207817 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto Structure, shape, material or disposition of the strap connectors after the connecting process
Sub-classes:Semiconductor device and method for manufacturing semiconductor device
#2Power semiconductor device and method for manufacturing same
#3Semiconductor device
#4Power semiconductor device and method for manufacturing same
#5High efficiency module
#6High efficiency module
#7Power semiconductor package
#8Chip-embedded packages with backside die connection
#9High efficiency module
#10Power semiconductor package with multiple dies
#11Power semiconductor package
#12Semiconductor package and fabrication method thereof
#13Semiconductor die package and method for making the same
#14High efficiency module
#15Semiconductor die package and method for making the same
#16Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#17Semiconductor package and method for fabricating the same
#18Semiconductor die package and method for making the same
#19Stacked-die package for battery power management
#20Pre-molded clip structure
#21RF package
#22Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#23High efficiency module
#24MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD
#25Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond
#26Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#27Semiconductor apparatus and manufacturing method of the same
#28Method for connecting a die attach pad to a lead frame and product thereof
#29Power semiconductor module including substrates spaced from each other
#30Semiconductor die package and method for making the same
#31Pre-molded clip structure
#32Pre-molded clip structure
#33Semiconductor die package and method for making the same
#34Flange package for a semiconductor device
#35SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY
#36Semiconductor device
#37Stacked dual MOSFET package
#38Semiconductor structure and method of manufacture
#39Method for connecting a die attach pad to a lead frame and product thereof
#40Stacked dual-die packages, methods of making, and systems incorporating said packages
#41Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
#42Device configuration and method to manufacture trench MOSFET with solderable front metal
#43Semiconductor Package and Method for Fabricating the Same
#44Semiconductor package
#45Pre-molded clip structure
#46Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same
#47Stacked dual MOSFET package
#48Semiconductor die package using leadframe and clip and method of manufacturing
#49Thermally conductive composite and uses for microelectronic packaging
#50Electrically conductive connection, electronic component and method for their production
#51Power semiconductor module as H-bridge circuit and method for producing the same
#52Substrate and method for mounting silicon device
#53Semiconductor device having through contact blocks with external contact areas
#54Semiconductor die package using leadframe and clip and method of manufacturing
#55Semiconductor die package and method for making the same
#56Low profile small outline leadless semiconductor device package
#57Flip chip contact (FCC) power package