207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Semiconductor packages with asymmetric connection configurations
#12002SER immune cell structure
#12003Active area bonding compatible high current structures
#12004High density direct connect loc assembly
#12005Flip-chip semiconductor device utilizing an elongated tip bump
#12006Wire positioning and mechanical attachment for a radio-frequency indentification device
#12007Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor
#12008Semiconductor package device and method for fabricating the same
#12009Integration type semiconductor device and method for manufacturing the same
#12010Semiconductor chip capable of implementing wire bonding over active circuits
#12011Substrate via pad structure providing reliable connectivity in array package devices
#12012Semiconductor device with crack-resistant multilayer copper wiring
#12013Wafer structure, chip structure and bumping process
#12014Semiconductor packaging device comprising a semiconductor chip including a MOSFET
#12015Semiconductor wafer with electrically connected contact and test areas
#12016Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
#12017Multi chip package
#12018Electronic device package and electronic equipment
#12019High-powered light emitting device with improved thermal properties
#12020Structured semiconductor element for reducing charging effects
#12021Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#12022Bumping process and structure thereof
#12023Fabrication method of a wafer structure
#12024Method for fabricating semiconductor components
#12025Bond pad structure for integrated circuit chip
#12026LED with self aligned bond pad
#12027Wiring board and method for producing same
#12028Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#12029Semiconductor device and method of fabricating the same
#12030Bond pad structure with stress-buffering layer capping interconnection metal layer
#12031Manufacturing method of solid-state image sensing device
#12032Bumping process and structure thereof
#12033Semiconductor device and manufacturing method of the same
#12034Semiconductor device and method of manufacturing the same
#12035UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE
#12036Bumping process and structure thereof
#12037Compliant interconnects for semiconductors and micromachines
#12038Semiconductor device and method of producing the same
#12039Multi-layer integrated semiconductor structure having an electrical shielding portion
#12040Solderable top metal for SiC device
#12041Circuit carrier and production thereof
#12042Semiconductor device and method of manufacturing the same
#12043Method for making electronic packages
#12044Methods of making microelectronic packages with conductive elastomeric posts
#12045Method for fabricating packaged die
#12046Packaging method for an electronic element
#12047Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#12048Semiconductor device having aluminum electrode and metallic electrode
#12049Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#12050Method of forming a bond pad on an I/C chip and resulting structure
#12051Light emitting semiconductor bonding structure and method of manufacturing the same
#12052Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
#12053Semiconductor device and manufacturing method for the same
#12054Method for manufacturing wafer level chip scale package using redistribution substrate
#12055Method for temporarily engaging electronic component for test
#12056Bonding structure, actuator device and liquid-jet head
#12057Post passivation interconnection schemes on top of the IC chips
#12058Non-Circular via holes for bumping pads and related structures
#12059Resist sidewall spacer for C4 BLM undercut control
#120603D interconnect with protruding contacts
#12061Contour structures to highlight inspection regions
#12062Method of forming bump that may reduce possibility of losing contact pad material
#12063Method of manufacturing a substrate with through electrodes
#12064Redistribution layer of wafer and the fabricating method thereof
#12065Method for forming an electrode
#12066Electronic parts packaging structure and method of manufacturing the same
#12067Structure and method for fabricating a bond pad structure
#12068Semiconductor device and fabrication method thereof
#12069Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices
#12070Copper interconnect
#12071Face-to-face bonded I/O circuit die and functional logic circuit die system
#12072Semiconductor package
#12073Semiconductor substrate thinning method for manufacturing thinned die
#12074Method of forming electrode for semiconductor device
#12075Post passivation interconnection schemes on top of the IC chips
#12076Semiconductor device manufacturing method
#12077Nano-sized metals and alloys, and methods of assembling packages containing same
#12078Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
#12079Semiconductor element including a wet prevention film
#12080Method for manufacturing wafer level chip scale package structure
#12081Reinforced bond pad for a semiconductor device
#12082Top layers of metal for integrated circuits
#12083Post passivation interconnection schemes on top of the IC chips
#12084Top layers of metal for integrated circuits
#12085Aluminum cap for reducing scratch and wire-bond bridging of bond pads
#12086Wafer scale integration packaging and method of making and using the same
#12087Semiconductor device packaged into chip size and manufacturing method thereof
#12088Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
#12089Post passivation interconnection schemes on top of the IC chips
#12090Interconnection structure of integrated circuit chip
#12091Pad structure to prompt excellent bondability for low-k intermetal dielectric layers
#12092Semiconductor device having a switch circuit
#12093Chip structure
#12094Method of stacking thin substrates by transfer bonding
#12095Semiconductor device and fabrication process thereof
#12096Method for producing bumps on an electrical component
#12097Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
#12098Method of forming a wafer backside interconnecting wire
#12099Method for forming a redistribution layer in a wafer structure
#12100Light emitting device
#12101Copper interconnect
#12102Copper interconnect
#12103Copper interconnect
#12104Copper interconnect for semiconductor device
#12105Semiconductor equipment having a pair of heat radiation plates
#12106Semiconductor device and manufacturing method thereof
#12107Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#12108Bump structure
#12109Packaging with metal studs formed on solder pads
#12110Method for supplying solder
#12111Bump structure of semiconductor package and method for fabricating the same
#12112Method of clearing electrical contact pads in thin film sealed OLED devices
#12113Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
#12114Method of manufacturing a semiconductor device
#12115Post passivation interconnection structures
#12116Post passivation interconnection process and structures
#12117Semiconductor device and method for manufacturing the same
#12118Flat chip semiconductor device and manufacturing method thereof
#12119Semiconductor device with reduced contact resistance
#12120Integrated semiconductor circuit and method for producing an integrated semiconductor circuit
#12121Semiconductor device and method for fabricating the same
#12122Post passivation interconnection process and structures
#12123Through-substrate interconnect fabrication methods
#12124Method for reducing lead precipitation during wafer processing
#12125Semiconductor chip packages and methods for fabricating the same
#12126Low stress conductive polymer bump
#12127Semiconductor device
#12128High-reliable semiconductor device using hermetic sealing of electrodes
#12129Through-wafer interconnects for photoimager and memory wafers
#12130Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
#12131Semiconductor and method for producing a semiconductor
#12132Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
#12133Semiconductor device and process for manufacturing the same
#12134Bump structure of an opto-electronic chip
#12135Semiconductor device with simplified constitution
#12136Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#12137Dense intermetallic compound layer
#12138Methods for forming molds
#12139Thermal fatigue resistant tin-lead-silver solder
#12140Electrode structure of a semiconductor device and method of manufacturing the same
#12141Integrated inductors and compliant interconnects for semiconductor packaging
#12142Submember mounted on a chip of electrical device for electrical connection
#12143Method of producing a semiconductor device having a magnetic layer formed thereon
#12144Post passivation interconnection schemes on top of the IC chips
#12145Stretchable semiconductor elements and stretchable electrical circuits
#12146Semiconductor element
#12147Fluxless solder transfer and reflow process
#12148Semiconductor device and manufacturing method of the same
#12149Wafer level package, multi-package stack, and method of manufacturing the same
#12150Power gridding scheme
#12151Semiconductor device with sidewall wiring
#12152Power gridding scheme
#12153Package structure
#12154Metal-metal bonding of compliant interconnect
#12155Selectively coating bond pads
#12156Methods of forming lead free solder bumps
#12157Semiconductor device and fabricating method thereof
#12158Semiconductor device and fabricating method thereof
#12159Method for fabricating semiconductor package with circuit side polymer layer
#12160Semiconductor device
#12161Method for processing a base that includes connecting a first base to a second base with an insulating film
#12162Semiconductor structure
#12163Method for processing base
#12164Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#12165Design of BEOL patterns to reduce the stresses on structures below chip bondpads
#12166Structure with spherical contact pins
#12167Interconnect assemblies and methods
#12168Method of manufacturing semiconductor device with two-step etching of layer
#12169Metal pad of semiconductor device and method for bonding the metal pad
#12170Methods of forming wire bonds for semiconductor constructions
#12171Semiconductor device
#12172Semiconductor device with signal line having decreased characteristic impedance
#12173Front-end processing of nickel plated bond pads
#12174Semiconductor component having a CSP housing
#12175Hermetic chip in wafer form
#12176Semiconductor device and manufacturing method thereof
#12177Chip structure with redistribution traces
#12178Metal bond pad for integrated circuits allowing improved probing ability of small pads
#12179Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
#12180Semiconductor substrate and semiconductor device fabrication method
#12181Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
#12182Method for the producing an integrated circuit bar arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement
#12183Method for fabricating pad redistribution layer
#12184Bump ball device and placing method thereof
#12185Semiconductor device
#12186Formation method and structure of conductive bumps
#12187Device having contact pad with a conductive layer and a conductive passivation layer
#12188Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#12189Structure and formation method of conductive bumps
#12190Semiconductor device and method of manufacturing a semiconductor device
#12191Interconnections of semiconductor device and method of forming the same
#12192Semiconductor package with heat sink
#12193Damascene patterning of barrier layer metal for C4 solder bumps
#12194Method of manufacturing semiconductor device
#12195Castellation wafer level packaging of integrated circuit chips
#12196Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
#12197Semiconductor package including rivet for bonding of lead posts
#12198Design of beol patterns to reduce the stresses on structures below chip bondpads
#12199Connection between a semiconductor chip and a circuit component with a large contact area
#12200Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same
#12201Semiconductor chip assembly with metal containment wall and solder terminal
#12202Light extraction from a semiconductor light emitting device via chip shaping
#12203Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device
#12204Methods of forming electronic structures including conductive shunt layers and related structures
#12205Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#12206Stacked semiconductor chips
#12207Castellation wafer level packaging of integrated circuit chips
#12208Bond pad structure for copper metallization having increased reliability and method for fabricating same
#12209Semiconductor device and a method of manufacturing the semiconductor device
#12210Semiconductor device and semiconductor module employing thereof
#12211Microelectronic devices
#12212Flip-chip without bumps and polymer for board assembly
#12213Bonding pad and chip structure
#12214Semiconductor component and assembly having female conductive members
#12215Castellation wafer level packaging of integrated circuit chips
#12216Semiconductor device having a through electrode
#12217Semiconductor integrated circuit device
#12218Method of reforming reformable members of an electronic package and the resultant electronic package
#12219Under bump metallurgy process on passivation opening
#12220Method for ultra thinning bumped wafers for flip chip
#12221Highly compliant plate for wafer bonding
#12222Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#12223Electrode contact structure
#12224Electronic assembly having multi-material interconnects
#12225Methods and apparatus for integrated circuit ball bonding using stacked ball bumps
#12226Semiconductor device
#12227Castellation wafer level packaging of integrated circuit chips
#12228Castellation wafer level packaging of integrated circuit chips
#12229Multi-component integrated circuit contacts
#12230Circular wire-bond pad, package made therewith, and method of assembling same
#12231Method of stacking wafers with anisotropic conductive adhesive
#12232Circuit film with bump, film package using the same, and related fabrication methods
#12233Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#12234Method for producing a semiconductor circuit, and corresponding semiconductor circuit
#12235Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
#12236Semiconductor device
#12237Electronic assembly with carbon nanotube contact formations or interconnections
#12238Method of forming a thin wafer stack for a wafer level package
#12239Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device
#12240Semiconductor device
#12241Ground plane for integrated circuit package
#12242Semiconductor package with heat sink
#12243Semiconductor assembly having substrate with electroplated contact pads
#12244High brightness light-emitting device and manufacturing process of the light-emitting device
#12245Semiconductor device, manufacturing method and apparatus for the same
#12246Method of forming a lead-free bump and a plating apparatus therefor
#12247Fabrication method of wafer level chip scale packages
#12248Method for fabricating chip structure
#12249Compliant interconnect and method of formation
#12250Compound semiconductor device and manufacturing method thereof
#12251Method for forming bump on electrode pad with use of double-layered film
#12252Semiconductor device, circuit substrate, electro-optic device and electronic appliance
#12253Capping of metal interconnects in integrated circuit electronic devices
#12254Lead-free conductive jointing bump
#12255Method of forming a solder bump and the structure thereof
#12256Pre-doped reflow interconnections for copper pads
#12257Stress mitigation layer to reduce under bump stress concentration
#12258Compound semiconductor device and manufacturing method thereof
#12259Semiconductor device with reduced contact resistance
#12260Method of manufacturing semiconductor device
#12261Formation method for conductive bump
#12262Method for forming interconnects on thin wafers
#12263RF isolator with differential input/output
#12264Crack protection for silicon die
#12265Semiconductor device with a barrier layer and a metal layer
#12266Semiconductor device and method capable of scribing chips with high yield
#12267Semiconductor component and system having thinned, encapsulated dice
#12268Semiconductor device that improves electrical connection reliability
#12269Semiconductor device with slanting side surface for external connection
#12270System-in-package (SIP) structure and fabrication thereof
#12271Preparation of front contact for surface mounting
#12272On chip transformer isolator
#12273Flip chip FET device
#12274Bipolar transistor, oscillation circuit, and voltage controlled oscillator
#12275Screen printing method of forming conductive bumps
#12276Wire-bonding method for chips with copper interconnects by introducing a thin layer
#12277Process of bonding circuitry components
#12278Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#12279Semiconductor device and method of manufacturing the same
#12280Imaging device having transparent unit and electronic apparatus
#12281Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#12282Method of manufacturing semiconductor device and support structure for semiconductor substrate
#12283Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#12284Chip structure and process for forming the same
#12285Semiconductor device
#12286Semiconductor device
#12287Asymmetric bump structure
#12288Semiconductor device and method of manufacturing the same
#12289Semiconductor device and manufacturing process therefor
#12290Method for fabrication of wafer level package incorporating dual compliant layers
#12291Semiconductor device and interposer
#12292Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#12293Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
#12294Substrate for solder joint
#12295Semiconductor device
#12296Bump structure
#12297Method and system for stacking integrated circuits
#12298Power composite integrated semiconductor device and manufacturing method thereof
#12299Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#12300Semiconductor die attachment for high vacuum tubes