Microelectronic devices and apparatuses having a patterned surface structure

Method for preparing a semiconductor device with spacer over sidewall of bonding pad

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Top hat structure for isolation capacitors

System, device and methods of manufacture

Info structure with copper pillar having reversed profile

Semiconductor package and manufacturing method thereof

Methods for forming substrate terminal pads, related terminal pads and substrates and assemblies incorporating such terminal pads

Semiconductor device with interconnect structure and method for preparing the same

Alternative integration for redistribution layer process

Semiconductor device

Bond pads for low temperature hybrid bonding

Semiconductor package

Conductive traces in semiconductor devices and methods of forming same

Method of manufacturing a semiconductor device having a bond wire or clip bonded to a bonding pad

Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment

Bond pad with micro-protrusions for direct metallic bonding

Selective recess of interconnects for probing hybrid bond devices

Contact pad for semiconductor device

Method for manufacturing a semiconductor device including patterning a polymer layer to reduce stress

Semiconductor device packages and methods of manufacturing the same

Semiconductor device and method of manufacture

Substrate structure of semiconductor device package and method of manufacturing the same

Integrated circuit device structures and double-sided electrical testing

Semiconductor device assembly with die support structures

Pillar-last methods for forming semiconductor devices

Back-illuminated semiconductor photodetection element

Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same

Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Redistribution layer metallic structure and method

Stacked via structure

Lead frame, package structure and method for manufacturing the same

Transfer carrier for micro light-emitting element

Method of manufacturing semiconductor device and semiconductor device

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

Wire bond pad design for compact stacked-die package

Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the same

Composition for cobalt or cobalt alloy electroplating

Variation of metal layer stack under under bump metallization (UBM)

Contact photolithography-based nanopatterning using photoresist features having re-entrant profiles

Device and Method for UBM/RDL Routing

Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device and method of manufacturing the semiconductor device

High speed, high density, low power die interconnect system

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

Methods and apparatus for processing a substrate

Hybrid bonding contact structure of three-dimensional memory device

Bonded three-dimensional memory devices having bonding layers

Bonded three-dimensional memory devices and methods for forming the same

Bonded semiconductor structure and method for forming the same

Bump structure and method of manufacturing bump structure

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device with spacer over bonding pad

Bond pads of semiconductor devices

Semiconductor structure and method of fabricating the same

Semiconductor device and power amplifier module

3DIC formation with dies bonded to formed RDLs

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

Stacked semiconductor package

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Integrated fan-out package

Semiconductor device with contact pad and method of making

Connector structure and method of forming same

Semiconductor device bonding area including fused solder film and manufacturing method

Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same

Chip structure and method for forming the same

Hybrid under-bump metallization component

Semiconductor structure and manufacturing method thereof

Wafer chip scale package

Chip packaging method and chip packaging structure

DISPLAY PANEL, PREPARATION METHOD THEREOF AND DISPLAY DEVICE

Semiconductor device and method for fabricating the same

Semiconductor apparatus and equipment

Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar

Stacked semiconductor devices and methods of forming same

Method of fabricating package structure

Prevention of metal pad corrosion due to exposure to halogen

Film structure for bond pad

Semiconductor device and method

E-fuse enhancement by underlayer layout design

Semiconductor structure and manufacturing method thereof

Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer

Multi-chip semiconductor package

Driving substrate and manufacturing method thereof, and micro LED bonding method

Wafer-level package including under bump metal layer

Semiconductor substrate having a bond pad material based on aluminum

SEMICONDUCTOR DEVICE

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor storage device

DISPLAY ELEMENT, DISPLAY DEVICE AND METHOD FOR PRODUCING A CONTACT STRUCTURE IN A PLURALITY OF DISPLAY ELEMENTS

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

Chip package, method of forming a chip package and method of forming an electrical contact

Packages with Si-substrate-free interposer and method forming same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacture

Semiconductor device and method for fabricating the same

Flat metal features for microelectronics applications

Method of forming an interconnect in a semiconductor device

Fingerprint sensor device and method

Semiconductor device packages and methods of manufacturing the same

Integrated circuit features with obtuse angles and method of forming same

Embedded component package structure and manufacturing method thereof

Semiconductor device with exposed input/output pad in recess

Methods of manufacturing semiconductor devices

Chemical mechanical polishing for hybrid bonding

Bond pad structure with reduced step height and increased electrical isolation

Semiconductor device and method of manufacturing the same

Interconnect structure, semiconductor structure including interconnect structure and method for forming the same

Metal layer patterning for minimizing mechanical stress in integrated circuit packages

Textured bond pads

Semiconductor device and method of manufacturing the same

Package having different metal densities in different regions and manufacturing method thereof

Semiconductor device

Semiconductor package for thermal dissipation

Semiconductor device and method of forming insulating layers around semiconductor die

Semiconductor package

Pad design for reliability enhancement in packages

Bonding structure and method of forming same

Package and manufacturing method thereof

First wafer, fabricating method thereof and wafer stack

Multi-pitch ball grid array

METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHANICAL PLANARIZATION IN WAFER-LEVEL PACKAGING APPLICATIONS

Die stack structure

Interconnect structure and method of forming same

Semiconductor component and manufacturing method thereof

Pad structure and manufacturing method thereof in semiconductor device

Anisotropic carrier for high aspect ratio fanout

Semiconductor device packages including an inductor and a capacitor

Solid-state image pickup element and electronic apparatus

Isolation structure for bond pad structure

Hybrid bonding using dummy bonding contacts

Method for forming package structure with a barrier layer

Method for producing a connection between component parts

Semiconductor bonding structure and method of manufacturing the same

Integrated circuit backside metallization

Integrated circuit device with through interconnect via and methods of manufacturing the same

Vertical memory device and method for fabricating vertical memory device

Multi-die package structures including redistribution layers

Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same

Polymer resin and compression mold chip scale package

Packaging devices and methods of manufacture thereof

Solder bump formation using wafer with ring

Integration and bonding of micro-devices into system substrate

Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof

Semiconductor devices having crack-inhibiting structures

Bond pad reliability of semiconductor devices

DISPLAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY DEVICE

Semiconductor device

Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch

Integrated circuit packages and methods of forming same

Display device and method for manufacturing the same

Composite semiconductor component having projecting elements projecting from a carrier substrate and method for producing the composite semiconductor component

Thermal pads between stacked semiconductor dies and associated systems and methods

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Semiconductor package and method of manufacturing the same

Bonding pad structure for memory device and method of manufacturing the same

Electrical connection structure and method of forming the same

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Method for manufacturing semiconductor structure

Method for the electrical bonding of semiconductor components

Semiconductor package

Semiconductor devices and semiconductor packages including the same

Semiconductor structure

Semiconductor device and method to minimize stress on stack via

Package structure and method of forming thereof

Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices

Semiconductor structure and method for forming the same

Passivation scheme for pad openings and trenches

Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same

Wafer structure and method for manufacturing the same, and chip structure

Low temperature bonded structures

Semiconductor package for wafer level packaging and manufacturing method thereof

Semiconductor package having a laser-activatable mold compound

Semiconductor structure, 3DIC structure and method of fabricating the same

Semiconductor structure and manufacturing method thereof

Packaged semiconductor devices for high voltage with die edge protection

Semiconductor device with a dielectric between portions

Image sensor with pad structure

Fan-out package and methods of forming thereof

Seal ring for hybrid-bond

Die-on-interposer assembly with dam structure and method of manufacturing the same

Encapsulated light emitting diodes for selective fluidic assembly

Adhesive bonding composition and method of use

METHOD OF SELF-ASSEMBLY WITH A HYBRID MOLECULAR BONDING

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device

Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask

Bond pad structure for bonding improvement

Semiconductor memory device structure

Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength

Semiconductor substrate and manufacturing method therefor

Stacked via structure

Integrated fan-out package structures with recesses in molding compound

Semiconductor wafer with void suppression and method for producing same

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Three-dimensional memory device with embedded dynamic random-access memory

Interconnect structures and methods of forming same

Semiconductor device and fabrication method of the semiconductor device

Semiconductor device and method of manufacturing the same

Via structure for semiconductor dies

Semiconductor device with bond pad extensions formed on molded appendage

Semiconductor device having capacitor

Electronic device, electronic module and methods for fabricating the same

Three-dimensional memory device having an epitaxial vertical semiconductor channel and method for making the same

Integrated fan-out package and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

Electrical binding structure and method of forming the same

ELECTRICAL BINDING STRUCTURE AND METHOD OF FORMING THE SAME

Through-silicon via with low-K dielectric liner

Packaged dies with metal outer layers extending from die back sides toward die front sides

Package with UBM and methods of forming

Fan-out interconnect structure and method for forming same

Semiconductor device and method of manufacturing the same

Stiffener package and method of fabricating stiffener package

Method of designing a layout, method of making a semiconductor structure and semiconductor structure

Semiconductor structure and method for forming the same

Bonding support structure (and related process) for wafer stacking

Alignment marks in substrate having through-substrate via (TSV)

Semiconductor package substrate and method of manufacturing semiconductor package using the same

Semiconductor structure and manufacturing method thereof

Triode packaging method and triode

Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices

Electromagnetic interference shield created on package using high throughput additive manufacturing

Packages with Si-substrate-free interposer and method forming same

Method of forming and packaging semiconductor die

SEMICONDUCTOR DEVICE INCLUDING RESIDUAL TEST PATTERN

Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby

Embedded component package structure, embedded type panel substrate and manufacturing method thereof

Three-dimensional device with bonded structures including a support die and methods of making the same

Hybrid bonding contact structure of three-dimensional memory device

Semiconductor device and method of manufacturing the same

Methods for processing high electron mobility transistor (HEMT)

Three-dimensional device with bonded structures including a support die and methods of making the same

Optical semiconductor package and method for manufacturing the same

SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES

Method of fabricating package structure

Methods of bonding the strip-shaped under bump metallization structures

Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration

Method for manufacturing semiconductor device and semiconductor device

Nanowire bonding interconnect for fine-pitch microelectronics

Field effect transistor and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package and manufacturing method thereof

Micro-connection structure and manufacturing method thereof

Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

Bonded assembly containing multiple memory dies sharing peripheral circuitry on a support die and methods for making the same

Multi-die package with bridge layer

Testing of semiconductor chips with microbumps

Method of manufacturing semiconductor device

EXPANDED HEAD PILLAR FOR BUMP BONDS

Semiconductor device and manufacturing method of semiconductor device

Method for manufacturing electronic package

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

Batch manufacture of component carriers

Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip

Redistribution layer (RDL) structure and method of manufacturing the same

Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar

Method of producing a substrate and system for producing a substrate

Nanostructure barrier for copper wire bonding

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

Through silicon via design for stacking integrated circuits

Three-dimensional semiconductor chip containing memory die bonded to both sides of a support die and methods of making the same

Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods

Hybrid bonding using dummy bonding contacts

Film scheme for bumping

Semiconductor structures

Conductive structures and redistribution circuit structures

Die stack structure and method of fabricating the same and package

RF devices with enhanced performance and methods of forming the same

Semiconductor device

Three-dimensional integrated circuit and method of manufacturing the same

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment

Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same

3D processor having stacked integrated circuit die

Method for forming interconnect structure

Semiconductor device and method of forming a 3D integrated system-in-package module

Fingerprint sensor and manufacturing method thereof

Microcontroller unit and fabrication method thereof

Packaged semiconductor device with electroplated pillars

Semiconductor devices having crack-inhibiting structures

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS

Methods for forming microwave tunable composited thin-film dielectric layer

Semiconductor device and method of manufacturing the same

Interconnect structures for preventing solder bridging, and associated systems and methods

Integrated circuit backside metallization

Chip packaging method and package structure

Offset-aligned three-dimensional integrated circuit

Method and structures for low temperature device bonding

Method for producing semiconductor device

Wiring structure, electronic device and method for manufacturing the same

Method for forming a semiconductor package