207808 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors
SEMICONDUCTOR PACKAGE
#2Heterogenous Thermal Interface Material
#3SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4PACKAGE STRUCTURE WITH PROTECTIVE LID
#5CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
#6ELECTRONIC DEVICE
#7COMPONENT CARRIER ASSEMBLY AND METHOD FOR MANUFACTURING A COMPONENT CARRIER ASSEMBLY
#8SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
#9SEMICONDUCTOR PACKAGE
#10DOUBLE-SIDED HEAT DISSIPATION SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#11ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#12SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#13POWER SEMICONDUCTOR, MOLDED MODULE, AND METHOD
#14SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#15CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
#16SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#173D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
#18VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME
#19ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
#20SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#21IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
#22DISPLAY DEVICE
#23Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical Component
#24Vertically Oriented Component Stack And Assembly
#25SEMICONDUCTOR PACKAGE
#26Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology
#27ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#28HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME
#29SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
#30SEMICONDUCTOR PACKAGE INCLUDING PACKAGE SEAL RING AND METHODS FOR FORMING THE SAME
#31CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#32TECHNIQUES FOR PROCESSING DEVICES
#33VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME
#34SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FORMING THE SAME
#35SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS
#36SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODULE, AND METHODS OF FORMING THE SEMICONDUCTOR DIE AND THE SEMICONDUCTOR DIE STACK
#37ELECTRONIC DEVICE
#38INTEGRATED DEVICE COMPRISING ELONGATED PADS
#39SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
#40DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
#41SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
#42INVERTER POWER MODULE
#43PACKAGE STRUCTURE WITH PROTECTIVE LID
#44SEMICONDUCTOR PACKAGE
#45Lead Frame, Packaging Structure and Packaging Method
#46SENSOR PACKAGING METHOD AND SENSOR PACKAGE
#47SEMICONDUCTOR PACKAGE
#48SEMICONDUCTOR PACKAGE
#49LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
#50Chip package structure with ring-like structure
#51THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
#52DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EMITTING DIODE AND SUBSTRATE
#53SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THEREFOR
#54SEMICONDUCTOR PACKAGE
#55PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#56SEMICONDUCTOR DEVICE
#57Semiconductor device with lead between a plurality of encapsulated MOSFETs
#58Package structure
#59INTEGRATED CIRCUIT PACKAGE
#60Selectable monolithic or external scalable die-to-die interconnection system methodology
#61WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
#62DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED METAL SUBSTRATES
#63SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
#64Method for manufacturing display panel, display panel, and display apparatus
#65LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
#66DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES
#67Vertical semiconductor package including horizontally stacked dies and methods of forming the same
#68LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR PACKAGES
#69Semiconductor device arrangement with compressible adhesive
#70Semiconductor device with curved conductive lines and method of forming the same
#71Triple-Sided Module
#72SEMICONDUCTOR LAYOUT STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE
#73DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
#74METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW
#75SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE
#76CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#77Low temperature bonded structures
#78Package comprising spacers between integrated devices
#79Semiconductor die, a semiconductor die stack, and a semiconductor module
#80Method for manufacturing display panel, display panel, and display apparatus
#81Chip package structure with ring-like structure
#82Semiconductor device with metal film having openings
#83Selectable monolithic or external scalable die-to-die interconnection system methodology
#84DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
#85DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
#86Semiconductor package and method of forming same
#87SEMICONDUCTOR DEVICE
#88Semiconductor device and method for manufacturing semiconductor device
#89Vertical semiconductor package including horizontally stacked dies and methods of forming the same
#90DBC substrate for power semiconductor devices, method for fabricating a DBC substrate and power semiconductor device having a DBC substrate
#91Structure and formation method of chip package with protective lid
#92DMOS FET chip scale package and method of making the same
#93Microelectronic structures including bridges
#94Thermal conductive film
#95Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
#96Light emitting device and manufacturing method therefor
#97Display device including connection pad part and electronic component connected to connection pad part
#98Package structure
#99Direct bonding in microelectronic assemblies
#100Recess portion in the surface of an interconnection layer mounted to a semiconductor device
#101Display panel, preparation method thereof, and display device
#102Electronic device and manufacturing method of electronic device
#103Semiconductor device and manufacturing method thereof
#1043D semiconductor device and structure
#105Connection structure
#106Lead between a plurality of encapsulated MOSFETs
#107Microelectronic structures including bridges
#108Microelectronic structures including bridges
#109DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#110Techniques for processing devices
#111Chip package structure with ring-like structure
#112Circuit Carrier Having an Installation Place for Electronic Components, Electronic Circuit and Production Method
#113Semiconductor packages with an intermetallic layer
#114Structure for bonding and electrical contact for direct bond hybridization
#115Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation
#116Semiconductor power module with temperature sensors and shaped top plate to equalize current paths
#117SEMICONDUCTOR APPARATUS
#118Electronic device having a curved portion between a plurality of conductive portions on a substrate
#119Chemical mechanical polishing for hybrid bonding
#120Power semiconductor package and method for fabricating a power semiconductor package
#121Micro LED display and manufacturing method with conductive film
#122Electronic device with three dimensional thermal pad
#123Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same
#124Chip package structure including ring-like structure and method for forming the same
#125Semiconductor package with a cavity in a die pad for reducing voids in the solder
#126Die attachment method and material between a semiconductor device and die pad of a leadframe
#127Low temperature bonded structures
#128Techniques for processing devices
#129Method for producing a semiconductor module by using adhesive attachment prior to sintering
#130Connection structure
#131Package structure and method of fabricating the same
#132Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
#133Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
#134Flip chip backside mechanical die grounding techniques
#135Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same
#136Silicon carbide semiconductor device, silicon carbide semiconductor assembly, and method of manufacturing silicon carbide semiconductor device
#137Semiconductor device
#138Semiconductor package structure with twinned copper
#139Connection structure
#140Method for producing structure, and structure
#141Structure and formation method of chip package with shielding structure
#142Package structure and method of fabricating the same
#143Integrated circuit packaging method and integrated packaging circuit
#144PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING SAME, AND PHYSICAL QUANTITY MEASUREMENT ELEMENT
#145Semiconductor devices with underfill control features, and associated systems and methods
#146Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
#147Low temperature bonded structures
#148Managing thermal warpage of a laminate
#149Power conversion device
#150Sensor device utilizing adhesives and manufacturing method thereof
#151Sensor device having adhesive between sensor portion and casing portion
#152Methods of fabricating semiconductor packages including reinforcement top die
#153Techniques for processing devices
#154Electronic system having increased coupling by using horizontal and vertical communication channels
#155Connection structure and method for manufacturing connection structure
#156Circuit device with monolayer bonding between surface structures
#157Device and method for producing a device
#158Display apparatus and method of manufacturing the same
#159Semiconductor device having high yield strength intermediate plate
#160Package with interconnections having different melting temperatures
#161SEMICONDUCTOR PACKAGE
#162Physical quantity measurement device, method for manufacturing same, and physical quantity measurement element
#163Method for fabricating an electronic device and a stacked electronic device
#164Chemical mechanical polishing for hybrid bonding
#165Bond materials with enhanced plasma resistant characteristics and associated methods
#166Stack type sensor package structure
#167Method for fabricating glass substrate package
#168Method of forming solder bumps
#169Multiple-chip package with multiple thermal interface materials
#170Semiconductor device
#171WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
#172Method for forming semiconductor package structure with twinned copper layer
#173Method of transferring micro devices
#174Semiconductor device and electronic apparatus
#175Lead frame and method of manufacturing the same
#176Display apparatus and method of manufacturing the same
#177Optoelectronic semiconductor chip and optoelectronic module
#178Package with interconnections having different melting temperatures
#179Electronic system having increased coupling by using horizontal and vertical communication channels
#180Semiconductor device having a plurality of semiconductor modules connected by a connection component
#181Semiconductor devices with underfill control features, and associated systems and methods
#182Method of manufacturing semiconductor device
#183Electronic system having increased coupling by using horizontal and vertical communication channels
#184Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers
#185Method of forming solder bumps
#186Method of forming solder bumps
#187Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
#188SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
#189Method for fabricating glass substrate package
#190METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
#191SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
#192Three dimensional device integration method and integrated device
#193Chip protection envelope and method
#194Optimized solder pads for microelectronic components
#195Method for fabricating an electronic device and a stacked electronic device
#196Semiconductor packages with an intermetallic layer
#197Display device
#198SEMICONDUCTOR DEVICE
#199Die attachment for packaged semiconductor device
#200Power-module substrate unit and power module
#201Method for producing a light emitting device
#202Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#203PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#204Semiconductor device
#205High efficiency module
#206THERMOCOMPRESSION BONDING WITH RAISED FEATURE
#207Wafer stack protection seal
#208Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
#209Method for coating conductive substrate with adhesive
#210Multichip stacking package structure and method for manufacturing the same
#211Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
#212Method for the diffusion soldering of an electronic component to a substrate
#213Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same
#214Three dimensional device integration method and integrated device
#215Laser assisted transfer welding process
#216Methods of manufacturing a semiconductor device
#217Method of making a semiconductor device having a functional capping
#218Die attachment for packaged semiconductor device
#219Lead frame construct for lead-free solder connections
#220High efficiency module
#221Ultra-thin power transistor and synchronous buck converter having customized footprint
#222Micro-pillar assisted semiconductor bonding
#223Semiconductor package
#224Package systems
#225SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#226High efficiency module including a plurality of MOSFETS
#227Mounting method
#228Three dimensional device integration method and integrated device
#229Electromagnetic interference shield for semiconductor chip packages
#230SEMICONDUCTOR DEVICE AND MODULE
#231Interposer package-on-package structure
#232Substrate and package structure
#233Sealing structure for a bonded wafer and method of forming the sealing structure
#234Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof
#235Semiconductor package
#236Method for processing a wafer and wafer structure
#237Semiconductor package including stacked memory chips
#238Connection arrangement of an electric and/or electronic component
#239Semiconductor packages including a metal layer between first and second semiconductor chips
#240III-Nitride device with solderable front metal
#241Semiconductor Device with Reduced Contact Resistance
#242Small footprint semiconductor package
#243Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
#244Method and system for height registration during chip bonding
#245Composition and methods of forming solder bump and flip chip using the same
#246Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
#247Chip package structure and manufacturing method thereof
#248Wafer stack protection seal
#249Multi-die package with separate inter-die interconnects
#250Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
#251STACKED PACKAGE, METHOD OF FABRICATING STACKED PACKAGE, AND METHOD OF MOUNTING STACKED PACKAGE FABRICATED BY THE METHOD
#252Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer
#253Method for forming a thin semiconductor device
#254Methods for Forming Semiconductor Devices Using Sacrificial Layers
#255Package systems and manufacturing methods thereof
#256Semiconductor packaging containing sintering die-attach material
#257Bump package and methods of formation thereof
#258Method and apparatus for routing die signals using external interconnects
#259Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#260Semiconductor device and manufacturing method thereof
#261Solar cell module and method of manufacturing thereof
#262Semiconductor device
#263Semiconductor device including a polymer disposed on a carrier
#264Semiconductor device with heat dissipation
#265Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body
#266Electronic system having increased coupling by using horizontal and vertical communication channels
#267Semiconductor device
#268Electrically bonded arrays of transfer printed active components
#269SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#270Chip package structure and manufacturing method thereof
#271Power package including multiple semiconductor devices
#272Chip package structure and manufacturing method thereof
#273Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
#274POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF
#275Method of making a semiconductor device having a functional capping
#276Ultra-thin power transistor and synchronous buck converter having customized footprint
#277Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method
#278POWER CONVERTER
#279IC device having low resistance TSV comprising ground connection
#280IC device having low resistance TSV comprising ground connection
#281METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE
#282Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#283Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#284SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#285Laser assisted transfer welding process
#286Electronic element unit and reinforcing adhesive agent
#287SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF
#288Package systems having a eutectic bonding material and manufacturing methods thereof
#289Package systems having an opening in a substrate thereof and manufacturing methods thereof
#290BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
#291SEMICONDUCTOR PACKAGE
#292Semiconductor device
#293ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
#294Semiconductor device
#295Semiconductor device including semiconductor packages stacked on one another
#296Method of manufacturing semiconductor modules and semiconductor module
#297Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect
#298PACKAGING METHOD OF SEMICONDUCTOR DEVICE
#299Method and system for forming a thin semiconductor device
#300Power semiconductor device