207795 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors ; Manufacturing methods related thereto Structure, shape, material or disposition of the bump connectors after the connecting process
Sub-classes:ELECTRONIC DEVICE
#2INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
#3REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE
#4Electronic device
#5Semiconductor device having conductive patterns with mesh pattern and differential signal wirings
#6Plurality of semiconductor devices between stacked substrates
#7Integrated circuit component with conductive terminals of different dimensions and package structure having the same
#8Semiconductor device having conductive patterns with mesh pattern and differential signal wirings
#9Hybrid under-bump metallization component
#10Filter and capacitor using redistribution layer and micro bump layer
#11Electronic device
#12THERMOSETTING RESIN COMPOSITION, THERMOSETTING SHEET, SEMICONDUCTOR COMPONENT, AND SEMICONDUCTOR MOUNTED ARTICLE
#13Hybrid under-bump metallization component
#14Integrated circuit packages and methods for forming the same
#15Semiconductor device including semiconductor chip transmitting signals at high speed
#16Metal pillar in a film-type seconductor package
#17Semiconductor chip, method for manufacturing semiconductor chip, integrated circuit device, and method for manufacturing integrated circuit device
#18Package structure having integrated circuit component with conductive terminals of different dimensions
#19High bandwidth memory (HBM) bandwidth aggregation switch
#20Integrated circuit packages and methods for forming the same
#21Filter and capacitor using redistribution layer and micro bump layer
#22Hybrid resonator based voltage controlled oscillator (VCO)
#23Integrated circuit packages and methods for forming the same
#24Contact Bumps and Methods of Making Contact Bumps on Flexible Electronic Devices
#25Electronic device and method for producing an electronic device
#26Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#27IC structure with angled interconnect elements
#28Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body
#29Bump-on-trace structures with high assembly yield
#30Resonant circuit including bump pads
#31Filter and capacitor using redistribution layer and micro bump layer
#32Substrate and assembly thereof with dielectric removal for increased post height
#33Laser subassembly metallization for heat assisted magnetic recording
#34Bump-on-trace structures with high assembly yield
#35Integrated circuit packages and methods for forming the same
#36Enhanced flip chip structure using copper column interconnect
#37Methods and apparatus for package on package devices
#38Substrate and assembly thereof with dielectric removal for increased post height
#39Package-on-package structure and method of forming same
#40Surface treatment in electroless process for adhesion enhancement
#41Filter and capacitor using redistribution layer and micro bump layer
#42Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#43Integrated circuit packages and methods for forming the same
#44Methods and apparatus for package on package devices
#45Substrate and assembly thereof with dielectric removal for increased post height
#46Flip chip interconnect method and design for GaAs MMIC applications
#47Low fabrication cost, high performance, high reliability chip scale package
#48Integrated circuit package
#49Solderable top metal for silicon carbide semiconductor devices
#50Integrated circuits and interconnect structure for integrated circuits
#51Integrated circuits and interconnect structure for integrated circuits
#52Integrated circuits and interconnect structure for integrated circuits
#53Integrated circuits and interconnect structure for integrated circuits
#54LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#55Low fabrication cost, high performance, high reliability chip scale package
#56Low fabrication cost, high performance, high reliability chip scale package
#57Bonding apparatus and method
#58Integrated circuits and interconnect structure for integrated circuits
#59Solderable top metal for SiC device
#60Method for fabricating leadless packages with mold locking characteristics
#61Leadless leadframe with an improved die pad for mold locking
#62Interconnect structure for power transistors
#63Robust pillar structure for semicondcutor device contacts