207808 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors
Semiconductor chip, and semiconductor package and system each including the semiconductor chip
#302Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material
#303Single chip semiconductor coating structure and manufacturing method thereof
#304III-nitride power device with solderable front metal
#305High-frequency module
#306High efficiency module
#307WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR
#308Stacked structures and methods of fabricating stacked structures
#309COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD
#310Method for manufacturing hetero-bonded wafer
#311Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#312METHOD FOR MANUFACTURING SYSTEM-IN-PACKAGE
#313WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES
#314Electronic component mounting structure
#315Stacked semiconductor device and method
#316Composition and methods of forming solder bump and flip chip using the same
#317Methods of processing a thermal interface material
#318IC device having low resistance TSV comprising ground connection
#319SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#320DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING
#321Semiconductor device
#322Semiconductor device and fabricating method thereof
#323Method for structuring a substrate using a metal mask layer formed using a galvanization process
#324Holistic thermal management system for a semiconductor chip
#325I/O pad structures for integrated circuit devices
#326HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES
#327Ultra-Thin Wafer-Level Contact Grid Array
#328Wafer-level flip-chip assembly methods
#329Die-cut and method of manufacturing or assembling die-cuts from the components thereof
#330Module comprising a semiconductor chip comprising a movable element
#331Bonding method and bonding material using metal particle
#332Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#333Semiconductor device and method of manufacturing the same
#334Stacked structures and methods of fabricating stacked structures
#335Three dimensional device integration method and integrated device
#336Three dimensional device integration method and integrated device
#337Three dimensional device integration method and integrated device
#338Semiconductor device with reduced contact resistance
#339Diffusion soldered semiconductor device
#340Reactive foil assembly
#341Method for bonding substrates and device for bonding substrates
#342Semiconductor device and method for manufacturing thereof
#343Three dimensional device integration method and integrated device
#344Semiconductor device using semiconductor chip
#345Dies bonding apparatus and dies bonding method
#346Flip chip device having supportable bar and mounting structure thereof
#347Method for polymer-assisted chip transfer
#348Optimized solder pads for microelectronic components
#349Encapsulated semiconductor package