207812 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
Sub-classes:PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
#2Method for producing a semiconductor arrangement
#3STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
#4Package including multiple semiconductor devices
#5Method for forming hermetic package for a power semiconductor
#6Package including multiple semiconductor devices
#7Clip bond semiconductor packages and assembly tools
#8Semiconductor arrangement and method for producing the same
#9Hermetic package for power semiconductor
#10Power semiconductor device and power conversion device
#11Package including multiple semiconductor devices
#12Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
#13Light emitting apparatus, illumination apparatus and display apparatus
#14Power semiconductor device and power conversion device
#15Semiconductor device and power converter
#16Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode
#17Resiliently mounted sensor system with damping
#18Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package
#19Power semiconductor device
#20SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#21Electronic part mounting heat-dissipating substrate
#22Semiconductor device manufacturing method
#23Power module and power conversion apparatus having a warpage suppression portion
#24Method for manufacturing semiconductor device
#25Dual lead frame semiconductor package and method of manufacture
#26Light emitting apparatus, illumination apparatus and display apparatus
#27Semiconductor device and semiconductor device manufacturing method
#28Semiconductor package with conductive clip
#29Method for manufacturing semiconductor device
#30Method of manufacturing semiconductor package and semiconductor package
#31Method of manufacturing semiconductor device
#32Semiconductor module with reinforcing board
#33Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#34Forming a panel of triple stack semiconductor packages
#35Semiconductor component having inner and outer semiconductor component housings
#36Integrating multi-output power converters having vertically stacked semiconductor chips
#37Integrating multi-output power converters having vertically stacked semiconductor chips
#38Power converter package using driver IC
#39Dual power converter package
#40Power semiconductor device and power conversion device
#41Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#42Semiconductor device
#43Power module semiconductor device
#44Semiconductor device
#45Power semiconductor module with switching device and assembly
#46Conductive pads and methods of formation thereof
#47Power semiconductor package with a common conductive clip
#48Semiconductor package with conductive clip
#49Power semiconductor package with conductive clip and related method
#50Light emitting apparatus, illumination apparatus and display apparatus
#51Method of manufacturing semiconductor device
#52Semiconductor device
#53Chip-embedded packages with backside die connection
#54Switching circuit
#55Semiconductor device and method of manufacturing the same
#56Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip
#57Electronic device
#58Substrateless power device packages
#59Semiconductor device to be attached to heat radiation member
#60Conductive pads and methods of formation thereof
#61Semiconductor device and method for manufacturing the same
#62Semiconductor die and package with source down and sensing configuration
#63Bonded body and semiconductor module
#64Semiconductor device
#65Semiconductor package
#66Power module for high/low voltage insulation
#67Dual lead frame semiconductor package and method of manufacture
#68Dual lead frame semiconductor package and method of manufacture
#69Semiconductor power device having a heat sink
#70Detection of current change in an integrated circuit
#71Integrating multi-output power converters having vertically stacked semiconductor chips
#72Semiconductor device and a method for manufacturing a semiconductor device
#73Semiconductor package and fabrication method thereof
#74Semiconductor device
#75Semiconductor device
#76Stack die package
#77Power electronic device
#78Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#79Power transistor arrangement and package having the same
#80Half-bridge package with a conductive clip
#81Cooling-type switching element module
#82Sensor package
#83Wiring material and semiconductor module using the same
#84Stacked power semiconductor device using dual lead frame
#85Power module semiconductor device
#86Mold module utilized as power unit of electric power steering apparatus and electric power steering apparatus
#87Flip-chip semiconductor chip packing method
#88Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells
#89Unit power module and power module package comprising the same
#90Dual-leadframe multi-chip package
#91Method of manufacturing semiconductor device
#92Semiconductor device and method of manufacturing the same
#93Semiconductor device having a clip contact
#94Semiconductor packaging method using connecting plate for internal connection
#95Semiconductor package with connecting plate for internal connection
#96Semiconductor device and method of manufacturing the same
#97Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
#98Power semiconductor device module
#99Semiconductor device and power supply device
#100Semiconductor device and manufacturing method thereof
#101Semiconductor unit
#102Semiconductor unit
#103Wiring member and semiconductor module having the same
#104Dual power converter package using external driver IC
#105Semiconductor device
#106Power module
#107Power conversion device
#108Semiconductor module with switching elements
#109Semiconductor device and manufacturing method thereof
#110Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#111Power module for electric power steering and electric power steering drive control apparatus using the same
#112Multi-transistor exposed conductive clip for semiconductor packages
#113Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die
#114Diode package having improved lead wire and manufacturing method thereof
#115Semiconductor device
#116Power module and power module manufacturing method
#117Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#118PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTS
#119Semiconductor device and method of manufacturing the same
#120Semiconductor device including a contact clip having protrusions and manufacturing thereof
#121Transport method and transport apparatus
#122Electronic module
#123Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module
#124Multi-transistor exposed conductive clip for high power semiconductor packages
#125Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
#126Semiconductor device
#127Semiconductor device
#128Semiconductor device
#129Light emitting apparatus, illumination apparatus and display apparatus
#130Semiconductor package and method for fabricating the same
#131Stacked half-bridge package with a common conductive clip
#132Semiconductor package and method of fabricating the same
#133Dual-leadframe multi-chip package and method of manufacture
#134MAGNETIC FIELD CURRENT SENSORS
#135Magnetic field current sensors
#136Dual lead frame semiconductor package and method of manufacture
#137Semiconductor module having an insert and method for producing a semiconductor module having an insert
#138Substrateless power device packages
#139Method and system for improving reliability of a semiconductor device
#140Power semiconductor package
#141Optoelectronic component
#142Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
#143Power module
#144Internal packaging of a semiconductor device mounted on die pads
#145Power semiconductor device and power conversion device
#146Power semiconductor device
#147Dual-leadframe multi-chip package and method of manufacture
#148Semiconductor packaging and fabrication method using connecting plate for internal connection
#149SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#150Semiconductor package
#151Semiconductor device and power source device with a current detection circuit
#152Diode leadframe for solar module assembly
#153Electrical bond connection system
#154Semiconductor device and power supply device
#155Thermally enhanced low parasitic power semiconductor package
#156Semiconductor apparatus with improved efficiency of thermal radiation
#157Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same
#158Transport method and transport apparatus
#159Electronic device and method of manufacturing same
#160Semiconductor device
#161Semiconductor device
#162Power semiconductor device
#163Electronic module
#164Method of forming a semiconductor package and structure therefor
#165LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
#166Back to Back Die Assembly For Semiconductor Devices
#167Switching assembly for an aircraft ignition system
#168Power semiconductor module
#169Sensor package
#170Solderable top metal for silicon carbide semiconductor devices
#171Metallization with tailorable coefficient of thermal expansion
#172Semiconductor Package and Method for Fabricating the Same
#173Semiconductor device and method of manufacturing same
#174Module comprising polymer-containing electrical connecting element
#175Thin, thermally enhanced flip chip in a leaded molded package
#176Plastic surface mount large area power device
#177Process of fabricating a semiconductor package
#178Semiconductor device
#179Semiconductor device and manufacturing method therefor
#180High reliability power module
#181Production system
#182Semiconductor package
#183Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
#184Method and apparatus for current and temperature measurement in an electronic power circuit
#185Stackable power semiconductor package system
#186Closed loop thermally enhanced flip chip BGA
#187Semiconductor device
#188Electronic device
#189Semiconductor package
#190Semiconductor package and semiconductor module
#191Semiconductor device package
#192Solderable top metal for SiC device
#193Semiconductor device and method of manufacturing same
#194Semiconductor device and manufacturing method therefor
#195Thin, thermally enhanced molded package with leadframe having protruding region
#196Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET