207783 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto Manufacturing methods
Metal pads over TSV
#902Semiconductor device and method for manufacturing the same
#903Integrated circuit structure, and method for forming thereof
#904Interposer, method for fabricating the same, and semiconductor package having the same
#905Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#906Solid-state image pickup element and electronic apparatus
#907METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE ATTACHED TO A WIDE BAND-GAP SEMICONDUCTOR WAFER
#908Semiconductor structure and manufacturing method thereof
#909SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
#910Test structure and testing method thereof
#911Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#912Semiconductor device and manufacturing method thereof
#913CONTACT STRUCTURES FOR DIRECT BONDING
#914Semiconductor module and method of manufacturing semiconductor module
#915Semiconductor device with edge-protecting spacers over bonding pad
#916Via structure for semiconductor dies
#917Hybrid pocket post and tailored via dielectric for 3D-integrated electrical device
#918PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
#919Wafer on wafer bonding structure
#920Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
#921SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#922Silicon transformer integrated chip
#923Semiconductor device with tilted insulating layers and method for fabricating the same
#924Contact pad structures and methods for fabricating contact pad structures
#925A Semiconductor Device and a Method Making the Same
#926Integrated circuit structure and fabrication method thereof
#927Passivation structure with planar top surfaces
#928Semiconductor package and method for manufacturing the same
#929Conductive barrier direct hybrid bonding
#930Film structure for bond pad
#931Reinforced semiconductor die and related methods
#932Semiconductor device including an exposed solderable element
#933Method of forming a sensor device
#934Stacked Integrated Circuit Structure and Method of Forming
#935Method for manufacturing side wettable package
#936Methods of forming microvias with reduced diameter
#937PACKAGE CHIP AND METHOD OF MANUFACTURING THE SAME, REWIRING PACKAGE CHIP AND METHOD OF MANUFACTURING THE SAME
#938Package having different metal densities in different regions and manufacturing method thereof
#939Stacked semiconductor device with removable probe pads
#940Metal bump structure and manufacturing method thereof and driving substrate
#941Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films
#942Bonding structures of integrated circuit devices and method forming the same
#943Electronic device including wire on side surface of substrate and manufacturing method thereof
#944Semiconductor structure including interconnection to probe pad with probe mark
#945Semiconductor package and method of manufacturing the same
#946Barrier structures between external electrical connectors
#947CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHIP STRUCTURE
#948BALL PLACEMENT STRUCTURE AND PREPARATION PROCESS THEREOF
#949Semiconductor device and method for manufacturing a semiconductor device
#950Semiconductor device and method
#951Semiconductor device and method
#952TIN PLATING BATH AND A METHOD FOR DEPOSITING TIN OR TIN ALLOY ONTO A SURFACE OF A SUBSTRATE
#953ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONTACT TO BOND PADS
#954Hybrid bonding structure and method of fabricating the same
#955Semiconductor device and method of manufacturing the same
#956Semiconductor structure including buffer layer
#957Semiconductor devices and semiconductor packages including the same
#958Structure with conductive feature and method of forming same
#959Printed package and method of making the same
#960Display device and manufacturing method thereof
#961Buffer layer(s) on a stacked structure having a via
#962Package structure
#963Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems
#964Semiconductor device with thermal release layer and method for fabricating the same
#965Methods for registration of circuit dies and electrical interconnects
#966Contact pads of three-dimensional memory device and fabrication method thereof
#967Semiconductor device including uneven contact in passivation layer
#968Chip packaging method and chip packaging structure
#969SOLDER BUMP FORMATION USING WAFER WITH RING
#970Resist Composition
#971MANUFACTURING METHOD OF PACKAGE CIRCUIT
#972Method of manufacturing die stack structure
#973Protective surface layer on under bump metallurgy for solder joining
#974Method for permanent connection of two metal surfaces
#975Semiconductor device with thermal release layer and method for fabricating the same
#976Thin-film resistor (TFR) with displacement-plated TFR heads
#977Offset interposers for large-bottom packages and large-die package-on-package structures
#978Semiconductor memory device structure
#979Electronic circuit for a hybrid molecular bonding
#980Bond pad with enhanced reliability
#981Semiconductor structures with via openings and methods of making the same
#982Solder ball application for singular die
#983Radiation sensor element and method
#984Merged power pad for improving integrated circuit power delivery
#985Method of manufacturing semiconductor device and semiconductor device
#986RF devices with enhanced performance and methods of forming the same
#987Chip structure, packaging structure and manufacturing method for chip structure
#988Bonding structure, package structure, and method for manufacturing package structure
#989Semiconductor device and manufacturing method of semiconductor device
#990Package structure and method of manufacturing the same
#991Semiconductor device and manufacturing method of semiconductor device
#992Method and structures for low temperature device bonding
#993Circuit substrate structure and manufacturing method thereof
#994Apparatus including a terminal pad associated with a conductive trace and having an irregular surface topography
#995Semiconductor device with spacer over bonding pad
#996Coupling of integrated circuits (ICS) through a passivation-defined contact pad
#997INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
#998Stiffener package and method of fabricating stiffener package
#999Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices
#1000Method for manufacturing a wafer level chip scale package (WLCSP)
#1001Semiconductor device and method of forming the same
#1002Semiconductor device and method of forming the same
#1003BOND PAD STRUCTURE WITH REDUCED STEP HEIGHT AND INCREASED ELECTRICAL ISOLATION
#1004HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
#1005MICROPARTICLE ARRAYING MASK
#1006Chip package structure
#1007RF devices with enhanced performance and methods of forming the same
#1008DRY ETCH BACK SUBSTRATE INTERCONNECTIONS
#1009Method for manufacturing semiconductor structure
#1010METHOD OF FORMING SEMICONDUCTOR STRUCTURE
#1011Method for fabricating semiconductor device with stress relief structure
#1012Method of manufacturing semiconductor device
#1013Device for controlling trapped ions and method of manufacturing the same
#1014Semiconductor device and method for manufacturing semiconductor device
#1015Bump pad structure
#1016Advanced device assembly structures and methods
#1017Bonded unified semiconductor chips and fabrication and operation methods thereof
#1018Backside contact for thermal displacement in a multi-wafer stacked integrated circuit
#1019Method for fabricating semiconductor device with slanted conductive layers
#1020Semiconductor device including bond pad with fixing parts fixed onto insulating film
#1021Interconnection structure of a semiconductor chip and semiconductor package including the interconnection structure
#1022Semiconductor device with tilted insulating layers and method for fabricating the same
#1023Semiconductor device with slanted conductive layers and method for fabricating the same
#1024BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME
#1025Semiconductor package and manufacturing method of semiconductor package
#1026Semiconductor package with air gap
#1027Side wettable package
#1028Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures
#10293D PROCESSOR
#1030Pad-out structure for semiconductor device and method of forming the same
#1031Bonding structure and method of forming same
#1032Semiconductor device structure with conductive polymer liner and method for forming the same
#1033Method of fabricating a semiconductor device
#1034Method of forming package structure
#1035Solder joints on nickel surface finishes without gold plating
#1036Bump coplanarity for semiconductor device assembly and methods of manufacturing the same
#1037Method for fabricating semiconductor device
#1038Method for manufacturing semiconductor package with air gap
#1039Electronic apparatus including antennas and directors
#1040Method of manufacturing semiconductor device having hybrid bonding interface
#1041Microelectronic devices, electronic systems having a memory array region and a control logic region, and methods of forming microelectronic devices
#1042Semiconductor Device, Method Making It And Packaging Structure
#1043Semiconductor device and fabrication method of the semiconductor device
#1044Wire bond pad design for compact stacked-die package
#1045Integrated circuit bond pad with multi-material toothed structure
#1046Methods of forming microvias with reduced diameter
#1047Leadframes in semiconductor devices
#1048INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS
#1049Single-shot encapsulation
#1050Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#1051Semiconductor structure and method for forming semiconductor structure
#1052Memory devices with backside bond pads under a memory array
#1053Integrated circuit test method and structure thereof
#1054Wafer-bonding structure and method of forming thereof
#1055Methods for bonding semiconductor structures and semiconductor devices thereof
#1056Semiconductor device including uneven contact in passivation layer and method of manufacturing the same
#1057Interlocked redistribution layer interface for flip-chip integrated circuits
#1058Passivation structure with increased thickness for metal pads
#1059SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1060Package and method of fabricating the same
#1061Method for forming conductive layer, and conductive structure and forming method therefor
#1062Iterative formation of damascene interconnects
#1063Semiconductor memory device
#1064Solid-state imaging device and electronic apparatus
#1065Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#1066Semiconductor structure containing pre-polymerized protective layer and method of making thereof
#1067Fabricating method of semiconductor device with exposed input/output pad in recess
#1068Semiconductor package and method of manufacturing the same
#1069Flip-chip flexible under bump metallization size
#1070Semiconductor structure and forming method therefor
#1071Method for manufacturing semiconductor structure
#1072Semiconductor device and method for manufacturing semiconductor device
#1073Semiconductor package having enlarged gate pad and method of making the same
#1074Chip packaging method and package structure
#1075Bumped pad structure
#1076CONTACT PAD STRUCTURE AND METHOD OF FORMING THE SAME
#1077Semiconductor device and semiconductor package
#1078Packages and methods of forming packages
#1079Magnetic induced heating for solder interconnects
#1080Packaged semiconductor device with electroplated pillars
#1081Semiconductor package substrate and method of manufacturing semiconductor package using the same
#1082Electrical component with component interconnection element
#1083Chip package and method of forming a chip package
#1084Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
#1085Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
#1086Capacitor between two passivation layers with different etching rates
#1087Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
#1088Semiconductor package and method for manufacturing the same
#1089Solid-state imaging device and electronic apparatus
#1090Semiconductor die containing dummy metallic pads and methods of forming the same
#1091Chiplets 3D SoIC system integration and fabrication methods
#1092SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#1093Method of treatment of an electronic circuit for a hybrid molecular bonding
#1094Display panel, manufacturing method of display panel, and display device
#1095Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#1096Wafer-level package including under bump metal layer
#1097Integrated fan-out package, package-on-package structure, and manufacturing method thereof
#1098Semiconductor package and method of forming the same
#1099Package comprising multi-level vertically stacked redistribution portions
#1100Semiconductor device structure with bonding pad and method for forming the same
#1101Semiconductor device and method of forming the same
#1102Bond pad with enhanced reliability
#1103Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip
#1104Methods and devices for fabricating and assembling printable semiconductor elements
#1105Through silicon via design for stacking integrated circuits
#1106Wirebond-constructed inductors
#1107Semiconductor devices having bonding structures with bonding pads and metal patterns
#1108Semiconductor package with air gap and manufacturing method thereof
#1109Integrated fan-out structures and methods for forming the same
#1110Semiconductor package with air gap and manufacturing method thereof
#1111Moat coverage with dielectric film for device passivation and singulation
#1112SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#1113Semiconductor device and method for manufacturing same
#1114Semiconductor package and methods of manufacturing a semiconductor package
#1115Multi-metal contact structure
#1116Semiconductor packages with an intermetallic layer
#1117Bonded assembly containing low dielectric constant bonding dielectric material
#1118Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging
#1119Field effect transistor and semiconductor device
#1120Textured bond pads
#1121Joint structure, semiconductor device, and joining method
#1122Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same
#1123Wafer bonding method
#1124METHOD FOR CONNECTING COMPONENTS DURING PRODUCTION OF POWER ELECTRONIC MODULES OR ASSEMBLIES
#1125Semiconductor device with composite connection structure and method for fabricating the same
#1126Microelectronic device interface configurations, and associated methods, devices, and systems
#1127Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same
#1128Semiconductor structure containing reentrant shaped bonding pads and methods of forming the same
#1129WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
#1130Semiconductor wafer and method of manufacturing the same
#1131Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#1132Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
#1133Semiconductor structure containing multilayer bonding pads and methods of forming the same
#1134Die-beam alignment for laser-assisted bonding
#1135Semiconductor device and method of manufacturing the same
#1136Method for fabricating a semiconductor device and the same
#1137Die stacking structure and method forming same
#1138Semiconductor device and manufacturing method thereof
#1139Metal bumps and method forming same
#1140Method for fabricating a semiconductor device
#1141Semiconductor device and semiconductor package
#1142Semiconductor device and manufacturing method thereof
#1143Semiconductor device and semiconductor device manufacturing method
#1144Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#1145Control device
#1146Bonding Pad on a Back Side Illuminated Image Sensor
#1147Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements
#1148Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#1149Method of manufacturing semiconductor device
#1150Heterogeneous fan-out structure and method of manufacture
#1151Display device
#1152Semiconductor packaging method and semiconductor package device
#1153Semiconductor device including bonding pads and method of manufacturing the same
#1154Semiconductor device having a passivation layer and method of making
#1155Method of forming a photoresist over a bond pad to mitigate bond pad corrosion
#1156Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#1157Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#1158Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
#1159Semiconductor package and method for manufacturing the same
#1160Semiconductor package and method of manufacturing the same
#1161SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF POWER DEVICE
#1162Integrated circuit package with a magnetic core
#1163Packaged die and RDL with bonding structures therebetween
#1164Semiconductor package and manufacturing method thereof
#1165Stacked Integrated Circuit Structure and Method of Forming
#1166Isolation structure for bond pad structure
#1167Nickel alloy for semiconductor packaging
#1168Semiconductor structure, redistribution layer (RDL) structure, and manufacturing method thereof
#1169Semiconductor device having alignment pads and method of manufacturing the same
#1170Semiconductor device and method of fabricating the same
#1171Flip chip packaging rework
#1172Semiconductor device having hybrid bonding interface, method of manufacturing the semiconductor device, and method of manufacturing semiconductor device assembly
#1173Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same
#1174DBI to SI bonding for simplified handle wafer
#1175Semiconductor device
#1176Semiconductor device
#1177Semiconductor device and manufacturing method of semiconductor device
#1178SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
#1179Light emitting diode containing a grating and methods of making the same
#1180Semiconductor device and method of manufacturing the same
#1181Vertical memory device and method for fabricating vertical memory device
#1182Stacked semiconductor structure and method
#1183Additive manufacturing of a frontside or backside interconnect of a semiconductor die
#1184Semiconductor structure and method of fabricating the same
#1185Semiconductor device and method of manufacturing the same
#1186Conductive bump of a semiconductor device and fabricating method thereof
#1187Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof
#1188Packages with Si-substrate-free interposer and method forming same
#1189Packages with enlarged through-vias in encapsulant
#1190Workpiece holder, wafer chuck, wafer holding method
#1191Method of manufacturing ring-shaped member and ring-shaped member
#1192Bonding pads including interfacial electromigration barrier layers and methods of making the same
#1193Pre-molded leadframes in semiconductor devices
#1194Methods of manufacturing a semiconductor device including a joint adjacent to a post
#1195Thermal compression flip chip bump for high performance and fine pitch
#1196Semiconductor structure and manufacturing method thereof
#1197Electrical connection placement of semiconductor device package and method of manufacturing the same
#1198Modular WLCSP die daisy chain design for multiple die sizes
#1199Three-dimensional memory device with embedded dynamic random-access memory
#1200Multilayer body and method of manufacturing the same