207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Flip chip light emitting diode and method of manufacturing the same
#11702Method of reducing process steps in metal line protective structure formation
#11703Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
#11704Semiconductor device and fabrication method thereof
#11705Method of bonding solder pads of flip-chip package
#11706Semiconductor device and method of fabricating the same
#11707Semiconductor device including wire bonding pads and pad layout method
#11708Temperature measurement device of power semiconductor device
#11709Electrode structure, and semiconductor light-emitting device having the same
#11710Solder ball pad surface finish structure of circuit board and fabrication method thereof
#11711Circuit device and method of manufacturing thereof
#11712Intermediate semiconductor device structures
#11713Bond pad structure comprising multiple bond pads with metal overlap
#11714Microelectronic packages and methods therefor
#11715Device with area array pads for test probing
#11716Terminal pad structures and methods of fabricating same
#11717Semiconductor device with passivation layer covering wiring layer
#11718Contact structure on chip and package thereof
#11719Method of making the semiconductor device, circuit board, and electronic instrument
#11720Wirebonded device packages for semiconductor devices having elongated electrodes
#11721Dielectric isolation type semiconductor device and manufacturing method therefor
#11722Solid-state imaging device and manufacturing method thereof
#11723Conductive bump structure for semiconductor device and fabrication method thereof
#11724Methods of forming wire bonds for semiconductor constructions
#11725Post bump passivation for soft error protection
#11726Multiple etch-stop layer deposition scheme and materials
#11727Alignment key structure in a semiconductor device and method of forming the same
#11728Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
#11729Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
#11730Differential amplifier circuitry formed on semiconductor substrate with rewiring technique
#11731Bond pad structures and semiconductor devices using the same
#11732Wire bonded semiconductor device having low inductance and noise
#11733Semiconductor device production method and semiconductor device
#11734Solder bumps in flip-chip technologies
#11735Techniques for improving bond pad performance
#11736Circuit board with built-in electronic component and method for manufacturing the same
#11737Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#11738Method of making a circuitized substrate
#11739Semiconductor device and method of manufacturing the same
#11740Substrate for producing a soldering connection to a second substrate
#11741Semiconductor device having a leading wiring layer
#11742Semiconductor device including an under electrode and a bump electrode
#11743Apparatus for conducting heat in a flip-chip assembly
#11744Microelectronic assemblies having compliant layers
#11745System having semiconductor component with multiple stacked dice
#11746Semiconductor chip with fuse unit
#11747Solid state imaging device
#11748Bumping process and bump structure
#11749Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes
#11750System for providing a redistribution metal layer in an integrated circuit
#11751Electronic devices including offset conductive bumps
#11752Integrated circuit system for bonding
#11753Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#11754Semiconductor device
#11755High density direct connect LOC assembly
#11756Semiconductor chip mounting body and manufacturing method thereof
#11757Manufacturing process of a chip package structure
#11758Semiconductor device including ROM interface pad
#11759Ultrasonic tool and ultrasonic bonder
#11760Method for manufacturing semiconductor device
#11761Method for fabricating semiconductor components with through wire interconnects
#11762Semiconductor chip capable of implementing wire bonding over active circuits
#11763Semiconductor device
#11764Semiconductor device and fabrication method thereof
#11765Reinforced bond pad for a semiconductor device
#11766Semiconductor device and method of manufacturing semiconductor device
#11767Strobe light control circuit and IGBT device
#11768Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles
#11769Manufacturing managing method of semiconductor devices and a semiconductor substrate
#11770Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same
#11771Semiconductor laser device and method of fabricating the same
#11772Chip package with dam bar restricting flow of underfill
#11773Semiconductor device
#11774Flip chip package and the fabrication thereof
#11775Method of forming self-passivating interconnects and resulting devices
#11776Semiconductor device
#11777Semiconductor device and method of manufacturing the same
#11778Wafer level package including a device wafer integrated with a passive component
#11779Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same
#11780Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device
#11781Semiconductor device and method for manufacturing same
#11782Method of manufacturing semiconductor device
#11783Package structure of semiconductor and wafer-level formation thereof
#11784Wafer-level package for integrated circuits
#11785Aluminum cap with electroless nickel/immersion gold
#11786Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus
#11787Semiconductor device and semiconductor-device manufacturing method
#11788Semiconductor device having a functional surface
#11789Wafer level chip scale package having a gap and method for manufacturing the same
#11790C4 joint reliability
#11791Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein
#11792Bevel dicing semiconductor components
#11793Method for Manufacturing Gold Bumps
#11794METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES
#11795Top via pattern for bond pad structure
#11796Integrated device and electronic system
#11797Semiconductor device and manufacturing method for the same
#11798Protection device for handling energy transients
#11799Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#11800Forming solder balls on substrates
#11801Method to accommodate increase in volume expansion during solder reflow
#11802Bonding pads having slotted metal pad and meshed via pattern
#11803Temperature dependent semiconductor module connectors
#11804Low capacitance solder bump interface structure
#11805Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices
#11806Front-end processing of nickel plated bond pads
#11807Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#11808Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier
#11809Semiconductor device with via hole for electric connection
#11810Semiconductor device having a package base with at least one through electrode
#11811Copper interconnection with conductive polymer layer and method of forming the same
#11812METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME
#11813Package of a semiconductor device with a flexible wiring substrate and method for the same
#11814Semiconductor package and method for manufacturing the same
#11815Semiconductor device
#11816Semiconductor device
#11817FINE PAD PITCH ORGANIC CIRCUIT BOARD WITH PLATING SOLDER AND METHOD FOR FABRICATING THE SAME
#11818LOCAL MULTILAYERED METALLIZATION
#11819Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method
#11820Semiconductor package having an optical device and a method of making the same
#11821CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
#11822Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same
#11823Light emitting semiconductor bonding structure and method of manufacturing the same
#11824Light emitting element mounting member, and semiconductor device using the same
#11825Optical modulator module package using flip-chip mounting technology
#11826Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
#11827Die attach material for TBGA or flexible circuitry
#11828Planar microspring integrated circuit chip interconnection to next level
#11829System for different bond pads in an integrated circuit package
#11830CHIP STRUCTURE AND WAFER STRUCTURE
#11831Semiconductor device and method for producing same
#11832Semiconductor device, magnetic sensor, and magnetic sensor unit
#11833Semiconductor light emitting device
#11834Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
#11835Semiconductor device production method and semiconductor device
#11836MULTI-CHIP BALL GRID ARRAY PACKAGE
#11837Microelectronic assemblies having compliancy
#11838Inductor formed in an integrated circuit
#11839Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#11840Semiconductor device with a recessed bond pad
#11841Integrated connection arrangements
#11842Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#11843Method of manufacturing semiconductor device and semiconductor device
#11844Wirebond crack sensor for low-k die
#11845High frequency semiconductor device
#11846Input and output circuit of an integrated circuit chip
#11847Semiconductor device
#11848High reflectivity p-contacts for group lll-nitride light emitting diodes
#11849Flip chip package with advanced electrical and thermal properties for high current designs
#11850Semiconductor chip capable of implementing wire bonding over active circuits
#11851Semiconductor device and manufacturing method thereof
#11852Method and system for bonding a semiconductor chip onto a carrier using micro-pins
#11853High frequency arrangement
#11854Semiconductor device
#11855Semiconductor device and unit equipped with the same
#11856Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#11857Accurate relative alignment and epoxy-free attachment of optical elements
#11858Apparatus and method for bonding wires
#11859Semiconductor component sealed on five sides by polymer sealing layer
#11860Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates
#11861Semiconductor package and method for manufacturing the same
#11862Method of forming a wear-resistant dielectric layer
#11863Bond pad structure for integrated circuit chip
#11864Forming a cap above a metal layer
#11865Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
#11866Semiconductor device and manufacturing method of the same
#11867Semiconductor chip having solder bumps and dummy bumps
#11868Acceleration sensor
#11869Structure and method for bonding an IC chip
#11870Semiconductor device and method of manufacturing the same
#11871Semiconductor device
#11872Semiconductor device and fabrication method thereof
#11873Efficient method of forming and assembling a microelectronic chip including solder bumps
#11874Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system
#11875Manufacturing Method of Semiconductive Element and Ink Jet Head Substrate
#11876Novel method for copper wafer wire bonding
#11877Semiconductor device
#11878Semiconductor device and method of manufacturing thereof
#11879Through-substrate interconnect structures and assemblies
#11880Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area
#11881Bump structure of semiconductor device and method of manufacturing the same
#11882Routing design to minimize electromigration damage to solder bumps
#11883Chip scale package and method for manufacturing the same
#11884Circuit board and semiconductor device
#11885Method for depositing an adhesion-promoting layer on a metallic layer of a chip
#11886Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures
#11887Semiconductor device and method of fabricating the same
#11888Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor
#11889Structure and manufacturing method of a chip scale package
#11890Bilayer aluminum last metal for interconnects and wirebond pads
#11891Semiconductor device and method of manufacturing the same
#11892Apparatus for plating a semiconductor wafer and plating solution bath used therein
#11893Method of making an electronic assembly
#11894Semiconductor element with under bump metallurgy structure and fabrication method thereof
#11895Method of manufacturing semiconductor device and method of treating electrical connection section
#11896Under bump metallurgy in integrated circuits
#11897Interconnection structure through passive component
#11898Electronic component, electro-optical device, and electronic apparatus
#11899Semiconductor device including multiple rows of peripheral circuit units
#11900Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof
#11901Semiconductor integrated circuit and method of manufacturing the same
#11902Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
#11903Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#11904Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
#11905Method for fabricating semiconductor component with thinned substrate having pin contacts
#11906Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#11907On-pad broadband matching network
#11908Semiconductor device with split pad design
#11909Encapsulated electronic component and production method
#11910Method of metal sputtering for integrated circuit metal routing
#11911Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#11912Method for fabricating module of semiconductor chip
#11913Integrated die bumping process
#11914Electronic parts packaging structure
#11915Electronic device
#11916Mounting pad structure for wire-bonding type lead frame packages
#11917Semiconductor devices having post passivation interconnections and a buffer layer
#11918On-chip circuit pad structure
#11919Method of forming pad and fuse in semiconductor device
#11920Semiconductor integrated device and method for manufacturing same
#11921Semiconductor package having semiconductor constructing body and method of manufacturing the same
#11922Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
#11923Layered microelectronic contact and method for fabricating same
#11924Solder structures for out of plane connections
#11925Semiconductor device and method for manufacturing the same
#11926Semiconductor device and fabrication method thereof
#11927Method of forming a bonding pad structure
#11928Copper interconnect
#11929Semiconductor device and fabrication method thereof
#11930Power semiconductor device
#11931Method of manufacturing semiconductor device
#11932Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
#11933Method for wafer stacking using copper structures of substantially uniform height
#11934Semiconductor device and method of fabricating the same
#11935Method for constructing contact formations
#11936Bonding pad structure
#11937Ball limiting metallurgy split into segments
#11938Semiconductor device and manufacturing method therefor
#11939Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
#11940Repairable three-dimensional semiconductor subsystem
#11941Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
#11942Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus
#11943Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component
#11944Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film
#11945Method of manufacturing a semiconductor device
#11946Solder bump composition for flip chip
#11947Method for re-routing lithography-free microelectronic devices
#11948Method of manufacturing semiconductor device and support structure for semiconductor substrate
#11949Protection of an integrated capacitor
#11950Semiconductor device having a bonding pad structure including an annular contact
#11951Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#11952Method for solder bumping, and solder-bumping structures produced thereby
#11953Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures
#11954Semiconductor device and manufacturing method thereof
#11955Semiconductor device
#11956Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
#11957Semiconductor package, manufacturing method thereof and IC chip
#11958Integrated circuit with stacked-die configuration utilizing substrate conduction
#11959Electronic component and a panel
#11960Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
#11961Optically blocked reference pixels for focal plane arrays
#11962Bonding structure and fabrication thereof
#11963Method and device for wafer scale packaging of optical devices using a scribe and break process
#11964Three-dimensional device fabrication method
#11965Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device
#11966Semiconductor memory device and defect remedying method thereof
#11967Semiconductor device and fabrication method for the same
#11968Semiconductor device and the method of producing the same
#11969Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
#11970Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device
#11971Method of making a circuitized substrate
#11972Die-to-die connection method and assemblies and packages including dice so connected
#11973Hermetically sealing using a cold welded tongue and groove structure
#11974Reinforced solder bump structure and method for forming a reinforced solder bump
#11975Semiconductor device and manufacturing method of semiconductor device
#11976Bond pad structure for gold wire bonding to copper low K dielectric silicon devices
#11977Wire bond interconnection
#11978Semiconductor die attachment for high vacuum tubes
#11979Semiconductor chip and tab package having the same
#11980Microelectronic assemblies incorporating inductors
#11981Method and apparatus for polymer dielectric surface recovery by ion implantation
#11982Methods for aligning semiconductor fabrication molds and semiconductor substrates
#11983Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
#11984Light emitting diode chip with large heat dispensing and illuminating area
#11985Semiconductor device and manufacturing method thereof
#11986Forming an intermediate layer in interconnect joints and structures formed thereby
#11987Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof
#11988High surface area aluminum bond pad for through-wafer connections to an electronic package
#11989Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
#11990Solder for fabricating solder bumps and pumping process
#11991Semiconductor device with penetrating electrode
#11992Die bonded device and method for transistor packages
#11993Method for forming solder bumps of increased height
#11994Method of fabricating a high Q factor integrated circuit inductor
#11995Device and method for fabricating double-sided SOI wafer scale package with through via connections
#11996System-in-package type semiconductor device
#11997Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor
#11998Die attach material for TBGA or flexible circuitry
#11999Semiconductor chip capable of implementing wire bonding over active circuits
#12000REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF