207790 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Bump connectors ; Manufacturing methods related thereto
Chip and flat panel display apparatus comprising the same
#602Semiconductor Device
#603On-chip inductor using redistribution layer and dual-layer passivation
#604System and method to reduce metal series resistance of bumped chip
#605Dual-sided chip attached modules
#606Super high density module with integrated wafer level packages
#607Method for fabricating semiconductor package with multi-layer die contact and external contact
#608Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device
#609Interconnection structure, electronic component and method of manufacturing the same
#610Array capacitors with voids to enable a full-grid socket
#611Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#612Semiconductor device having a smaller electrostatic capacitance electrode
#613Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#614Method of manufacturing a semiconductor package
#615Wafer level semiconductor module and method for manufacturing the same
#616Optical display package and the method thereof
#617High frequency IC package and method for fabricating the same
#618UNIVERSAL CHIP PACKAGE STRUCTURE
#619Semiconductor device that improves electrical connection reliability
#620Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#621SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB
#622Chip package
#623Semiconductor integrated circuit device
#624Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#625Semiconductor wafer coat layers and methods therefor
#626Semiconductor device
#627Composite bump
#628Semiconductor device and manufacturing method thereof
#629TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS
#630Bond pad structures with reduced coupling noise
#631Chip underfill in flip-chip technologies
#632Integrated circuit architecture for reducing interconnect parasitics
#633Connection structure and method for fabricating the same
#634Semiconductor device with signal line having decreased characteristic impedance
#635Patterned gold bump structure for semiconductor chip
#636Chip with bump structure
#637Method of fabricating wafer level package
#638Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same
#639Semiconductor device with surface-mountable external contacts and method for manufacturing the same
#640Semiconductor device having flange structure
#641Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
#642Method of forming a microelectronic package and microelectronic package formed according to the method
#643Interconnection pattern design
#644Semiconductor package and fabricating method thereof
#645Substrate and semiconductor device
#646Method for fabricating semiconductor package with build-up layers formed on chip
#647Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same
#648Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel
#649Package structure and manufacturing method thereof
#650Methods including fluxless chip attach processes
#651Super high-density module with integrated wafer level packages
#652Electronic micromodule and method for manufacturing the same
#653Compliant terminal mountings with vented spaces and methods
#654Low temperature bumping process
#655Super high-density module with integrated wafer level packages
#656Techniques for packaging multiple device components
#657Compliant terminal mountings with vented spaces and methods
#658Wafer-level flipchip package with IC circuit isolation
#659PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD
#660PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE
#661Semiconductor device and method for fabricating the same
#662Projected contact structures for engaging bumped semiconductor devices
#663Integrated Circuit With Dual Electrical Attachment Pad Configuration
#664Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
#665Semiconductor components having through wire interconnects (TWI)
#666Interconnect assemblies and methods
#667Intermediate connection for flip chip in packages
#668Wiring board, electronic component mounting structure, and electronic component mounting method
#669Semiconductor Device with Improved Stud Bump
#670Integrated circuit package system with bump pad
#671Wafer level chip scale packaging structure and method of fabricating the same
#672Semiconductor device and method for manufacturing the same
#673Bonding pad with high bonding strength to solder ball and bump
#674Semiconductor device
#675CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME
#676Semiconductor device and manufacturing method of the same
#677Semiconductor device with a dummy electrode
#678Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
#679Method for manufacture of wafer level package with air pads
#680Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#681Universal chip package structure
#682Bump structure and its forming method
#683Electronic device with conductive connection structure
#684Optical imaging device for optical proximity communication
#685Resonator system for optical proximity communication
#686Method and apparatus for facilitating proximity communication and power delivery
#687Semiconductor device
#688Solder joint intermetallic compounds with improved ductility and toughness
#689Semiconductor chip and semiconductor device
#690Semiconductor device
#691Semiconductor device
#692Semiconductor device
#693Metal duplex method
#694Semiconductor device and method for fabricating the same
#695Metal duplex method
#696Radiant energy heating for die attach
#697Wafer-level package and IC module assembly method for the wafer-level package
#698Pad open structure
#699Chip package and bump connecting structure thereof
#700Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
#701Ball grid array interface structure and method
#702Lead-containing solder bumps
#703Lead-containing solder paste
#704Lead-containing anodes
#705Wafer integrated rigid support ring
#706Ternary alloy column grid array
#707Encapsulated chip scale package having flip-chip on lead frame structure and method
#708Semiconductor device
#709Semiconductor device
#710Integrated circuit with low-stress under-bump metallurgy
#711Chip-sized flip-chip semiconductor package and method for making the same
#712Semiconductor device and method of manufacturing the same
#713Manufacturing method of semiconductor device
#714Scalable subsystem architecture having integrated cooling channels
#715Flip chip package with reduced thermal stress
#716Electro-optic interconnection apparatus and method
#717Semiconductor device, electronic module, and method of manufacturing electronic module
#718Microelectronic bond pad
#719Semiconductor device and oscillator
#720Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
#721Method for modifying surface of substrate and method for manufacturing semiconductor device
#722Method and apparatus for providing a solder area on a leadframe
#723Seedless wirebond pad plating
#724Semiconductor device
#725BUMP FOR OVERHANG DEVICE
#726Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#727Circuitry component and method for forming the same
#728Grid array connection device and method
#729Electronic board, method of manufacturing the same, and electronic device
#730Low stress chip attachment with shape memory materials
#731Semiconductor device and method for manufacturing the same
#732Microelectronic assemblies having low profile connections
#733Semiconductor device having reduced number of external pad portions
#734Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
#735Solder joints for copper metallization having reduced interfacial voids
#736Semiconductor chip with coil element over passivation layer
#737Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
#738Flip chip interconnect solder mask
#739Semiconductor device chip and semiconductor device chip package
#740Technique for defining a wettable solder joint area for an electronic assembly substrate
#741Semiconductor device with substrate having penetrating hole having a protrusion
#742Semiconductor device production method and semiconductor device
#743Electronic component and electronic configuration
#744Semiconductor device having a leading wiring layer
#745System having semiconductor component with multiple stacked dice
#746Semiconductor chip with fuse unit
#747Substrate for mounting electronic part and electronic part
#748Semiconductor device
#749Method of fabricating a substrate with a concave surface
#750Manufacturing managing method of semiconductor devices and a semiconductor substrate
#751Semiconductor wafer coat layers and methods therefor
#752Semiconductor device
#753Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads
#754METHODS AND SYSTEMS FOR IMPROVING MICROELECTRONIC I/O CURRENT CAPABILITIES
#755Semiconductor package and method for manufacturing the same
#756Semiconductor device
#757Methods of refining lead-containing materials
#758CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
#759Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine
#760Die attach material for TBGA or flexible circuitry
#761CHIP STRUCTURE AND WAFER STRUCTURE
#762Microfeature devices and methods for manufacturing microfeature devices
#763MULTI-CHIP BALL GRID ARRAY PACKAGE
#764Inductor formed in an integrated circuit
#765Microfeature devices and methods for manufacturing microfeature devices
#766Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#767Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates
#768Trace design to minimize electromigration damage to solder bumps
#769Semiconductor device and manufacturing method of the same
#770Semiconductor chip having solder bumps and dummy bumps
#771Semiconductor module for making electrical contact with a connection device via a rewiring device
#772Wiring board and capacitor to be built into wiring board
#773Semiconductor package and method of manufacturing the same
#774Circuit board and semiconductor device
#775Structure and manufacturing method of a chip scale package
#776Apparatus for plating a semiconductor wafer and plating solution bath used therein
#777Under bump metallurgy in integrated circuits
#778Interconnection structure through passive component
#779Electronic component, electro-optical device, and electronic apparatus
#780Structure for joining a semiconductor package to a substrate using a solder column
#781Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
#782Semiconductor integrated device and method for manufacturing same
#783IC substrate with over voltage protection function
#784IC substrate with over voltage protection function
#785Ball grid array IC substrate with over voltage protection function
#786IC substrate with over voltage protection function
#787IC substrate with over voltage protection function
#788Multi-layer printed circuit board comprising a through connection for high frequency applications
#789Method of manufacturing semiconductor device and support structure for semiconductor substrate
#790Electronic component with a housing package
#791Protection of an integrated capacitor
#792Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#793Multi-chip module
#794Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#795Semiconductor device
#796Method of manufacturing a device-incorporated substrate
#797Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
#798Semiconductor device and the method of producing the same
#799MSD raised metal interface features
#800Attachment of flip chips to substrates
#801Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
#802Semiconductor device with penetrating electrode
#803Integrated circuit package and assembly thereof
#804Die attach material for TBGA or flexible circuitry
#805REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
#806Socket grid array
#807Method and structure to reduce risk of gold embrittlement in solder joints
#808Wafer structure, chip structure and bumping process
#809Semiconductor device and manufacturing method of the same
#810Package structure module of bump posited type lead frame
#811Method for manufacturing wafer level chip scale package using redistribution substrate
#812Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
#813Integrated circuit with at least one bump
#814Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
#815Semiconductor device
#816Reliable printed wiring board assembly employing packages with solder joints
#817Top layers of metal for integrated circuits
#818Semiconductor device packaged into chip size and manufacturing method thereof
#819Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
#820Radiant energy heating for die attach
#821Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#822Chip structure
#823Method for producing bumps on an electrical component
#824Bump structure
#825Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#826Method for supplying solder
#827Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#828Semiconductor chip packages and methods for fabricating the same
#829Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus
#830Bump structure of an opto-electronic chip
#831Semiconductor device with simplified constitution
#832Thermal fatigue resistant tin-lead-silver solder
#833Integrated inductors and compliant interconnects for semiconductor packaging
#834Stacked packages
#835Wafer level package, multi-package stack, and method of manufacturing the same
#836Power gridding scheme
#837Semiconductor device with sidewall wiring
#838Power gridding scheme
#839Metal-metal bonding of compliant interconnect
#840Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
#841Electroplated wire layout for package sawing
#842Interconnect assemblies and methods
#843Method of manufacturing semiconductor device with two-step etching of layer
#844Semiconductor device with signal line having decreased characteristic impedance
#845Semiconductor device and method for manufacturing the same, package for LCD driver
#846Semiconductor component having a CSP housing
#847Semiconductor device and manufacturing method thereof
#848Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#849Bump ball device and placing method thereof
#850Die and die-package interface metallization and bump design and arrangement
#851Semiconductor package having protective layer for re-routing lines and method of manufacturing the same
#852Semiconductor package including rivet for bonding of lead posts
#853Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#854Bonding pad and chip structure
#855Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
#856Interposer containing bypass capacitors for reducing voltage noise in an IC device
#857Semiconductor die package with internal bypass capacitors
#858Microfeature devices and methods for manufacturing microfeature devices
#859Pre-doped reflow interconnections for copper pads
#860Stress mitigation layer to reduce under bump stress concentration
#861Method of manufacturing semiconductor device
#862Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#863Semiconductor device that improves electrical connection reliability
#864Semiconductor package including redistribution pattern and method of manufacturing the same
#865Preparation of front contact for surface mounting
#866Integrated circuit packages with reduced stress on die and associated methods
#867Method of manufacturing semiconductor device and support structure for semiconductor substrate
#868Chip structure and process for forming the same
#869Semiconductor device
#870Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#871Method for fabrication of wafer level package incorporating dual compliant layers
#872Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#873Semiconductor device
#874Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#875Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#876Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#877Semiconductor device
#878Electronic device including chip parts and a method for manufacturing the same
#879Flip chip semiconductor package for testing bump and method of fabricating the same
#880Selectable decoupling capacitors for integrated circuits and associated methods
#881Method of manufacturing an electronic parts packaging structure
#882Semiconductor chip having pads with plural junctions for different assembly methods
#883Integrated circuit die for wire bonding and flip-chip mounting
#884FCBGA package structure
#885Semiconductor component having multiple stacked dice
#886Structure of package
#887Compliant multi-composition interconnects
#888Semiconductor chip having pads with plural junctions for different assembly methods
#889Method for manufacturing semiconductor device
#890Method and apparatus for improved power routing
#891Wafer level chip scale packaging structure and method of fabricating the same
#892Electronic component, mounted structure, electro-optical device, and electronic device
#893Method for depositing a solder material on a substrate
#894Extension of fatigue life for C4 solder ball to chip connection
#895Method for maintaining solder thickness in flipchip attach packaging processes
#896Wafer support and release in wafer processing
#897Semiconductor device
#898Underfill fluxing curative
#899Semiconductor device and manufacturing method of the same
#900Method of producing an electronic component with flexible bonding