207822 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto Structure, shape, material or disposition of the wire connectors prior to the connecting process
Sub-classes:BACKPLANE AND GLASS-BASED CIRCUIT BOARD
#2Semiconductor module and power conversion apparatus
#3Method of forming a semiconductor package with connection lug
#4Three-dimensional stacked fan-out packaging structure and method making the same
#5Electro-optical package and method of fabrication
#6Semiconductor device having plate-shaped metal terminals facing one another
#7Wire bonding method and wire bonding apparatus
#8Fan-out semiconductor package module
#9Light emitting apparatus and method of manufacturing light emitting apparatus
#10Coated wire
#11Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#12Embedded wire bond wires
#13Binding wire and semiconductor package structure using the same
#14LEADFRAME PACKAGE WITH WETTABLE SIDES AND METHOD OF MANUFACTURING SAME
#15Copper-based alloy wire and methods for manufaturing the same