Approach to high temperature wafer processing

Semiconductor connection component

Method for forming metal pad in semiconductor device

Manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device electronic component, circuit board, and electronic device

Optical semiconductor device and method of manufacturing the same

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Metal pad or metal bump over pad exposed by passivation layer

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Planar bond pad design and method of making the same

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Self-assembled interconnection particles

Semiconductor package with ferrite shielding structure

Semiconductor device

Method of forming solder bump with reduced surface defects

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Method for forming high reliability bump structure

Integrated circuit pad with separate probing and bonding areas

Multi-component integrated circuit contacts

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

Process for making a semiconductor device having a roughened surface

Method and structure for reduction of soft error rates in integrated circuits

Electronic parts packaging structure and method of manufacturing the same

Semiconductor device

Semiconductor sensor and manufacturing method therefor

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Semiconductor device and manufacturing method of the same

Under bump metallization design to reduce dielectric layer delamination

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Circuitry component and method for forming the same

Ultrathin semiconductor circuit having contact bumps

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Manufacturing method for packaged semiconductor device

Grid array connection device and method

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor device and manufacturing method of the same

Method of manufacturing semiconductor device

Semiconductor device having through electrode and method of manufacturing the same

Electronic board, method of manufacturing the same, and electronic device

Electronic board, method of manufacturing the same, and electronic device

Low stress chip attachment with shape memory materials

Wafer and single chip having circuit rearranged structure and method for fabricating the same

Semiconductor device and manufacturing method therefor

Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump

Die stacking recessed pad wafer design

METHOD FOR FORMING BUMPS

Semiconductor device and manufacturing method thereof

Method and circuit structure employing a photo-imaged solder mask

Semiconductor element and manufacturing method thereof

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Structure and method for bond pads of copper-metallized integrated circuits

Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof

Offset solder bump method and apparatus

Flip chip light emitting diode and method of manufacturing the same

Method of reducing process steps in metal line protective structure formation

Semiconductor device and method of fabricating the same

Semiconductor device including wire bonding pads and pad layout method

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Fabrication method of under bump metallurgy structure

Circuit device and method of manufacturing thereof

Bond pad structure comprising multiple bond pads with metal overlap

Terminal pad structures and methods of fabricating same

Semiconductor device with passivation layer covering wiring layer

Conductive bump structure for semiconductor device and fabrication method thereof

Post bump passivation for soft error protection

Multiple etch-stop layer deposition scheme and materials

Alignment key structure in a semiconductor device and method of forming the same

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Solder bumps in flip-chip technologies

Techniques for improving bond pad performance

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Substrate for producing a soldering connection to a second substrate

Semiconductor device including an under electrode and a bump electrode

Apparatus for conducting heat in a flip-chip assembly

Bumping process and bump structure

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Integrated circuit system for bonding

Semiconductor chip mounting body and manufacturing method thereof

Method for fabricating semiconductor components with through wire interconnects

Semiconductor device and fabrication method thereof

Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor device

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device

Package structure of semiconductor and wafer-level formation thereof

Wafer-level package for integrated circuits

Aluminum cap with electroless nickel/immersion gold

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Semiconductor device and semiconductor-device manufacturing method

Wafer level chip scale package having a gap and method for manufacturing the same

Method for Manufacturing Gold Bumps

METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES

Top via pattern for bond pad structure

Integrated device and electronic system

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Front-end processing of nickel plated bond pads

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Semiconductor device with via hole for electric connection

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Semiconductor package and method for manufacturing the same

Semiconductor device

FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME

LOCAL MULTILAYERED METALLIZATION

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Semiconductor package having an optical device and a method of making the same

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

System for different bond pads in an integrated circuit package

Semiconductor device having a plastic housing and external connections and method for producing the same

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Semiconductor device production method and semiconductor device

MULTI-CHIP BALL GRID ARRAY PACKAGE

Microelectronic assemblies having compliancy

Inductor formed in an integrated circuit

Integrated connection arrangements

High reflectivity p-contacts for group lll-nitride light emitting diodes

Semiconductor device and manufacturing method thereof

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor device and manufacturing process therefor

Accurate relative alignment and epoxy-free attachment of optical elements

Apparatus and method for bonding wires

Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Method of forming a wear-resistant dielectric layer

Forming a cap above a metal layer

Structure and method for bonding an IC chip

Semiconductor device and fabrication method thereof

Efficient method of forming and assembling a microelectronic chip including solder bumps

Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate

Novel method for copper wafer wire bonding

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Bump structure of semiconductor device and method of manufacturing the same

Chip scale package and method for manufacturing the same

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Under bump metallurgy in integrated circuits

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Semiconductor integrated circuit and method of manufacturing the same

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for fabricating module of semiconductor chip

Electronic parts packaging structure

Electronic device

On-chip circuit pad structure

Method of forming pad and fuse in semiconductor device

Semiconductor integrated device and method for manufacturing same

Semiconductor device and method for manufacturing the same

Method of forming a bonding pad structure

Copper interconnect

Semiconductor device and fabrication method thereof

Power semiconductor device

Method of manufacturing semiconductor device

Method for wafer stacking using copper structures of substantially uniform height

Method for constructing contact formations

Ball limiting metallurgy split into segments

Arrangement of input/output pads on an integrated circuit

Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Method of manufacturing a semiconductor device

Solder bump composition for flip chip

Method for re-routing lithography-free microelectronic devices

Protection of an integrated capacitor

Semiconductor device having a bonding pad structure including an annular contact

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and manufacturing method thereof

Bonding structure and fabrication thereof

Three-dimensional device fabrication method

Semiconductor device and the method of producing the same

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Reinforced solder bump structure and method for forming a reinforced solder bump

Semiconductor device and manufacturing method of semiconductor device

Method and apparatus for polymer dielectric surface recovery by ion implantation

Methods for aligning semiconductor fabrication molds and semiconductor substrates

Semiconductor device and manufacturing method thereof

Forming an intermediate layer in interconnect joints and structures formed thereby

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

High surface area aluminum bond pad for through-wafer connections to an electronic package

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Semiconductor device with penetrating electrode

Method for forming solder bumps of increased height

Method of fabricating a high Q factor integrated circuit inductor

Active area bonding compatible high current structures

Integration type semiconductor device and method for manufacturing the same

Semiconductor device with crack-resistant multilayer copper wiring

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Bumping process

Bumping process and structure thereof

Fabrication method of a wafer structure

Method for fabricating semiconductor components

LED with self aligned bond pad

Semiconductor device and method of fabricating the same

Manufacturing method of solid-state image sensing device

Bumping process and structure thereof

Semiconductor device and manufacturing method of the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Compliant interconnects for semiconductors and micromachines

Semiconductor device and method of manufacturing the same

Method for fabricating packaged die

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device having aluminum electrode and metallic electrode

Method of forming a bond pad on an I/C chip and resulting structure

Resist sidewall spacer for C4 BLM undercut control

3D interconnect with protruding contacts

Contour structures to highlight inspection regions

Method of forming bump that may reduce possibility of losing contact pad material

Method of manufacturing a substrate with through electrodes

Redistribution layer of wafer and the fabricating method thereof

Method for forming an electrode

Electronic parts packaging structure and method of manufacturing the same

Structure and method for fabricating a bond pad structure

Semiconductor device and fabrication method thereof

Copper interconnect

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Semiconductor element including a wet prevention film

Top layers of metal for integrated circuits

Wafer scale integration packaging and method of making and using the same

Semiconductor device packaged into chip size and manufacturing method thereof

Interconnection structure of integrated circuit chip

Pad structure to prompt excellent bondability for low-k intermetal dielectric layers

Semiconductor device and fabrication process thereof

Wire bond pads

Method for producing bumps on an electrical component

Method for forming a redistribution layer in a wafer structure

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Semiconductor device and manufacturing method thereof

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Bump structure

Packaging with metal studs formed on solder pads

Bump structure of semiconductor package and method for fabricating the same

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Method of manufacturing a semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device with reduced contact resistance

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Semiconductor device and method for fabricating the same

Semiconductor chip packages and methods for fabricating the same

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Through-wafer interconnects for photoimager and memory wafers

Semiconductor and method for producing a semiconductor

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Methods for forming molds

Stretchable semiconductor elements and stretchable electrical circuits

Semiconductor device and manufacturing method of the same

Wafer level package, multi-package stack, and method of manufacturing the same

Semiconductor device with sidewall wiring

Methods of forming lead free solder bumps

Method for fabricating semiconductor package with circuit side polymer layer

Method for processing base

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Interconnect assemblies and methods

Method of manufacturing semiconductor device with two-step etching of layer

Metal pad of semiconductor device and method for bonding the metal pad

Front-end processing of nickel plated bond pads

Hermetic chip in wafer form

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Method for fabricating pad redistribution layer

Device having contact pad with a conductive layer and a conductive passivation layer

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Structure and formation method of conductive bumps

Semiconductor device and method of manufacturing a semiconductor device

Damascene patterning of barrier layer metal for C4 solder bumps

Method of manufacturing semiconductor device

Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same

Light extraction from a semiconductor light emitting device via chip shaping

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Stacked semiconductor chips

Bond pad structure for copper metallization having increased reliability and method for fabricating same

Semiconductor device and a method of manufacturing the semiconductor device

Semiconductor component and assembly having female conductive members

Under bump metallurgy process on passivation opening

Method for ultra thinning bumped wafers for flip chip

Highly compliant plate for wafer bonding

Multi-component integrated circuit contacts

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method for producing a semiconductor circuit, and corresponding semiconductor circuit

Electronic assembly with carbon nanotube contact formations or interconnections