ClassID:

207765

H01L23/556 - CPC Classification

Classification description:

Details of semiconductor or other solid state devices; Protection against radiation, e.g. light or electromagnetic waves against alpha rays

Recent Application in this class:
#1
20250293179
2025-09-18

STACK PACKAGING METHOD FOR MEMORY COMPONENTS FOR SPACE-USE AND MEMORY COMPONENT PACKAGE FOR SPACE-USE MANUFACTURED THROUGH THE METHOD

#2
20240347478
2024-10-17

SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES

#3
20230275585
2023-08-31

SYSTEM AND METHOD FOR FORMING RADIATION HARDENED CIRCUITRY

#4
20220293531
2022-09-15

Semiconductor device with oxide-nitride stack

#5
20210233864
2021-07-29

Semiconductor device with oxide-nitride stack

#6
20200350260
2020-11-05

Ground shield plane for ball grid array (BGA) package

#7
20200303290
2020-09-24

Semiconductor device

#8
20200091087
2020-03-19

SEMICONDUCTOR MEMORY AND SEMICONDUCTOR MEMORY MANUFACTURING METHOD

#9
20200075505
2020-03-05

Semiconductor device

#10
20190287923
2019-09-19

Radiation-tolerant unit MOSFET hardened against single event effect and total ionizing dose effect

#11
20190287922
2019-09-19

Semiconductor device package with radiation shield

#12
20180348831
2018-12-06

System and method for power electronics with a high and low temperature zone cooling system

#13
20180121587
2018-05-03

Simulation methods and systems for predicting SER

#14
20170323942
2017-11-09

FinFET device structure and method for forming same

#15
20170301764
2017-10-19

Semiconductor device and method of manufacturing semiconductor device

#16
20170243935
2017-08-24

Designing and fabricating semiconductor devices with specific terrestrial cosmic ray (TCR) ratings

#17
20170182600
2017-06-29

Method for producing metal ball, joining material, and metal ball

#18
20170141048
2017-05-18

Radiation-hard electronic device and method for protecting an electronic device from ionizing radiation

#19
20170054000
2017-02-23

Semiconductor device and method of manufacturing semiconductor device

#20
20160368105
2016-12-22

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

#21
20160300837
2016-10-13

Wafer structure for electronic integrated circuit manufacturing

#22
20160261812
2016-09-08

Multi-tiered tamper-resistant assembly system and method

#23
20160160368
2016-06-09

Method of producing low alpha-ray emitting bismuth, and low alpha-ray emitting bismuth

#24
20160148885
2016-05-26

Cu core ball

#25
20150380336
2015-12-31

Packaged semiconductor chips with array

#26
20150200178
2015-07-16

Connection structure and electronic component

#27
20150171023
2015-06-18

Formation of alpha particle shields in chip packaging

#28
20150069588
2015-03-12

Radiation hardened microelectronic chip packaging technology

#29
20140339618
2014-11-20

Circuit having capacitor coupled with memory element

#30
20140197404
2014-07-17

Thin-film transistor active device

#31
20140151881
2014-06-05

Packaged semiconductor chips with array

#32
20140138852
2014-05-22

Semiconductor device and method for producing the same

#33
20140032135
2014-01-30

Structure and method to ensure correct operation of an integrated circuit in the presence of ionizing radiation

#34
20140027887
2014-01-30

Wafer backside doping for thermal neutron shielding

#35
20130306885
2013-11-21

Soft error resistant circuitry

#36
20130234337
2013-09-12

Semiconductor package and fabrication method thereof

#37
20130062740
2013-03-14

Tunable radiation source

#38
20130049177
2013-02-28

Wafer structure for electronic integrated circuit manufacturing

#39
20120306050
2012-12-06

Method for improving prompt dose radiation response of mixed-signal integrated circuits

#40
20120298586
2012-11-29

Alpha-particle emitter removal

#41
20120267768
2012-10-25

Formation of alpha particle shields in chip packaging

#42
20120220101
2012-08-30

INTERNAL CONDUCTIVE LAYER

#43
20120199959
2012-08-09

Extended under-bump metal layer for blocking alpha particles in a semiconductor device

#44
20120161300
2012-06-28

Ionizing radiation blocking in IC chip to reduce soft errors

#45
20120153443
2012-06-21

Packaged semiconductor chips with array

#46
20120122260
2012-05-17

Array of alpha particle sensors

#47
20120108762
2012-05-03

Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus

#48
20120028458
2012-02-02

Alpha particle blocking wire structure and method fabricating same

#49
20110210443
2011-09-01

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

#50
20110191729
2011-08-04

Method and apparatus for interconnect layout in an integrated circuit

#51
20110175211
2011-07-21

Method and structure to reduce soft error rate susceptibility in semiconductor structures

#52
20110121438
2011-05-26

EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE

#53
20110095404
2011-04-28

Semiconductor device and method of manufacturing the same

#54
20110012259
2011-01-20

Packaged semiconductor chips

#55
20100301463
2010-12-02

Reduced soft error rate through metal fill and placement

#56
20100254069
2010-10-07

Providing capacitors to improve radiation hardening in memory elements

#57
20100230772
2010-09-16

Array of alpha particle sensors

#58
20100155912
2010-06-24

Apparatus for shielding integrated circuit devices

#59
20100140760
2010-06-10

Alpha shielding techniques and configurations

#60
20100032795
2010-02-11

Method for semiconductor device having radiation hardened insulators and design structure thereof

#61
20090321896
2009-12-31

Semiconductor device and its manufacturing method

#62
20090302471
2009-12-10

Semiconductor device and manufacturing method therefor

#63
20090302421
2009-12-10

Method and apparatus for creating a deep trench capacitor to improve device performance

#64
20090243053
2009-10-01

Structure for reduction of soft error rates in integrated circuits

#65
20090236699
2009-09-24

Discrete placement of radiation sources on integrated circuit devices

#66
20090057565
2009-03-05

COSMIC RAY DETECTORS FOR INTEGRATED CIRCUIT CHIPS

#67
20090039515
2009-02-12

Ionizing radiation blocking in IC chip to reduce soft errors

#68
20080318365
2008-12-25

Formation of alpha particle shields in chip packaging

#69
20080296519
2008-12-04

Apparatus and method for absorption of incident gamma radiation and its conversion to outgoing radiation at less penetrating, lower energies and frequencies

#70
20080251895
2008-10-16

Apparatus for shielding integrated circuit devices

#71
20080230900
2008-09-25

Determining the placement of semiconductor components on an integrated circuit

#72
20080217793
2008-09-11

Method and device including reworkable alpha particle barrier and corrosion barrier

#73
20080164584
2008-07-10

Method for reduction of soft error rates in integrated circuits

#74
20080116545
2008-05-22

Packaged semiconductor chips

#75
20080116544
2008-05-22

Packaged semiconductor chips with array

#76
20070285118
2007-12-13

Semiconductor integrated circuit device

#77
20070284702
2007-12-13

Semiconductor device having a bonding pad and fuse and method for forming the same

#78
20070212820
2007-09-13

Method and device including reworkable alpha particle barrier and corrosion barrier

#79
20070050599
2007-03-01

Determining the placement of semiconductor components on an integrated circuit

#80
20070045844
2007-03-01

Alpha particle shields in chip packaging

#81
20070037406
2007-02-15

METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY

#82
20070032065
2007-02-08

Alpha-particle-tolerant semiconductor die systems, devices, components and methods for optimizing clock rates and minimizing die size

#83
20070013073
2007-01-18

Method and structure for reduction of soft error rates in integrated circuits

#84
20060246703
2006-11-02

Post bump passivation for soft error protection

#85
20060194454
2006-08-31

Technique to radiation-harden trench refill oxides

#86
20060166402
2006-07-27

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

#87
20060000981
2006-01-05

Cosmic ray detectors for integrated circuit chips

#88
20050205953
2005-09-22

Semiconductor device

#89
20050051349
2005-03-10

Radiation shielded semiconductor package

#90
20050011656
2005-01-20

Method for shielding integrated circuit devices

#91
16048133
2020-04-07

Method for forming FinFET device structure

#92
15994671
2019-07-09

Radiation-hardened latch circuit