Mixed wire structure and method of making the same

Interconnection structure and method for manufacturing same

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING BOTH SIDE PLATING

Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device

Method and apparatus for designing interconnection structure and method for manufacturing interconnection structure

Metal oxide semiconductor device of an integrated circuit

Systems, methods, and apparatuses for implementing a high mobility low contact resistance semiconducting oxide in metal contact vias for thin film transistors

Isolation of circuit elements using front side deep trench etch

3D semiconductor wafer, devices, and structure

Data storage system using wafer-level packaging

Fan-out antenna packaging structure and method making the same

Integrated circuit comprising an antifuse structure and method of realizing

Forming self-aligned vias and air-gaps in semiconductor fabrication

Semiconductor device and fingerprint sensor device thereof

Manufacturing techniques and devices for magnetic tunnel junction devices

Epitaxial source or drain structures for advanced integrated circuit structure fabrication

Gate line plug structures for advanced integrated circuit structure fabrication

Replacement gate structures for advanced integrated circuit structure fabrication

Phase change memory devices with enhanced vias

Electrostatic discharge circuit and manufacturing method therefor, and display apparatus

Nonvolatile memory device having a vertical structure and a memory system including the same

Dual metal gate structures for advanced integrated circuit structure fabrication

Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication

Structure with embedded memory device and contact isolation scheme

Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods

Microstructure modulation for metal wafer-wafer bonding

3D stacked dies with disparate interconnect footprints

Pad structure and manufacturing method thereof in semiconductor device

Seal ring for hybrid-bond

Seal ring structure, semiconductor die, and method for detecting cracks on semiconductor die

Package structure including at least one connecting module and manufacturing method thereof

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Semiconductor devices including a first cobalt alloy in a first barrier layer and a second cobalt alloy in a second barrier layer

PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Via sizing for IR drop reduction

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Interconnect structures and methods of forming the same

Semiconductor device with polygonal inductive device

BEOL integration with advanced interconnects

Middle-end-of-line strap for standard cell

Integrated circuit package substrate

Semiconductor device and method for manufacturing the same

Dual metal silicide structures for advanced integrated circuit structure fabrication

Prevention of contact bottom void in semiconductor fabrication

Trench plug hardmask for advanced integrated circuit structure fabrication

Fin cut and fin trim isolation for advanced integrated circuit structure fabrication

Semiconductor device, interconnection structure and method for forming the same

Semiconductor device with TiN adhesion layer for forming a contact plug

Etch-stop layer topography for advanced integrated circuit structure fabrication

Plugs for interconnect lines for advanced integrated circuit structure fabrication

Continuous gate and fin spacer for advanced integrated circuit structure fabrication

Trench isolation for advanced integrated circuit structure fabrication

Method for forming interconnect structure

Contact over active gate structures for advanced integrated circuit structure fabrication

Synaptic crossbar memory array

Electromigration test structures for void localization

Electronic device and method of fabricating the same

Hybrid bonded structure

3D circuit transistors with flipped gate

Vertical semiconductor devices

Integrated circuit memory devices having impurity-doped dielectric regions therein and methods of forming same

Three-dimensional memory devices and fabricating methods thereof

Method of manufacturing a semiconductor device

Drive integrated circuit and display device including the same

Semiconductor structure and method of forming

Semiconductor device

Layer structure including diffusion barrier layer and method of manufacturing the same

Layer structure including diffusion barrier layer and method of manufacturing the same

Structural enhancement of Cu nanowires

Interconnect structures with fully aligned vias

Interconnects having long grains and methods of manufacturing the same

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Semiconductor device, layout design method for the same and method for fabricating the same

Semiconductor structure with doped via plug and method for forming the same

Process integration approach of selective tungsten via fill

Interconnect structure and method of forming the same

Multi-channel transistor including an asymmetrical source/drain contact

Three-dimensional memory device with thickened word lines in terrace region and method of making thereof

Interconnect apparatus and method for a stacked semiconductor device

Three-dimensional memory device with thickened word lines in terrace region

Pillar-shaped semiconductor device and method for producing the same

Semiconductor devices

Vertical transistors with different gate lengths

Semiconductor device including vertical routing structure and method for manufacturing the same

Integrated circuit and method of generating integrated circuit layout

Semiconductor packages

Semiconductor device with post passivation structure

Circuit substrate

Low aspect ratio interconnect

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

Patterning approach for improved via landing profile

Semiconductor devices

Semiconductor device with damascene structure

Two-Dimensional Via Pillar Structures

Semiconductor device

Semiconductor device and method of manufacture

Via structure and methods thereof

Semiconductor packages including routing dies and methods of forming same

Semiconductor package and method

Semiconductor device and manufacturing method thereof

Gate contact structures and cross-coupled contact structures for transistor devices

Plated metallization structures

Integrated circuit devices and method of manufacturing the same

Fin field effect transistor (finFET) device structure with protection layer and method for forming the same

Patterning methods for semiconductor devices and structures resulting therefrom

Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects

Atomic layer deposition based process for contact barrier layer

Insulator, capacitor with the same and fabrication method thereof, and method for fabricating semiconductor device

Cell contact

Apparatus for high speed ROM cells

Method for forming an aligned mask

Wafer level packaging for MEMS device

Semiconductor device

Electronic device

Stacked LED structure and associated manufacturing method

Wireless module with antenna package and cap package

Embedded resistor-capacitor film for fan out wafer level packaging

Method for forming semiconductor device structure with conductive line

Construction of integrated circuitry and a method of forming an elevationally-extending conductor laterally between a pair of structures

Vertically oriented metal silicide containing e-fuse device and methods of making same

Integrated fan-out package and manufacturing method thereof

Lossy MIM capacitor for on-die noise reduction

Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication and structures resulting therefrom

Package structure with porous conductive structure and manufacturing method thereof

Memory device and method for fabricating the same

Package structure having a plurality of insulating layers

Semiconductor device package with patterned conductive layers and an interconnecting structure

Semiconductor device and method for manufacturing the same

METHODS OF FORMING CONDUCTIVE LINES AND VIAS AND THE RESULTING STRUCTURES

Semiconductor device and manufacturing method thereof

Methods of manufacturing semiconductor devices

Multi-barrier deposition for air gap formation

Structure and formation method of semiconductor device with resistive elements

Semiconductor interconnect structure having graphene-capped metal interconnects

Via-hole connection structure and method of manufacturing the same, and array substrate and method of manufacturing the same

Systems and methods for a sequential spacer scheme

Die stack structure with hybrid bonding structure and method of fabricating the same and package

Optical semiconductor package and method for manufacturing the same

Integrated fan-out package and manufacturing method thereof

Seal ring for bonded dies

Semiconductor structure and manufacturing method thereof

Thermally isolated ground planes with a superconducting electrical coupler

Forming interlayer dielectric material by spin-on metal oxide deposition

Semiconductor device having a multilayer wiring structure

Semiconductor device with barrier layer

Method of fabricating integrated fan-out packages

External connection pad for semiconductor device package

Fan-out semiconductor package

Heterojunction semiconductor device for reducing parasitic capacitance

Integration of single crystalline transistors in back end of line (BEOL)

Semiconductor devices including contact plugs

Stairstep structures in multilevel circuitry, and method for forming the same

Fan-out semiconductor package

Filter component having ESD protection function

Semiconductor device and manufacturing method thereof

Resistive memory array and fabricating method thereof

Variable resistance memory devices

Three-dimensional memory devices and fabricating methods thereof

Method for producing a pillar-shaped semiconductor memory device

Tri-layer COWOS structure

Semiconductor structure

Integrated circuits including via array and methods of manufacturing the same

Stair contact structure, manufacturing method of stair contact structure, and memory structure

Via blocking layer

Fan-out interconnect integration processes and structures

Semiconductor die contact structure and method

Electronic apparatus including antennas and directors

Structures and methods for heat dissipation of semiconductor devices

Self-aligned nanowire formation using double patterning

Self-forming barrier process

Contact hole structure and method of fabricating the same

Semiconductor device including a passivation spacer and method of fabricating the same

Array substrate with auxiliary gate metal pattern for common electrode connection and method for manufacturing the same, touch display panel and touch display device

Reduced capacitance coupling effects in devices

Nonvolatile memory device including row decoder

Semiconductor device

Method and structure for semiconductor mid-end-of-year (MEOL) process

Conductive vias in semiconductor packages and methods of forming same

Systems and methods to enhance passivation integrity

Gate contact structure over active gate and method to fabricate same

Semiconductor device having engineering change order (ECO) cells

Method of using a chip identification device

Electrically-verifiable fuses and method of fuse verification

Fin-based strap cell structure

High voltage resistor device

RRAM memory cell with multiple filaments

Method for producing pillar-shaped semiconductor device

Semiconductor structure and method for manufacturing the same

Seal-ring structure for stacking integrated circuits

Microelectronic packages with high integration microelectronic dice stack

Semiconductor apparatus and method for preparing the same

Method and apparatus for forming backside die planar devices and saw filter

Logic cell including deep via contact and wiring layers located at different levels

Method of manufacturing semiconductor device with multi wire structure

Redistribution layer layouts on integrated circuits and methods for manufacturing the same

Methods of forming conductive contact structures to semiconductor devices and the resulting structures

Composite contact plug structure and method of making same

Flying and twisted bit line architecture for dual-port static random-access memory (DP SRAM)

Method of reconfiguring uncrowned standard cells and semiconductor apparatus including uncrowned and crowned cells

Image sensing apparatus and manufacturing method thereof

Manufacturing method of semiconductor package

Method for forming at least one electrical discontinuity in an integrated circuit, and corresponding integrated circuit

Ruthenium metal feature fill for interconnects

Semiconductor device

Redistribution structures in semiconductor packages and methods of forming same

Fin Field-Effect Transistor device and method of forming the same

Interconnect structures

Methods of forming semiconductor devices using multiple planarization processes

Method of forming an integrated circuit

Composite device

Semiconductor device and a method for fabricating the same

Semiconductor device and method for manufacturing semiconductor device

Local interconnect structure

Three-dimensional memory devices, and related methods and electronic systems

Semiconductor device and method of fabricating the same

Memory cell structure of a three-dimensional memory device

Memory device having a plurality of first conductive pillars penetrating through a stacked film

Semiconductor device having an inter-layer via (ILV), and method of making same

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device including electrostatic discharge protection patterns

Integrated circuit, system for and method of forming an integrated circuit

Method of fabricating integrated circuit having staggered conductive features

Integrated circuit having a high cell density

Substrate-less stackable package with wire-bond interconnect

Integrated fan-out package and method of fabricating the same

Semiconductor device with interconnecting structure and method for manufacturing the same

MIM structure

Tapering discrete interconnection for an integrated circuit (IC)

Via architecture for increased density interface

Dense redistribution layers in semiconductor packages and methods of forming the same

Thin film interconnects with large grains

Etch profile control of interconnect structures

Via patterning using multiple photo multiple etch

Interconnect structures and methods for forming same

Stacked chip layout and method of making the same

Semiconductor device

Semiconductor memory

Multi-layer wiring structure, method for manufacturing multi-layer wiring structure, and semiconductor device

Semiconductor devices

Integrated circuits with standard cell

Integrated circuits with standard cell

Laterally extended conductive bump buffer

Semiconductor die bond pad with insulating separator

Semiconductor device

Seam healing of metal interconnects

Semiconductor device and manufacturing method thereof

Memory device

Fan out package structure and method of manufacturing the same

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device and a method of manufacturing the same

Scalable circuit-under-pad device topologies for lateral GaN power transistors

Semiconductor memory devices

Semiconductor memory device

Method of processing a substrate and a device manufactured by using the method

Integrated structures and methods of forming vertically-stacked memory cells

Semiconductor memory device

Memory device

Three-dimensional NAND memory device with source line comprising metallic and semiconductor layers

Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent thereto

Semiconductor device and manufacturing method of semiconductor device

Dielectric film forming composition

Semiconductor device and manufacturing method of the same

Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via

Structure, method and system for measuring RIE lag depth

Dielectric film forming composition

Wiring with external terminal

SEMICONDUCTOR MEMORY DEVICE AND PRODUCTION METHOD THEREOF

Flash memory structure with reduced dimension of gate structure

Manufacturing method for semiconductor structure

Methods of producing self-aligned vias

Semiconductor device

RRAM memory cell with multiple filaments

Semiconductor device including stack structure and trenches

Interconnect structure of three-dimensional memory device

Semiconductor device

Semiconductor device and method for manufacturing the same

Memory array circuit and method of manufacturing the same

SRAM structure with alternate gate pitches

PoP device and method of forming the same

Semiconductor device

Integrated circuit component package and method of fabricating the same

Methods and structures for mitigating ESD during wafer bonding

Semiconductor devices and semiconductor dice including electrically conductive interconnects between die rings

Trench structure and method

Interconnect structure for semiconductor device and methods of fabrication thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Interconnect structure for semiconductor device and methods of fabrication thereof

Layout technique for middle-end-of-line

Interconnect structure with insulation layer and method of forming the same

Structure and formation method of semiconductor device with self-aligned conductive features

Semiconductor device and layout design thereof

Interconnect structure

Semiconductor device and method for manufacturing the same

Interconnect structure for fin-like field effect transistor

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Methods of producing self-aligned grown via

Methods of producing self-aligned vias

Method and IC design with non-linear power rails