Bond pads for low temperature hybrid bonding

Sensor systems and methods for providing sensor systems

Semiconductor package

Fan-out semiconductor packages

Conductive traces in semiconductor devices and methods of forming same

Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive

Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment

Semicondutor package structures and methods of manufacturing the same

Organic light emitting diode display device and method of manufacturing the same

Semiconductor devices with package-level configurability

Stacked chips comprising interconnects

Three-dimensional chip packaging structure and method thereof

Bond pad with micro-protrusions for direct metallic bonding

Contact pad for semiconductor device

Method for manufacturing a semiconductor device including patterning a polymer layer to reduce stress

Semiconductor device packages and methods of manufacturing the same

Package structure and method of fabricating the same

Semiconductor device and method of manufacture

Semiconductor device with through-substrate via

Substrate structure of semiconductor device package and method of manufacturing the same

Integrated circuit device structures and double-sided electrical testing

Semiconductor package including dummy chip on a first semiconductor chip and laterally spaced apart from a second semiconductor chip

Chip package structure with stacked chips and manufacturing method thereof

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS

Semiconductor device assembly with die support structures

Arrangement of bond pads on an integrated circuit chip

Semiconductor package

Electronic device package and method for manufacturing the same

Through-substrate via structure and method of manufacture

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

Pillar-last methods for forming semiconductor devices

Semiconductor wafer and semiconductor device for suppressing the propagation of cracks

Semiconductor device package and method of manufacturing the same

Vertical memory device having improved electrical characteristics and method of operating the same

Back-illuminated semiconductor photodetection element

Structure and method for cooling three-dimensional integrated circuits

Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same

Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Redistribution layer metallic structure and method

Semiconductor device package and method for manufacturing the same

Lead frame, package structure and method for manufacturing the same

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME

Semiconductor memory

Method of manufacturing semiconductor device and semiconductor device

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

Wire bond pad design for compact stacked-die package

Semiconductor device package and method for packaging the same

3D Integrated Circuit and Methods of Forming the Same

Electronic device, device package, and method of fabrication

Composition for cobalt or cobalt alloy electroplating

Variation of metal layer stack under under bump metallization (UBM)

Contact photolithography-based nanopatterning using photoresist features having re-entrant profiles

Semiconductor memory device and manufacturing method thereof

Semiconductor packages having improved reliability in bonds between connection conductors and pads

Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same

Semiconductor device with edge-protecting spacers over bonding pad

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device package with conductive pillars and reinforcing and encapsulating layers

Fanout integration for stacked silicon package assembly

Electronic device package and method for manufacturing the same

Bonded semiconductor structure and method for forming the same

Bump structure and method of manufacturing bump structure

Semiconductor chip formed using a cover insulation layer and semiconductor package including the same

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device with spacer over bonding pad

Bond pads of semiconductor devices

Semiconductor device having a bonding pad area of a first wiring layer overlaps a bonding pad electrode of a second wiring layer

Semiconductor structure and method of fabricating the same

Semiconductor device and power amplifier module

Variable die size memory device and methods of manufacturing the same

Sawing underfill in packaging processes

Forming of bump structure

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Integrated fan-out package

METAL ON MOLD COMPOUND IN FAN-OUT WAFER-LEVEL PACKAGING OF INTEGRATED CIRCUITS

Semiconductor power module with temperature sensors and shaped top plate to equalize current paths

Through-Substrate Vias with Improved Connections

Semiconductor device with contact pad and method of making

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Antenna module

SUBSTRATE MOUNTING METHOD AND ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE

Nonvolatile memory device having stacked structure with spaced apart conductive layers

Soldering a conductor to an aluminum metallization

CHIP-PACKAGE DEVICE

Semiconductor device

Connector structure and method of forming same

Semiconductor device bonding area including fused solder film and manufacturing method

Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same

Chip structure and method for forming the same

Method of making moisture barrier for bond pads and integrated circuit having the same

PACKAGE STRUCTURE WITH BUMP

SEMICONDUCTOR PACKAGES

Fan-out type semiconductor packages and methods of manufacturing the same

Fan-out semiconductor package and electronic device including the same

Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device

Light emitting diode module and display device having the same

Device assembly structure and method of manufacturing the same

Display device incorporating self-assembled monolayer and method of manufacturing the same

Wafer chip scale package

Structure with controlled capillary coverage

DISPLAY PANEL, PREPARATION METHOD THEREOF AND DISPLAY DEVICE

Semiconductor device and method for fabricating the same

Die-to-wafer bonding structure and semiconductor package using the same

Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar

PAD STRUCTURE

Semiconductor devices including a thick metal layer

SILICON ON DIAMOND THERMAL AND SHIELDING MITIGATION

Stacked semiconductor devices and methods of forming same

Semiconductor apparatus for reducing parasitic capacitance

Intelligent power module containing IGBT and super-junction MOSFET

Scheme for enabling die reuse in 3D stacked products

Semiconductor package with shared barrier layer in redistribution and via

Vias in composite IC chip structures

Redistribution layers and methods of fabricating the same in semiconductor devices

Prevention of metal pad corrosion due to exposure to halogen

Film structure for bond pad

Semiconductor device and method

Integrated capacitor with extended head bump bond pillar

Semiconductor structure and manufacturing method thereof

DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT

Circuit member joint structure and circuit member joining method

Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer

Semiconductor structure and manufacturing method thereof

Shielding structures

Wafer-level package including under bump metal layer

Semiconductor substrate having a bond pad material based on aluminum

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit structure

Distribution layer structure and manufacturing method thereof, and bond pad structure

Semiconductor package and manufacturing method thereof

Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and method of fabricating the semiconductor structure

Semiconductor device

Semiconductor device

Semiconductor memory device

Semiconductor storage device

Semiconductor storage device including first pads on a first chip that are bonded to second pads on a second chip

DISPLAY ELEMENT, DISPLAY DEVICE AND METHOD FOR PRODUCING A CONTACT STRUCTURE IN A PLURALITY OF DISPLAY ELEMENTS

ELECTRIC DEVICE WITH TWO OR MORE CHIP COMPONENTS

Package and manufacturing method of reconstructed wafer

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

Chip package, method of forming a chip package and method of forming an electrical contact

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of manufacture

Integrated circuit device including support patterns and method of manufacturing the same

Semiconductor device and method for fabricating the same

Chip package and manufacturing method thereof

Method of fabricating a semiconductor package

Flat metal features for microelectronics applications

Method of forming an interconnect in a semiconductor device

Fingerprint sensor device and method

Multilayered memory device with through-silicon via(TSV), semiconductor device and method for manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor package structure and method of manufacturing the same

Connection arrangement, component carrier and method of forming a component carrier structure

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE BUMPS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Semiconductor device

Semiconductor device having first and second terminals

Moisture barrier for bond pads and integrated circuit having the same

Chip package structure using silicon interposer as interconnection bridge

Semiconductor die contact structure and method

Embedded component package structure and manufacturing method thereof

Bonding alignment marks at bonding interface

Board having electronic component embedded therein

Compound semiconductor device

Manufacturing method of chip package

Memory device

Integrated circuit device

Semiconductor device with exposed input/output pad in recess

Semiconductor package and manufacturing method thereof

Electronic device having a curved portion between a plurality of conductive portions on a substrate

Methods of manufacturing semiconductor devices

Chip with magnetic interconnect alignment

Semiconductor device

Chemical mechanical polishing for hybrid bonding

Integrated circuit device having redistribution pattern

Chip package structure

Semiconductor packages having conductive pillars with inclined surfaces and methods of forming the same

Semiconductor device and method of manufacturing the same

Interconnect structure, semiconductor structure including interconnect structure and method for forming the same

Bond pad structure for semiconductor device and method of forming same

Metal layer patterning for minimizing mechanical stress in integrated circuit packages

Textured bond pads

Semiconductor device and method of manufacturing the same

Package having different metal densities in different regions and manufacturing method thereof

Semiconductor packages

Semiconductor module

Semiconductor die, semiconductor wafer, semiconductor device including the semiconductor die and method of manufacturing the semiconductor device

Semiconductor devices and methods of manufacturing semiconductor devices

Nonvolatile memory device, storage device, and operating method of nonvolatile memory device

Semiconductor device and amplifier assembly

Semiconductor device and inverter

Semiconductor device

Semiconductor device package and method of manufacturing the same

Semiconductor package for thermal dissipation

Sawing underfill in packaging processes

Semiconductor package including stacked semiconductor chips and method for fabricating the same

Semiconductor device and method of forming insulating layers around semiconductor die

Semiconductor device and method of manufacturing the same

Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys

Solder pads of variable thickness in an optoelectronic semiconductor chip, on a connection substrate for mounting a semiconductor chip, method of producing an optoelectronic component, and optoelectronic component having the solder pads

Semiconductor package

Package and manufacturing method thereof

Semiconductor device including a plurality of bonding pads

Semiconductor memory device with chip-to-chip bonding structure

First wafer, fabricating method thereof and wafer stack

Semiconductor chip including low-k dielectric layer

Flexible semiconductor package formed by roll-to-roll process

Semiconductor package, manufacturing method of semiconductor device and semiconductor package

Temporary post-assisted embedding of semiconductor dies

Image sensor

Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same

Interconnect structure and method of forming same

Semiconductor component and manufacturing method thereof

Pad structure and manufacturing method thereof in semiconductor device

Package substrate and semiconductor package including the same

FAN-OUT CHIP PACKAGE ASSEMBLY AND FAN-OUT BOTTOM PACKAGE WITH FINE PITCH SILICON THROUGH VIA

FAN-OUT SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

Semiconductor device packages including an inductor and a capacitor

Solid-state image pickup element and electronic apparatus

IMAGE SENSOR WITH ENHANCED MULTI-SUBSTRATE STRUCTURES AND INTERCONNECTS

Array substrate, display panel, and display device

Interconnect structure of three-dimensional memory device

Semiconductor package and method of fabricating the same

Semiconductor devices including a thick metal layer and a bump

Metal-insulator-metal (MIM) capacitor

Semiconductor device and method of forming micro interconnect structures

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Memory device including circuitry under bond pads

Antenna module and electronic system including the same

Semiconductor memory device having three-dimensional structure and method for manufacturing the same

Three-dimensional memory devices and fabricating methods thereof

Multi-chip package

Soldering a conductor to an aluminum layer

Chip structure and manufacturing method thereof

Method for forming package structure with a barrier layer

Semiconductor structure and method for manufacturing the same

Method for producing a connection between component parts

Semiconductor bonding structure and method of manufacturing the same

Integrated circuit backside metallization

Integrated circuit device with through interconnect via and methods of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor package with a trench portion

Semiconductor package and manufacturing method thereof

Step-type stacked chip packaging structure based on resin spacer and preparation process

Pad structure for front side illuminated image sensor

Wirebondable interposer for flip chip packaged integrated circuit die

Semiconductor package with thick under-bump terminal

Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same

Semiconductor package structure and method of manufacturing the same

Polymer resin and compression mold chip scale package

Packaging devices and methods of manufacture thereof

Semiconductor packages

Semiconductor packages including a recessed conductive post

Semiconductor packages with external bump pads having trench portions and semiconductor modules including the semiconductor packages

Embedded metal insulator metal structure

Semiconductor memory device and manufacturing method thereof

Integration and bonding of micro-devices into system substrate

Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof

Semiconductor devices having crack-inhibiting structures

Semiconductor device including through substrate vias and method of manufacturing the semiconductor device

Wafer-level stack chip package and method of manufacturing the same

Method of forming semiconductor device having a dual material redistribution line and semiconductor device

Forming a lock structure in a semiconductor chip pad

Semiconductor package including stacked semiconductor chips

Bond pad reliability of semiconductor devices

3D Integrated Circuit and Methods of Forming the Same

Semiconductor device

Semiconductor device encapsulated by molding material attached to redestribution layer

Semiconductor device and method of manufacturing

Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch

Semiconductor packages including through holes and methods of fabricating the same

Semiconductor devices comprising getter layers and methods of making and using the same

Nonvolatile memory devices

Composite semiconductor component having projecting elements projecting from a carrier substrate and method for producing the composite semiconductor component

Semiconductor device including high speed heterogeneous integrated controller and cache

Stacking structure, package structure and method of fabricating the same

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Bonding pad structure for memory device and method of manufacturing the same

Semiconductor die with conversion coating

Method of manufacturing package structure

Electrical connection structure and method of forming the same

Method for forming semiconductor structure

Nonvolatile memory device with capability of determing degradation of data erase characteristics

Crystal growth method in a semiconductor device

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Integrated multiple-path power amplifier

Method for testing a high voltage transistor with a field plate

System-in-package with double-sided molding

Method for the electrical bonding of semiconductor components

Package structure

Semiconductor package

Semiconductor devices and semiconductor packages including the same