Etching to reduce line wiggling

Vias for cobalt-based interconnects and methods of fabrication thereof

Interconnect structure and method of forming the same

Structure and formation method of interconnection structure of semiconductor device

Fence structure to prevent stiction in a MEMS motion sensor

Hybrid bonding contact structure of three-dimensional memory device

Self aligned active trench contact

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor package structure and manufacturing method thereof

Interposer test structures and methods

Semiconductor device including contact structure

Word line decoder circuitry under a three-dimensional memory array

Power supply wiring in a semiconductor memory device

Overlay mark structures

MONOLITHIC INTEGRATION TECHNIQUES FOR FABRICATING PHOTODETECTORS WITH TRANSISTORS ON SAME SUBSTRATE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Memory devices

Logic drive based on standardized commodity programmable logic semiconductor IC chips

Semiconductor device and method of producing semiconductor device

Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor

Semiconductor device including dummy contact

Semiconductor device and method of manufacturing the same

METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACITOR CAPACITANCE DENSITY FOR WAFER LEVEL PACKAGING

Advanced metal connection with metal cut

Self-aligned contacts

Quantum dot devices with fine-pitched gates

Multi-spacers for quantum dot device gates

Semiconductor device and method of manufacturing the same

Word line structure of three-dimensional memory device

Through array contact structure of three-dimensional memory device

Wordline bridge in a 3D memory array

THREE-DIMENSIONAL (3D) MEMORY WITH CONTROL CIRCUITRY AND ARRAY IN SEPARATELY PROCESSED AND BONDED WAFERS

Manufacturability (DFM) cells in extreme ultra violet (EUV) technology

Metal-nitride-free via in stacked memory

METHOD OF MANUFACTURING CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

Etch stop layer in integrated circuits

Semiconductor devices

Semiconductor device

Method of manufacturing an electronics package using device-last or device-almost last placement

Semiconductor structure and method for fabricating the same

Semiconductor package having a variable redistribution layer thickness

Split probe pad structure and method

Chemoepitaxy etch trim using a self aligned hard mask for metal line to via

Package structure and method of fabricating the same

Thin-film negative differential resistance and neuronal circuit

Thin-film negative differential resistance and neuronal circuit

Method of processing a substrate and a device manufactured by using the method

Vertical memory devices

Semiconductor devices

Vertical-type memory device

Semiconductor device and method of manufacturing the same

METAL LAYERS FOR A THREE-PORT BIT CELL

Semiconductor device

Package on antenna package

Line structure and a method for producing the same

Interconnect structure and method

Interconnect structure

Device and package structure

Semiconductor package with programmable signal routing

INTEGRATED ELECTRONIC DEVICE WITH A REDISTRIBUTION REGION AND A HIGH RESILIENCE TO MECHANICAL STRESSES

Integrated electronic device with a redistribution region and a high resilience to mechanical stresses and method for its preparation

Semiconductor device extension insulation

Method for making semiconductor structure having MIS contact

Semiconductor device and manufacturing method thereof

Self-aligned via below subtractively patterned interconnect

Enhanced active and passive devices for radio frequency (RF) process and design technology

Three-dimensional semiconductor device

Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same

Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same

System on integrated chips and methods of forming same

Semiconductor device

Semiconductor package and method of manufacturing the same

Vertical interconnects for self shielded system in package (SiP) modules

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC)

Interconnect structures for a security application

Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and method

Interconnection structure of semiconductor device

Method of Using a Barrier-Seed Tool for Forming Fine Pitched Metal Interconnects

Interconnect structure

Via and skip via structures

Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device resistor including vias and multiple metal layers

Device and method for a thin film resistor using a via retardation layer

Semiconductor Chip Having Region Including Gate Electrode Features Formed In Part from Rectangular Layout Shapes on Gate Horizontal Grid and First-Metal Structures Formed In Part from Rectangular Layout Shapes on First-Metal Vertical Grid

Passivation scheme for pad openings and trenches

Electronic device and manufacturing method of electronic device

System on integrated chips and methods of forming the same

Semiconductor device with through silicon via structure and method for manufacturing the same

Liner recess for fully aligned via

Semiconductor device

3D semiconductor device and structure

APPROACHES FOR INTEGRATING STT-MRAM MEMORY ARRAYS INTO A LOGIC PROCESSOR AND THE RESULTING STRUCTURES

Integrated circuit device and method of manufacturing the same

PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION CHIP AND DRIVE CHIP

Embedded die package multichip module

Hybrid dielectric scheme for varying liner thickness and manganese concentration

Semiconductor device and manufacturing method thereof

Metal-insulator-metal capacitors with dielectric inner spacers

INTERCONNECTS FORMED WITH STRUCTURALLY-MODIFIED CAPS

Three-dimensional semiconductor device and method of fabricating the same

Method for manufacturing fully aligned via structures having relaxed gapfills

3D semiconductor device and structure

Layouts for connecting contacts with metal tabs or vias

Apparatus comprising a semiconductor arrangement

PACKAGING STRUCTURE AND PACKAGING METHOD OF MEMS CHIP AND ASIC CHIP

Semiconductor device with multi-layered source/drain regions having different dopant concentrations and manufacturing method thereof

Heterojunction semiconductor device for reducing parasitic capacitance

High voltage resistor device

3D static RAM core cell having vertically stacked structure, and static RAM core cell assembly comprising same

Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same

Semiconductor device and method for manufacturing same

Three-dimensional memory device containing hydrogen diffusion barrier layer for CMOS under array architecture and method of making thereof

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor device with over pad metal electrode and method for manufacturing the same

Semiconductor device with shielding structure for cross-talk reduction

Structure and method for improving high voltage breakdown reliability of a microelectronic device

Semiconductor package with cavity

Metallization lines on integrated circuit products

Methods of forming interconnect structures using a vacuum environment

Interconnect structure without barrier layer on bottom surface of via

3D semiconductor device and structure

Semiconductor device

Gate tie-down enablement with inner spacer

Semiconductor devices including resistor structures

Interconnect landing method for RRAM technology

Semiconductor structure and method of forming the same

Semiconductor chip having region including gate electrode features formed in part from rectangular layout shapes on gate horizontal grid and first-metal structures formed in part from rectangular layout shapes on at least eight first-metal gridlines of first-metal vertical grid

Semiconductor chip having region including gate electrode features of rectangular shape on gate horizontal grid and first-metal structures of rectangular shape on at least eight first-metal gridlines of first-metal vertical grid

Semiconductor Chip Having Region Including Gate Electrode Features of Rectangular Shape on Gate Horizontal Grid and First-Metal Structures of Rectangular Shape on First-Metal Vertical Grid

Method for manufacturing monolithic three-dimensional (3D) integrated circuits

Semiconductor package and method of manufacturing the same

Method for preparing a semiconductor apparatus

Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Layout technique for middle-end-of-line

3D integration method using SOI substrates and structures produced thereby

Interconnect structure

Self-forming barrier process

Semiconductor devices and fabrication methods thereof

Magnetic memory with metal oxide etch stop layer and method for manufacturing the same

Memory device with reduced-resistance interconnect

Semiconductor device and method of manufacturing the same

Graphene as interlayer dielectric

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Over-molded IC packages with embedded voltage reference plane and heater spreader

Self-aligned interconnection for integrated circuits

Interconnect structure

Modeling 3D physical connectivity into planar 2D domain to identify via redundancy

Memory device and method for fabricating the same

Semiconductor device

Semiconductor device having shared power line connections and method of manufacturing the same

Semiconductor package having a plurality of chips and method of manufacturing the same

Adhesive bonding composition and electronic components prepared from the same

Via rail solution for high power electromigration

Wrapped signal shielding in a wafer fanout package

Semiconductor device having a metal via

Phase changing on-chip thermal heat sink

Methods of manufacturing a semiconductor device

Stack access control for memory device

PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MICROELECTRONICS

Step height reduction of memory element

Deposition methodology for superconductor interconnects

Multi-layer film device and method

Method of manufacturing a semiconductor device including an LDMOS transistor

Semiconductor interconnect structure having graphene-capped metal interconnects

Capacitor having multiple graphene structures

Three-dimensional memory device with through-stack contact via structures and method of making thereof

Static random access memory (SRAM) device

Reducing or avoiding mechanical stress in static random access memory (SRAM) strap cells

Semiconductor device including a field effect transistor

Semiconductor structure and method of forming

Semiconductor device and manufacturing method thereof

Conductive vias in semiconductor packages and methods of forming same

Integrated circuit structures comprising conductive vias and methods of forming conductive vias

Semiconductor device and manufacturing method thereof

Interconnect structure and methods thereof

Localized high density substrate routing

Semiconductor structure and method of making the same

Semiconductor device and manufacturing method thereof

Method of forming trenches

Etch stop layer for semiconductor devices

Method of integrated circuit fabrication with dual metal power rail

Chemical clean of semiconductor device

Fin field effect transistor (FinFET) device structure with interconnect structure

Semiconductor package and semiconductor process

Depositing ruthenium layers in interconnect metallization

Metal-oxide semiconductor (MOS) device with thick oxide

Semiconductor device and method of forming the same

Methods of forming semiconductor device structures, and related semiconductor device structures, semiconductor devices, and electronic systems

Dynamic random access memory and method of manufacturing the same

Thin 3D die with electromagnetic radiation blocking encapsulation

BEOL vertical fuse formed over air gap

Interconnect structure containing a metal slilicide hydrogen diffusion barrier and method of making thereof

Via and skip via structures

Multi-directional self-aligned multiple patterning

Mitigating pattern collapse

Stack access control for memory device

Method to improve HKMG contact resistance

Semiconductor devices

Vertical memory devices with conductive pads supported by dummy channels with varying dimensions

SRAM cell and logic cell design

Semiconductor package and manufacturing method thereof

Preclean and deposition methodology for superconductor interconnects

Semiconductor device structure with resistive element

3D IC decoupling capacitor structure and method for manufacturing the same

Memory array structure having multiple bit lines

3D integration method using SOI substrates and structures produced thereby

Post-etch treatment of an electrically conductive feature

Contact structure and method of forming the same

Method for making a semiconductor device including a superlattice as a gettering layer

Semiconductor device including a superlattice as a gettering layer

MULTI-LAYER BARRIER FOR CMOS UNDER ARRAY TYPE MEMORY DEVICE AND METHOD OF MAKING THEREOF

Quantum device with spin qubits

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Semiconductor package device with integrated antenna and manufacturing method thereof

Three dimensional storage cell array with highly dense and scalable word line design approach

Ultra high performance interposer

Staircase encapsulation in 3D NAND fabrication

Closely packed vertical transistors with reduced contact resistance

SELF-ALIGNED SPACER FOR CUT-LAST TRANSISTOR FABRICATION

Phase-change memory

Semiconductor device and IO-cell

Package substrate and method of fabricating the same

Structure of integrated circuitry and a method of forming a conductive via

Electronic device with delamination resistant wiring board

Selective deposition of dielectric materials

Method of forming vertical flash memory

Three-dimensional semiconductor memory device including stacked electrodes having pad portions

SEMICONDUCTOR DEVICES

Semiconductor device and method for fabricating the same

Semiconductor device with post passivation structure and fabrication method therefor

Method of forming stacked trench contacts and structures formed thereby

POWER RAIL AND MOL CONSTRUCTS FOR FDSOI

Crack stop with overlapping vias

Semiconductor device

Semiconductor structure

Surface nitridation in metal interconnects

Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions

SELF-ENCLOSED ASYMMETRIC INTERCONNECT STRUCTURES

External connection mechanism, semiconductor device, and stacked package

3D integration method using SOI substrates and structures produced thereby

Selective recessing to form a fully aligned via

Selective recessing to form a fully aligned via

Process integration approach of selective tungsten via fill

Etch profile control of interconnect structures

Double spacer immersion lithography triple patterning flow and method

Process of fabricating embedded spin transfer torque memory for cellular neural network based processing unit

Passive electrical component with thermal via

Semiconductor device

Semiconductor devices for integration with light emitting chips and modules thereof

Fan-out semiconductor package

Chip security fingerprint

Chip security fingerprint

Semiconductor structure

Oxidation resistant barrier metal process for semiconductor devices

Semiconductor device having an extra low-k dielectric layer and method of forming the same

Split rail structures located in adjacent metal layers

Semiconductor device and manufacturing method thereof

Semiconductor device

Structure and formation method of interconnection structure of semiconductor device

Multi-metal fill with self-align patterning

3D stacking semiconductor device

Semiconductor device and method for manufacturing the same

System and method of forming a porous low-K structure

Semiconductor storage device

Memory device

Semiconductor device and method of manufacturing the same

Storage node contact structure of a memory device and manufacturing methods thereof

Copper etching integration scheme

Stacked multilayer structure and manufacturing method thereof

Semiconductor device with multi-layer metallization

Construction of integrated circuitry and a method of forming an elevationally-extending conductor laterally between a pair of structures

Methods of forming a semiconductor device comprising first and second nitride layers

Conductive structures in semiconductor devices

Forming conductive plugs for memory device

Three-dimensional semiconductor device with isolated dummy pattern

Three-dimensional memory device having conductive support structures and method of making thereof

Method of manufacturing a semiconductor device using reference pattern

Back-contact thin film semiconductor device structures and methods for their production

Method and system for MOM capacitance value control

Three-dimensional semiconductor device

Memory device and method for fabricating the same

Semiconductor device

Semiconductor devices

METHOD FOR FABRICATING MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED PASSIVE ELEMENT

Semiconductor device and ball bonder

Semiconductor device and fabrication method thereof

Standard cell and an integrated circuit including the same

Semiconductor device, electronic circuit having the same, and semiconductor device forming method

Integrated circuit having heterogeneous source/drain and gate contacts

Array substrate motherboard, array substrate and method of manufacturing the same, and display device

Low resistivity films containing molybdenum

Method for manufacturing a semiconductor device

Structures and methods for improved lithographic processing

Testing of semiconductor devices and devices, and designs thereof

Semiconductor device and manufacturing method thereof

Semiconductor device having contacts with varying widths