SEMICONDUCTOR DEVICE

Interconnect structure in semiconductor device and method of forming the same

Semiconductor device having inter-metal dielectric patterns and method for fabricating the same

Semiconductor device with composite passivation structure and method for preparing the same

Semiconductor device and method for manufacturing same

Assemblies containing PMOS decks vertically-integrated with NMOS decks, and methods of forming integrated assemblies

Semiconductor device and fabrication method thereof

METHOD FOR GENERATING A LAYOUT DIAGRAM OF A SEMICONDUCTOR DEVICE INCLUDING POWER-GRID-ADAPTED ROUTE-SPACING

Low resistance crosspoint architecture

Semiconductor device and manufacturing method thereof

Semiconductor device

Three-dimensional semiconductor device including a connection pattern connecting a source channel and a vertical channel

Semiconductor storage device

Memory device

Memory device including multiple decks of memory cells and pillars extending through the decks

Three-dimensional memory device with vertical field effect transistors and method of making thereof

Methods for forming on-chip capacitor structures in semiconductor devices

ON-CHIP CAPACITOR STRUCTURES IN SEMICONDUCTOR DEVICES

Three-dimensional NAND memory device and method of forming the same

Semiconductor device

Semiconductor memory device

Embedded reference layers for semiconductor package substrates

Microelectronic devices including stair step structures, and related electronic systems and methods

Applications of buried power rails

Semiconductor package and method of manufacturing the semiconductor package

Different scaling ratio in FEOL / MOL/ BEOL

Semiconductor device

Wiring substrate and manufacturing method thereof

Semiconductor memory device and manufacturing method of the semiconductor memory device

Semiconductor apparatus and method of making the same

Semiconductor devices and methods for manufacturing the same

Semiconductor storage device with insulating layers for etching stop

SEMICONDUCTOR STORAGE DEVICE

METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Electronic package, manufacturing method for the same, and electronic structure

Integrated circuitry and method used in forming a memory array comprising strings of memory cells

Semiconductor structure and method for forming the same

Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape

Semiconductor device and manufacturing method thereof

Plug and trench architectures for integrated circuits and methods of manufacture

METAL INTERCONNECT WRAP AROUND WITH GRAPHENE

Measuring device, measuring method, and semiconductor storage device

Antenna module

Nonvolatile memory device and method for fabricating the same

Three-dimensional semiconductor memory device

Word line structure of three-dimensional memory device

Methods of forming microelectronic devices and memory devices

Methods of forming microelectronic devices and memory devices, and related microelectronic devices, memory devices, and electronic systems

MEMORY CELL WITH OFFSET INTERCONNECT VIA

Method for preparing semiconductor memory device with air gaps between conductive features

Method for preparing semiconductor device with metal plug having rounded top surface

DRAM chiplet structure and method for manufacturing the same

Three-dimensional memory device including contact via structures for multi-level stepped surfaces and methods for forming the same

Method for fabricating semiconductor device with alleviation feature

Electronic apparatus including antennas and directors

Semiconductor device including plurality of patterns

Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via

Semiconductor device

Power rails for stacked semiconductor device

Method for preparing semiconductor device structure with air gap

Heterojunction bipolar transistor and method for forming the same

Common rail contact

Semiconductor memory device

Nonvolatile memory device including erase transistors

ARCHITECTURE FOR MONOLITHIC 3D INTEGRATION OF SEMICONDUCTOR DEVICES

Semiconductor package with under-bump metal structure

Microelectronic devices including conductive structures, and related methods

Semiconductor devices and electronic systems including the same

Microelectronic devices including conductive rails, and related methods

Three-dimensional memory device with dielectric isolated via structures and methods of making the same

Package structure and method of manufacturing the same

Interconnects including dual-metal vias

Via contact patterning method to increase edge placement error margin

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Field effect transistor devices with self-aligned source/drain contacts and gate contacts positioned over active transistors

Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems

Semiconductor device and method

Integrated circuit devices and methods of manufacturing the same

Channel hole and bitline architecture and method to improve page or block size and performance of 3D NAND

3D NAND memory device and method of forming the same

SEMICONDUCTOR MEMORY DEVICE

Three-dimensional memory device including a composite semiconductor channel and a horizontal source contact layer and method of making the same

Three-dimensional memory device including a composite semiconductor channel and a horizontal source contact layer and method of making the same

Three-dimensional memory device with double-sided stepped surfaces and method of making thereof

Three-dimensional memory device with high mobility channels and nickel aluminum silicide or germanide drain contacts and method of making the same

Nonvolatile memory device and method for fabricating the same

Semiconductor memory device

Semiconductor storage device

Thin film transistor based memory cells on both sides of a layer of logic devices

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME

Chip protected against back-face attacks

Methods for fabricating microelectronic devices with contacts to conductive staircase steps, and related devices and systems

Three-dimensional memory device including bump-containing bit lines and methods for manufacturing the same

Integrated circuit devices including metal wires having etch stop layers on sidewalls thereof

Semiconductor device and fabrication method for the same

Conductive interconnects

Low cost three-dimensional stacking semiconductor assemblies

Memory arrays and methods used in forming a memory array

Encapsulated top via interconnects

Conductive via of integrated circuitry, memory array comprising strings of memory cells, method of forming a conductive via of integrated circuitry, and method of forming a memory array comprising strings of memory cells

Multilayer light detecting device and electronic apparatus

Methods of etching metals in semiconductor devices

Structure and Method for MRAM Devices with a Slot Via

Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films

Transistor semiconductor die with increased active area

Three-dimensional memory device and method

Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent thereto

NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor devices

Semiconductor structure and forming method thereof

Integrated circuit device, method, layout, and system

Semiconductor package

Vias in composite IC chip structures

Carrier, assembly with a carrier, and method for producing a carrier

Memory cell array, semiconductor device including the same, and manufacturing method thereof

Integrated circuit cells and related methods

Semiconductor device and semiconductor package including penetration via structure

Semiconductor device

Spacers for semiconductor devices including backside power rails

Semiconductor memory device

Three-dimensional memory device with word lines extending through sub-arrays, semiconductor device including the same and method for manufacturing the same

Vertical memory devices

Three-dimensional memory device with increased memory cell density

Three-dimensional memory device with punch-through-resistant word lines and methods for forming the same

3D semiconductor device and structure

Method of making an individualization zone of an integrated circuit

Method of making an individualization zone of an integrated circuit

Bottom barrier free interconnects without voids

Ruthenium liner and cap for back-end-of-line applications

Top via interconnect having a line with a reduced bottom dimension

Placing top vias at line ends by selective growth of via mask from line cut dielectric

Top via stack

Semiconductor device, an image unit and an endoscope system

Multilevel interconnection structure and method for forming the same

Semiconductor device structure and methods of forming the same

SEMICONDUCTOR STRUCTURE

Memory arrays and methods used in forming a memory array comprising strings of memory cells

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor apparatus

Three-dimensional memory device and method

Semiconductor memory device and production method thereof

Three-dimensional memory device and manufacturing method thereof

Semiconductor structure

Layout designs of integrated circuits having backside routing tracks

Semiconductor device and in-vehicle electronic control device using the same

Graphene-assisted low-resistance interconnect structures and methods of formation thereof

INDUCTOR DEVICE WIRING ARCHITECTURE, INTEGRATED CIRCUIT, AND COMMUNICATIONS DEVICE

Fully aligned via for interconnect

Semiconductor device and method of manufacturing the same

Slit oxide and via formation techniques

Semiconductor device and metal-oxide-semiconductor capacitor structure

Semiconductor device including an input/output circuit

Embedded die packaging for power semiconductor devices

DOUBLE-SIDE BACK-END-OF-LINE METALLIZATION FOR PSEUDO THROUGH-SILICON VIA INTEGRATION

Interconnection element and method of manufacturing the same

Contact plug structure and manufacturing method thereof

Partial wrap around top contact

Via configurable edge-combiner with duty cycle correction

Semiconductor memory device

Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof

Package and method of fabricating the same

Semiconductor device having a graphene film and method for fabricating thereof

3D NAND memory device and method of forming the same

Semiconductor device and method of manufacturing the same

Interconnect structures

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

Semiconductor package

Method for manufacturing an anchor-shaped backside via

Semiconductor device package and method of manufacturing the same

Integrated assemblies having conductive-shield-structures between linear-conductive-structures

Assemblies having conductive interconnects which are laterally and vertically offset relative to one another

Three-dimensional memory device and fabrication method thereof

Three-dimensional memory device including stairless word line contact structures for and method of making the same

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Semiconductor device and method for fabricating the same

Semiconductor memory device

Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same

Semiconductor memory device

Semiconductor device

Metal via structure

Top via with next level line selective growth

SEMICONDUCTOR DIE WITH CONVERSION COATING

Three-dimensional semiconductor memory devices

Semiconductor structure and method of forming the same

Semiconductor structure

Top via with damascene line and via

ETCH STOP LAYER REMOVAL FOR CAPACITANCE REDUCTION IN DAMASCENE TOP VIA INTEGRATION

Connector via structures for nanostructures and methods of forming the same

Memory arrays and methods used in forming a memory array comprising strings of memory cells

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Spacerless source contact layer replacement process and three-dimensional memory device formed by the process

Semiconductor memory device and method of manufacturing the semiconductor memory device

Semiconductor device

Four CPP wide memory cell with buried power grid, and method of fabricating same

3D semiconductor device and structure

Multi-bit structure

Device including first structure having peripheral circuit and second structure having gate layers

VIA WIRING FORMATION SUBSTRATE, MANUFACTURING METHOD FOR VIA WIRING FORMATION SUBSTRATE, AND SEMICONDUCTOR DEVICE MOUNTING COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Passive component embedded in an embedded trace substrate (ETS)

Semiconductor package structure and method of manufacturing the same

Multi-height and multi-width interconnect line metallization for integrated circuit structures

Semiconductor devices and methods of forming semiconductor devices

SEMICONDUCTOR MEMORY DEVICE

Package component, semiconductor package and manufacturing method thereof

High-throughput additively manufactured power delivery vias and traces

Halogen treatment for NMOS contact resistance improvement

Semiconductor device including liner structure

Air gaps in memory array structures

Control gate strap layout to improve a word line etch process window

Memory device and method of forming the same

Memory devices

Memory device

Vertical memory devices having support structures to replace dummy channels and methods of manufacturing the same

Three-dimensional semiconductor memory device with vertical structures between contact plugs

Microelectronic devices including a varying tier pitch, and related electronic systems and methods

Memory cell structure of a three-dimensional memory device

Microelectronic devices, and related methods, memory devices, and electronic systems

Memory cells with ferroelectric capacitors separate from transistor gate stacks

Memory device

Methods of forming semiconductor structure

Integration of multiple discrete GaN devices

Semiconductor memory device

Semiconductor structure with a contact to source/drain layers and fabrication method thereof

Semiconductor device with contact structure

Transistor and fabrication method thereof

Protection liner on interconnect wire to enlarge processing window for overlying interconnect via

Microelectronic devices and electronic systems

Metal-Insulator-Metal structure

Manufacturing method of three-dimensional semiconductor device including contact plugs

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, electronic systems, and additional methods

Semiconductor structure and forming method thereof

Dumbbell shaped self-aligned capping layer over source/drain contacts and method thereof

Epitaxial source/drain feature with enlarged lower section interfacing with backside via

Structure and method for forming integrated high density MIM capacitor

Magnetic memory devices

Three-dimensional memory devices with drain select gate cut and methods for forming the same

Three-dimensional memory device including multi-tier moat isolation structures and methods of making the same

Semiconductor memory device

SEMICONDUCTOR DEVICE

Diffusion barrier for semiconductor device and method

Package structure and method of fabricating the same

Self-aligned cavity strucutre

Three-dimensional semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

Microelectronic devices including staircase structures, and related memory devices and electronic systems

E-fuse with dielectric zipping

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device including capacitor and resistor

Interconnect structure and manufacturing method for the same

Extended via semiconductor structure and device

Via structures for use in semiconductor devices

MIMCAP architecture

Thermally enhanced silicon back end layers for improved thermal performance

Fully self-aligned subtractive etch

Interconnect structure and manufacturing method for the same

Metal capping layer and methods thereof

BioFET and method of manufacturing the same

Systems and methods for fabrication of superconducting integrated circuits

SEMICONDUCTOR DEVICE

Field plate structure to enhance transistor breakdown voltage

Vertical memory devices

SEMICONDUCTOR STORAGE DEVICE

Semiconductor device

Integrated circuit device and fabrication method thereof

Semiconductor device and semiconductor package including the same

Semiconductor device and manufacturing method thereof

Advanced node interconnect routing methodology

Staircase structure in three-dimensional memory device and method for forming the same

Well-controlled edge-to-edge spacing between adjacent interconnects

Method of forming semiconductor device including deep vias

Semiconductor packages and methods of forming same

Method of forming a semiconductor device with inter-layer vias

Staircase structure in three-dimensional memory device and method for forming the same

Method for manufacturing semiconductor structure same

Semiconductor device and a manufacturing method thereof

Method of fabricating redistribution circuit structure

Fully self-aligned interconnect structure

Semiconductor structure and forming method thereof

Etchant for selectively etching copper and copper alloy, and method for manufacturing semiconductor substrate using said etchant

Semiconductor device and manufacturing method thereof

Dielectric fins with air gap and backside self-aligned contact

Semiconductor structure and method of forming the same

3D RAM SL/BL contact modulation

Methods for forming three-dimensional memory devices

Three-dimensional memory device containing III-V compound semiconductor channel and contacts and method of making the same

Three-dimensional memory device containing III-V compound semiconductor channel and contacts and method of making the same

Integrated circuit device including vertical memory device

Microelectronic devices including two-dimensional materials, and related memory devices and electronic systems

Semiconductor chip

Semiconductor device, memory array and method of forming the same

Method of fabricating semiconductor device

Static random access memory device

Integrated circuit device, system and method

Composite IC chips including a chiplet embedded within metallization layers of a host IC chip

Method for fabricating an integrated circuit device

Semiconductor arrangement and method of making

Corner structures for an optical fiber groove and manufacturing methods thereof