207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Semiconductor devices having crack-inhibiting structures
#3602Semiconductor structure
#3603Energy storage interposer device with conductive nanostructures
#3604Package structures and methods of forming the same
#3605Semiconductor device and method to minimize stress on stack via
#3606Semiconductor device and manufacturing method of semiconductor device including a through electrode for connection of wirings
#3607Nonvolatile memory device and method of programming in the same
#3608Nonvolatile memory device and memory system including the same
#3609Solid-state image-capturing device, semiconductor apparatus, electronic apparatus, and manufacturing method
#3610Resistive element
#3611IC package with multiple dies
#3612Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
#3613Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices
#3614SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
#3615Passivation scheme for pad openings and trenches
#3616Method of manufacturing intergrated fan-out package with redistribution structure
#3617Localized high density substrate routing
#3618SEMICONDUCTOR DEVICE
#3619Display device
#3620Active package substrate having anisotropic conductive layer
#3621Shield structure for backside through substrate vias (TSVs)
#3622Semiconductor devices
#3623Tool for metal plugging or sealing of casing
#3624Stack packages including an interconnection structure
#3625Integrated circuit package and method
#3626MEMORY DEVICE
#3627Semiconductor package having a laser-activatable mold compound
#3628Semiconductor structure, 3DIC structure and method of fabricating the same
#3629Semiconductor structure and manufacturing method thereof
#3630Packages with Si-substrate-free interposer and method forming same
#3631Packaged semiconductor devices for high voltage with die edge protection
#3632Semiconductor device with a dielectric between portions
#3633Method for manufacturing semiconductor device with metallization structure
#3634Memory controller, memory device and memory system having improved threshold voltage distribution characteristics and related operating methods
#3635Image sensor with pad structure
#3636Sensors having an active surface
#3637Semiconductor package and method of forming the same
#3638Reduced-length bond pads for broadband power amplifiers
#3639Semiconductor package including passive device embedded therein and method of manufacturing the same
#3640Bonding wire for semiconductor device
#3641SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF
#3642Semiconductor package including heat redistribution layers
#3643Die-on-interposer assembly with dam structure and method of manufacturing the same
#3644Integrated fan-out package and manufacturing method thereof
#3645Semiconductor device
#3646Semiconductor device, manufacturing method thereof, and electronic apparatus
#3647Semiconductor device and electronic apparatus
#3648Non-volatile memory
#3649Adhesive bonding composition and method of use
#3650Via structure for packaging and a method of forming
#3651Semiconductor module and method of manufacturing semiconductor module
#3652Semiconductor devices having landing pads
#3653Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#3654Package with tilted interface between device die and encapsulating material
#3655Substrate bonding structure and substrate bonding method
#3656Cache program operation of three-dimensional memory device with static random-access memory
#3657Semiconductor device
#3658Manufacturing method of semiconductor device
#3659Bond pad structure for bonding improvement
#3660Semiconductor memory device structure
#3661Semiconductor packages with crack preventing structure
#3662Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength
#3663Semiconductor substrate and manufacturing method therefor
#3664Semiconductor device, imaging device, and manufacturing apparatus
#3665Power semiconductor device and method of manufacturing the same
#3666Method of manufacturing a flip chip package and an apparatus for testing flip chips
#3667Vertical memory device having improved electrical characteristics and method of operating the same
#3668Semiconductor device structure with magnetic element
#3669Image sensor package including reflector
#3670Memory device
#3671Stack packages including a fan-out sub-package
#3672Integrated fan-out package structures with recesses in molding compound
#3673HYBRID MOLECULAR BONDING METHOD AND ELECTRONIC CIRCUITS FOR IMPLEMENTING SUCH A METHOD
#3674Semiconductor wafer with void suppression and method for producing same
#3675WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#3676Non-volatile memory device and method of operating the same
#3677Three-dimensional NAND flash memory device having improved data reliability by varying program intervals, and method of operating the same
#3678Three-dimensional memory device with embedded dynamic random-access memory
#3679Semiconductor memory
#3680Semiconductor packages and methods of forming same
#3681Interconnect structures and methods of forming same
#3682Semiconductor device and method of manufacturing the same
#3683Via structure for semiconductor dies
#3684Semiconductor device with bond pad extensions formed on molded appendage
#3685Semiconductor device having capacitor
#3686Through via structure and method
#3687Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same
#3688Memory device with improved program performance and method of operating the same
#3689Semiconductor memory device with a plurality of sense amplifiers overlapping a plurality of metal joints
#3690Semiconductor device
#3691Integrated fan-out package and manufacturing method thereof
#3692Chip Packaging Structure and Related Inner Lead Bonding Method
#3693Semiconductor wafer, bonding structure and wafer bonding method
#3694Semiconductor package including multiple semiconductor chips
#3695Semiconductor device and a method of manufacturing the same
#3696CENTRIPETAL BUMPING LAYOUT AND METHOD
#3697Fan-out semiconductor package
#3698Device isolators
#3699Through-silicon via with low-K dielectric liner
#3700Packaged dies with metal outer layers extending from die back sides toward die front sides
#3701Micro device integration into system substrate
#3702Driving chip including bonding pads in non-display area and display panel
#3703Package with UBM and methods of forming
#3704Semiconductor package and manufacturing method thereof
#3705Fan-out interconnect structure and method for forming same
#3706SEMICONDUCTOR CHIPS INCLUDING REDISTRIBUTION LAYER
#3707Wafer-level bonding of obstructive elements
#3708Protective elements for bonded structures
#3709Protective elements for bonded structures including an obstructive element
#3710Semiconductor device and method of manufacturing the same
#3711Forming bonding structures by using template layer as templates
#3712Integrated ESD event sense detector
#3713Junction structure
#3714Chip structure
#3715IC chip layout for minimizing thermal expansion misalignment
#3716Semiconductor devices having a non-galvanic connection
#3717Semiconductor structure and method for forming the same
#3718Antenna module
#3719Semiconductor device with shielding structure for cross-talk reduction
#3720Alignment marks in substrate having through-substrate via (TSV)
#3721Insulated gate bipolar transistor module, conductor installing structure therefor, and inverter
#3722Bonded nanofluidic device chip stacks
#3723Semiconductor package
#3724Semiconductor package substrate and method of manufacturing semiconductor package using the same
#3725Semiconductor structure and manufacturing method thereof
#3726Triode packaging method and triode
#3727Semiconductor package
#3728Electromagnetic interference shield created on package using high throughput additive manufacturing
#3729CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#3730Semiconductor device and method of manufacturing the same
#3731Interposer, microelectronic device assembly including same and methods of fabrication
#3732Semiconductor storage device and method of manufacturing the same
#3733Power integrated module
#3734SEMICONDUCTOR DEVICE
#3735Film for a package substrate
#3736Semiconductor device and method of inspecting semiconductor device
#3737SEMICONDUCTOR DEVICE INCLUDING RESIDUAL TEST PATTERN
#3738Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#3739Housing via for semiconductor current sensor
#3740Display driver integrated circuit device
#3741Semiconductor device and method of manufacturing the same
#3742Method for producing a connection between component parts, and component made of component parts
#3743Flip chip package utilizing trace bump trace interconnection
#3744Electronic component
#3745Non-volatile memory with capacitors using metal under signal line or above a device capacitor
#3746Non-volatile memory with capacitors using metal under signal line or above a device capacitor
#3747Fan-out semiconductor package and electronic device including the same
#3748Sensor package and manufacturing method thereof
#3749Methods for processing high electron mobility transistor (HEMT)
#3750Method of providing partial electrical shielding
#3751Semiconductor apparatus and device
#3752Three-dimensional device with bonded structures including a support die and methods of making the same
#3753Forming recesses in molding compound of wafer to reduce stress
#3754Formation of bonding wire vertical interconnects
#3755Semiconductor structure and manufacturing method thereof
#3756SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
#3757Integrated circuit package with pre-wetted contact sidewall surfaces
#3758Method of fabricating package structure
#3759Multi-chip structure and method of forming same
#3760Semiconductor device with bonding pads and method of manufacturing the same
#3761Methods of bonding the strip-shaped under bump metallization structures
#3762Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#3763Method for manufacturing semiconductor device and semiconductor device
#3764Nanowire bonding interconnect for fine-pitch microelectronics
#3765Array substrate, display panel, and display device having a notched display area
#3766Field effect transistor and semiconductor device
#3767Plurality of different size metal layers for a pad structure
#3768SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3769Micro-connection structure and manufacturing method thereof
#3770Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package
#3771Semiconductor component and semiconductor package
#3772VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#3773Display device
#3774Integrated display devices
#3775Die stack assembly using an edge separation structure for connectivity through a die of the stack
#3776Semiconductor device and method of manufacturing semiconductor device
#3777Bump structure manufacturing method
#3778Semiconductor device
#3779DETACHABLE BONDING STRUCTURE AND METHOD OF FORMING THEREOF
#3780Semiconductor package
#3781Semiconductor package with leadframe having pre-singulated leads or lead terminals
#3782Multi-die package with bridge layer
#3783Testing of semiconductor chips with microbumps
#3784EXPANDED HEAD PILLAR FOR BUMP BONDS
#3785Semiconductor device and manufacturing method of semiconductor device
#3786Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating
#3787Die package and method of forming a die package
#3788Method for manufacturing electronic package
#3789Optical scrambler with nano-pyramids
#3790Package structure and manufacturing method thereof
#3791Batch manufacture of component carriers
#3792Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#3793Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip
#3794Redistribution layer (RDL) structure and method of manufacturing the same
#3795Semiconductor device and method for manufacturing the same
#3796Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillar
#3797Nanostructure barrier for copper wire bonding
#3798NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
#3799Method of manufacturing an electronic device
#3800Semiconductor element
#3801Semiconductor memory device and method of manufacturing the same
#3802Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#3803Soldering a conductor to an aluminum metallization
#3804Film scheme for bumping
#3805Via for semiconductor device connection and methods of forming the same
#3806Semiconductor device
#3807Cascode semiconductor device and method of manufacture
#3808Microelectronic assembly from processed substrate
#3809Semiconductor device
#3810Three-dimensional integrated circuit and method of manufacturing the same
#3811Semiconductor device and method for fabricating the same
#3812RF devices with enhanced performance and methods of forming the same
#3813Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#3814Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same
#3815Semiconductor structure and manufacturing method thereof
#3816Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chip
#3817Devices and methods of vertical integrations of semiconductor chips, magnetic chips, and lead frames
#3818Method for forming interconnect structure
#3819Semiconductor device and method of forming a 3D integrated system-in-package module
#3820Chip assembly
#3821System-in-package with double-sided molding
#3822Soldering a conductor to an aluminum metallization
#3823SEMICONDUCTOR PACKAGE
#3824Electronic device, connection body, and manufacturing method for electronic device
#3825Microfeature workpieces having alloyed conductive structures, and associated methods
#3826Fingerprint sensor and manufacturing method thereof
#38273D chip sharing power interconnect layer
#3828Microcontroller unit and fabrication method thereof
#3829Apparatuses and methods for arranging through-silicon vias and pads in a semiconductor device
#3830Semiconductor Package
#3831Packaged semiconductor device with electroplated pillars
#3832Semiconductor package having a sidewall connection
#3833Semiconductor devices having crack-inhibiting structures
#3834Semiconductor devices having crack-inhibiting structures
#3835SEMICONDUCTOR MODULE
#3836METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#3837Methods for forming microwave tunable composited thin-film dielectric layer
#3838Resistor element
#3839Semiconductor device and method of manufacturing the same
#3840Display device having a plurality of pad terminals including connection pad terminals and dummy pad terminals
#3841Semiconductor device
#3842Semiconductor structure
#3843Method for packaging semiconductor dies
#3844Chip package structure and method for forming the same
#3845Interconnect structures for preventing solder bridging, and associated systems and methods
#3846Chip packaging method and package structure
#3847Integrated circuit backside metallization
#3848Semiconductor package
#3849Method for bonding and interconnecting semiconductor chips
#3850Fan-out electronic device
#3851Chip packaging method and package structure
#3852Chip packaging method and package structure
#3853Offset-aligned three-dimensional integrated circuit
#3854Electronic device including electrical connections on an encapsulation block
#3855Method and structures for low temperature device bonding
#3856Semiconductor device having circuit board to which contact part is bonded
#3857Method for producing semiconductor device
#3858High voltage semiconductor devices having improved electric field suppression
#3859Method for forming a semiconductor package
#3860Semiconductor element and method for identifying semiconductor element
#3861Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#3862Integrally-formed multiple-path power amplifier with on-die combining node structure
#3863Organic light emitting diode array substrate and electronic device
#3864Interposer and semiconductor package including the same
#3865Semiconductor device and method of manufacturing thereof
#3866Integrated device packages with passive device assemblies
#3867Semiconductor device and method of manufacturing a semiconductor device
#3868Packaged semiconductor system having unidirectional connections to discrete components
#3869Die attach surface copper layer with protective layer for microelectronic devices
#3870Semiconductor device and power amplifier module
#3871Semiconductor arrangement
#3872Package comprising chip contact element of two different electrically conductive materials
#3873Semiconductor package and method for fabricating base for semiconductor package
#3874Bonding pads with thermal pathways
#3875Isolation cavities in semiconductor devices
#3876Through-substrate via structures in semiconductor devices
#3877Solid-state image pickup element and electronic apparatus
#3878Photoelectric conversion device
#3879METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
#3880Semiconductor device package including embedded conductive elements
#3881Shielding structures
#3882Bonding pad, semiconductor structure, and method of manufacturing semiconductor structure
#3883RF power amplifier pallet
#3884Biological information detecting apparatus
#3885Radio-frequency isolation using backside cavities
#3886Semiconductor package having a redistribution layer for package-on-package structure
#3887METHODS OF FABRICATING SEMICONDUCTOR PACKAGE
#3888METHODS OF FABRICATING SEMICONDUCTOR PACKAGE
#3889Lead-free solder joining of electronic structures
#3890Chip package structure
#3891Electronic component and device
#3892Wafer-level package including under bump metal layer
#3893Amplifier and amplification apparatus
#3894DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED AREA
#3895Chip package
#3896Structure for standard logic performance improvement having a back-side through-substrate-via
#3897Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package
#3898Semiconductor device
#3899Semiconductor device with contact pad
#3900Bonding alignment marks at bonding in interface