Semiconductor device

Semiconductor assembly having substrate with electroplated contact pads

Semiconductor device

Fabrication method of wafer level chip scale packages

Method for fabricating chip structure

Compliant interconnect and method of formation

Compound semiconductor device and manufacturing method thereof

Method for forming bump on electrode pad with use of double-layered film

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Capping of metal interconnects in integrated circuit electronic devices

Method of forming a solder bump and the structure thereof

Pre-doped reflow interconnections for copper pads

Compound semiconductor device and manufacturing method thereof

Semiconductor device with reduced contact resistance

Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus

Method of manufacturing semiconductor device

Formation method for conductive bump

Method for forming interconnects on thin wafers

Crack protection for silicon die

Semiconductor device with a barrier layer and a metal layer

Semiconductor device and method capable of scribing chips with high yield

Semiconductor device with slanting side surface for external connection

Screen printing method of forming conductive bumps

Wire-bonding method for chips with copper interconnects by introducing a thin layer

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Method for fabrication of wafer level package incorporating dual compliant layers

Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon

Semiconductor device

Bump structure

Power composite integrated semiconductor device and manufacturing method thereof

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Method of manufacturing semiconductor device

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

Under bump metallization layer to enable use of high tin content solder bumps

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface

Fill for large volume vias

Methods of forming solder bumps on exposed metal pads

Method for making an interconnect pad

INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR

Display device and manufacturing method of the same

FCBGA package structure

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Structure of package

Semiconductor device

Method for manufacturing an interconnect

Compliant multi-composition interconnects

Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps

Bonding pad structure and method of forming the same

Power semiconductor module

High performance system-on-chip discrete components using post passivation process

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package

Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes

Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits

Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits

Method of fabricating electrical connection terminal of embedded chip

Circuit device and method of manufacturing the circuit device

Wafer level mounting frame for ball grid array packaging, and method of making and using the same

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor device comprising through-electrode interconnect

Wafer stacking using interconnect structures of substantially uniform height

Semiconductor device with electrode pads for test probe

Use of palladium in IC manufacturing with conductive polymer bump

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Method and semiconductor device having copper interconnect for bonding

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Methods of forming bumps using barrier layers as etch masks

Adhesion by plasma conditioning of semiconductor chip surfaces

Under bump metallization layer to enable use of high tin content solder bumps

Copper interconnect

Semiconductor device and method of manufacturing the same

Bumpless die and heat spreader lid module bonded to bumped die carrier

Solder bump structure and method for forming a solder bump

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of routing an electrical connection on a semiconductor device and structure therefor

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device with recessed post electrode

Multi-chip package (MCP) with a conductive bar and method for manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Bump and fabricating process thereof

Method and apparatus for bonding a wire

Electronic component having an integrated passive electronic component and associated production method

Packaged semiconductor device

Bonding structure and fabrication thereof

Semiconductor device and manufacturing method of the same

Titanium stripping solution

Method to prevent passivation layer peeling in a solder bump formation process

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method thereof

Manufacturing method for semiconductor device and semiconductor device

Method of manufacturing semiconductor device

High performance system-on-chip using post passivation process

Semiconductor light emitting device

Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Manufacturing method of semiconductor device

BUMPING PROCESS OF LIGHT EMITTING DIODE

Wafer-level chip scale package and method for fabricating and using the same

Bumping process of light emitting diode

Wafer-level package and method for production thereof

Electrode pad section for external connection

Semiconductor device and method of manufacturing the same

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

High performance system-on-chip discrete components using post passivation process

Bumpless wafer scale device and board assembly

High Q factor integrated circuit inductor

Method of fabricating a pad over active circuit I.C. with meshed support structure

Method of forming solder bump with reduced surface defects

Flip chip packaging process employing improved probe tip design

Adhesion by plasma conditioning of semiconductor chip

Room temperature metal direct bonding

Method of manufacturing high performance copper inductors with bond pads

Method of forming segmented ball limiting metallurgy

Hermetic passivation structure with low capacitance

Integrated device including connections on a separate wafer

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

UBM for fine pitch solder ball and flip-chip packaging method using the same

Semiconductor device and manufacturing method thereof

Semiconductor chip and manufacturing method for the same, and semiconductor device

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Method of forming a bonding pad structure

Semiconductor device and method for manufacturing the same

Solder ball pad structure

Method of fabricating a pad over active circuit I.C. with frame support structure

Semiconductor device with intermediate connector

Method and device for manufacturing bonding pads for chip scale packaging

Semiconductor device and method of fabricating the same

Novel process for improved hot carrier injection

Structure and method for fabricating a bond pad structure

Structure and method for reinforcing a bond pad on a chip

Semiconductor device

Semiconductor device and the method of producing the same

Solder bump structure for flip chip package and method for manufacturing the same

Bonding pads with dummy patterns in semiconductor devices and methods of forming the same

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Internally reinforced bond pads

Chip and wafer integration process using vertical connections

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Bond pad

Wire bonding process for copper-metallized integrated circuits

Method of applying a pattern of particles to a substrate

Barrier layers for tin-bearing solder joints

Use of palladium in IC manufacturing with conductive polymer bump

Optimum padset for wire bonding RF technologies with high-Q inductors

Redistribution of substrate interconnects

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Method for forming bond pad openings

Method of manufacturing a semiconductor device

Inductor formed in an integrated circuit

Semiconductor device having a bond pad and method therefor

Method and semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Apparatus and method for low pressure wirebond

Semiconductor device and manufacturing method thereof

Bond pad scheme for Cu process

Semiconductor device and method for fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of fabricating ultra thin flip-chip package

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

Semiconductor test board having laser patterned conductors

Electronic circuit device and porduction method therefor

Self-locking wire bond structure and method of making the same

Wirebond structure and method to connect to a microelectronic die

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Light-emitting diode chip package body and packaging method thereof

Local multilayered metallization

Method of fabricating a wire bond pad with Ni/Au metallization

Semiconductor electronic device and method of manufacturing thereof

Semiconductor device with electrode pad having probe mark

Reliable metal bumps on top of I/O pads after removal of test probe marks

Wafer-level moat structures

Method of mounting wafer on printed wiring substrate

Method for fabricating wafer-level chip scale packages

Reinforced bond pad

Semiconductor device with multilayered metal pattern

Semiconductor device and method of manufacturing the same

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

I/C chip suitable for wire bonding

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Semiconductor device having fuse circuit on cell region and method of fabricating the same

Solder bump structure and method for forming the same

Method for chemical etch control of noble metals in the presence of less noble metals

Method of forming a bond pad

Super high density module with integrated wafer level packages

Pad structures including insulating layers having a tapered surface

Chip stack package and manufacturing method thereof

Process for forming lead-free bump on electronic component

Active area bonding compatible high current structures

Process for making contact with and housing integrated circuits

Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Method of metal sputtering for integrated circuit metal routing

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Semiconductor packaging structure and method for forming the same

Semiconductor electronic device and method of manufacturing thereof

Wire bonding method for copper interconnects in semiconductor devices

Semiconductor sensor and method of plating semiconductor devices

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Asymmetric plating

Low fabrication cost, fine pitch and high reliability solder bump

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

PROBE TIP DESIGN APPLIED IN A FLIP CHIP PACKAGING PROCESS

Apparatus and method for packaging circuits

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Method for producing a semiconductor device in chip format

Inhibition of tin oxide formation in lead free interconnect formation

Semiconductor processing methods

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Bonding structure with pillar and cap

Method of fabricating semiconductor device and semiconductor device

Pad over active circuit system and method with meshed support structure

Semiconductor device with strain relieving bump design

CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME

Semiconductor wafer, semiconductor device, method for manufacturing the semiconductor device, circuit board, and electronic apparatus

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Semiconductor component having conductors with wire bondable metalization layers

Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Stencil mask design method and under bump metallurgy for C4 solder bump

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device including a diffusion layer

Under-bump metallugical structure

Semiconductor device

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Wafer level bumping process

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Manufacturing method for semiconductor device

Aluminum cap with electroless nickel/immersion gold

Semiconductor device and method of manufacturing the same

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode

Bump electrodes having multiple under ball metallurgy (UBM) layers

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

Method of fabricating semiconductor memory device and semiconductor memory device driver

Activation plate for electroless and immersion plating of integrated circuits

Semiconductor device and manufacturing method thereof

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument

Semiconductor device

Semiconductor device with under bump metallurgy and method for fabricating the same

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Method and apparatus for maintaining a separation between contacts

Acentric non-round electrical interconnections

Bonding process with inhibited oxide formation

Bonding process with inhibited oxide formation

Structure of semiconductor device and method for bonding two substrates

PCB for bare die mount and process therefore

Semiconductor die with hybrid wire bond pads

Method of transferring different types of micro devices

Semiconductor structure and method for forming the same

Three-dimensional device with bonded structures including a support die and methods of making the same

Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same

Patterning polymer layer to reduce stress

Protective layers for high-yield printed electronic devices

Flip-chip wire bondless power device

Method of manufacturing integrated fan-out package

Molded cavity fanout package without using a carrier and method of manufacturing the same

Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same

Wafer edge partial die engineered for stacked die yield

Semiconductor device and manufacturing method thereof

Repackaged reconditioned die method and assembly

Method for binding micro device to conductive pad

Interconnect structures for preventing solder bridging, and associated systems and methods

Semiconductor device including optional pad interconnect

Bond pad structure for semiconductor device packaging

Integrated fan-out package, redistribution circuit structure, and method of fabricating the same

Semiconductor package with grounding device and related methods

Resist composition

Chamfering for stress reduction on passivation layer

Electronic apparatus

Method for manufacturing memory having stacked integrated circuit chip

Interconnect structure and method

Vertically stacked wafers and methods of forming same

Semiconductor device and method for manufacturing the same

Signal isolator having inductive and capacitive signal coupling

Fan-out wafer level integration for photonic chips

Wafer level package with EMI shielding