Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Driver chip and display apparatus having the same

Semiconductor device and manufacturing method of the same

Semiconductor device

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor integrated circuit device

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor device having bonding pad above low-k dielectric film

Socket grid array

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Methods for reducing flip chip stress

Semiconductor device and method of fabricating the same

Partially etched dielectric film with conductive features

Solder alloy and semiconductor device

Bumpless wafer scale device and board assembly

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Flip chip packaging process employing improved probe tip design

Method and structure to reduce risk of gold embrittlement in solder joints

WAFER-LEVEL PACKAGE STRUCTURE

Colored conductive wires for a semiconductor package

Self-supporting connecting element for a semiconductor chip

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Moisture resistant, flexible epoxy/cyanate ester formulation

Method of forming bump pad of flip chip and structure thereof

Array capacitors with voids to enable a full-grid socket

Method and device for manufacturing bonding pads for chip scale packaging

High-frequency device

Stacked semiconductor device assembly and method for forming

Various structure/height bumps for wafer level-chip scale package

Method and apparatus for improved power routing

System and method for increasing the ball pitch of an electronic circuit package

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device and the method of producing the same

Semiconductor package with improved solder joint reliability

[METHOD OF FORMING BOND MICROSTRUCTURE]

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Chip and wafer integration process using vertical connections

Support structure for low-k dielectrics

Wafer level packages for chips with sawn edge protection

Techniques for packaging multiple device components

Wafer level chip scale packaging structure and method of fabricating the same

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Electronic device with reduced entrapment of material between die and substrate electrical connections

Inductor formed in an integrated circuit

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Semiconductor circuit with multiple contact sizes

Chip structure and process for forming the same

Semiconductor device manufacturing method

Method for preapplying a viscous material to strengthen solder connections in microelectronic packaging and microelectronic packages formed thereby

Integrated circuit with dual electrical attachment PAD configuration

Semiconductor device and method of fabricating the same

SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same

Method of mounting wafer on printed wiring substrate

Integrated circuit die/package interconnect

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor apparatus and method for fabricating the same

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Super high density module with integrated wafer level packages

Inorganic thin layer, organic electroluminescence device including the same, and fabrication method thereof

Flip-chip interconnect with increased current-carrying capability

Fluxless assembly of chip size semiconductor packages

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip chip die bond pads, die bond pad placement and routing optimization

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Flip chip on lead frame

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

CSP semiconductor device having signal and radiation bump groups

Semiconductor sensor and method of plating semiconductor devices

PROBE TIP DESIGN APPLIED IN A FLIP CHIP PACKAGING PROCESS

Under bump metallurgic layer

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Multi-functional solder and articles made therewith, such as microelectronic components

Method for producing a semiconductor device in chip format

Semiconductor integrated circuit device

Semiconductor device and semiconductor device manufacturing method

Semiconductor chip with fuse unit

IC chip with improved pillar bumps

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor device with connections for bump electrodes

Interconnecting component

Semiconductor device having chip size package with improved strength

Method of fabricating an electronic device

Manufacturing method for semiconductor device

Manufacturing method of semiconductor device, including differently spaced bump electrode arrays

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Semiconductor device, manufacturing method thereof, electronic device, electronic equipment

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Semiconductor device and method for manufacturing the same

Arrangement comprising a capacitor

Chip scale package and method of fabricating the same

Stud bumping apparatus

Acentric non-round electrical interconnections

Bump connection placement in quantum devices in a flip chip configuration

Package and printed circuit board attachment

Semiconductor devices with post-probe configurability

Combing bump structure and manufacturing method thereof

Semiconductor package

Robust pillar structure for semicondcutor device contacts

Integrated circuit package having side and bottom contact pads