEN LINES

Semiconductor device, circuit board structure and manufacturing method thereof

Semiconductor memory device and erasing method of the semiconductor memory device

CONVERTIBLE INTERCONNECT BARRIER

NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing a semiconductor device

HYBRID METHOD FOR FORMING SEMICONDUCTOR INTERCONNECT STRUCTURE

LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMPERATURES IN MICROELECTRONICS

Semiconductor structure with a bit line in a different configuration than a local interconnect line

Etch method for opening a source line in flash memory

Memory device including multiple decks of memory cells and pillars extending through the decks

Fin Field Effect Transistor (FinFET) Device Structure with Interconnect Structure

TOP VIA STRUCTURE MADE WITH BI-LAYER TEMPLATE

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Structure And Method For Finfet Device With Contact Over Dielectric Gate

Integrated circuit, system and method of forming the same

Semiconductor device and method for manufacturing same

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Methods for forming conductive vias, and associated devices and systems

Middle-end-of-line strap for standard cell

PIC die with optical deflector for ambient light

Mobile casino jackpot payment reporting system with secure form reporting to customer

Semiconductor device and semiconductor package

RECESSED VERTICAL INTERCONNECTS FOR DEVICE MINIATURIZATION

Metal capping layer and methods thereof

Strap-cell architecture for embedded memory

Inverted integrated circuit and method of forming the same

Semiconductor device with multiple polarity groups

Semiconductor device with airgap spacer formation from backside of wafer

3D CIRCUIT STRUCTURE WITH STAIRSTEP CONTACT CONFIGURATION

Method for forming photonic integrated package

Semiconductor device having a carbon containing insulation layer formed under the source/drain

Integrated circuits (ICs) employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related methods

GALLIUM NITRIDE TRANSISTORS WITH RELIABILITY ENHANCEMENTS

Structures for Three-Dimensional CMOS Integrated Circuit Formation

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES

Integrated circuit packages with ring-shaped substrates

Semiconductor device and method forming the same

LOW VERTICAL RESISTANCE SINGLE DAMASCENE INTERCONNECT

Middle-end-of-line strap for standard cell

Semiconductor device

INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTERFACES FOR LOW RESISTANCE VIAS IN INTEGRATED CIRCUITS

Staircase formation in three-dimensional memory device

Self-aligned contacts in three-dimensional memory devices and methods for forming the same

Semiconductor device

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

SIMULTANEOUS FILLING OF VARIABLE ASPECT RATIO SINGLE DAMASCENE CONTACT TO GATE AND TRENCH VIAS WITH LOW RESISTANCE BARRIERLESS SELECTIVE METALLIZATION

Wire bond damage detector including a detection bond pad over a first and a second connected structures

Dual color via patterning

Buried power rails located in a base layer including first, second, and third etch stop layers

SEMICONDUCTOR DEVICE

ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC

Subtractive Skip-Level Power via Adjacent Recessed Damascene Signal Lines

Manufacturing method of active device substrate

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

Methods of forming microelectronic devices

SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS

Capping layer for liner-free conductive structures

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF

Top via process with damascene metal

GLASS SUBSTRATES HAVING PARTIALLY EMBEDDED CONDUCTIVE LAYERS FOR POWER DELIVERY IN SEMICONDUCTOR PACKAGES AND RELATED METHODS

CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor devices

Semiconductor structure with doped via plug

Gate contact inside gate cut trench

Backside electrical contacts to buried power rails

Electronic Package with Components Mounted at Two Sides of a Layer Stack

3D MEMORY DEVICE

Semiconductor package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Standard cell design architecture for reduced voltage droop utilizing reduced contacted gate poly pitch and dual height cells

Semiconductor devices and methods of manufacturing