207820 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Wire connectors; Manufacturing methods related thereto
Sub-classes:SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR PACKAGE
#3SEMICONDUCTOR PACKAGE
#4Method for processing memory device
#5SEMICONDUCTOR PACKAGE
#6SEMICONDUCTOR DEVICE
#7SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8Semiconductor module and power conversion apparatus
#9Semiconductor package
#10Voltage generators with charge pumps for switch circuits
#11Thermal spreading management of 3D stacked integrated circuits
#12Method and system of forming integrated circuit
#13Thermal spreading management of 3D stacked integrated circuits
#14Flip chip bonding onto a photonic integrated circuit
#15Semiconductor device and manufacturing method of the same
#16Sensor package structure
#17Apparatuses and methods for drivers with reduced noise
#18INDUCTIVE COMPENSATION IN MEMORY SYSTEMS
#19Method and system of forming integrated circuit
#20Semiconductor vertical wire bonding structure and method
#21Semiconductor package having singular wire bond on bonding pads
#22Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same
#23Three-level I-type inverter and semiconductor module
#24Touch panel, method for fabricating the same, and touch device
#25DRAM memory chips quick optical erasure
#26Neutral point clamped multiple-level switching unit for voltage inverter or rectifier
#27IGBT module assembly
#28Packaged integrated circuit having stacked die and method for therefor
#29Semiconductor device
#30Semiconductor apparatus, ignition device for internal combustion engine, and internal combustion engine system
#31Interposer substrate and method for manufacturing the same
#32System and method for controlling switching device in power converter
#33Opto-reflector
#34Coated wire
#35Power converter
#36Solid-state image pickup device and electronic apparatus to increase yield
#37Wide-bandgap semiconductor device including gate fingers between bond pads
#38Igniter
#39Control circuitry for silicon-on-insulator chip
#40Semiconductor device and method of manufacturing the same
#41Semiconductor device and manufacturing method thereof
#42Optoelectronic component comprising a conversion element, method of producing an optoelectronic component comprising a conversion element, and use of an optoelectronic component comprising a conversion element
#43THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEATSINK
#44Light emitting device and light emitting module
#45Interposer
#46DIMM DRAM memory chips quick optical data erasure after power cycling
#47Power semiconductor device
#48Semiconductor device
#49Bonding pad structure of a semiconductor device
#50Three-dimensional stacked integrated circuit devices and methods of assembling the same
#51Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#52Combined source and base contact for a field effect transistor
#53Semiconductor structure and fabricating method thereof
#54METHOD OF EXPOSING A GLASS-COATED MICROWIRE AND USES THEREOF
#55Semiconductor device
#56Capacitor formed on heavily doped substrate
#57Embedded wire bond wires
#58Compact semiconductor package and related methods
#59Semiconductor device and manufacturing method thereof
#60Chip rotated at an angle mounted on die pad region
#61Semiconductor device
#62Compact semiconductor package and related methods
#63Chip rotated at an angle mounted on die pad region
#64Binding wire and semiconductor package structure using the same
#65Conductive pads and methods of formation thereof
#66Semiconductor device
#67Molded semiconductor package with pluggable lead
#68SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS
#69Method of manufacturing semiconductor device
#70Semiconductor device that controls a negative resistive oscillation and obtains a high amplification output
#71Semiconductor device including dummy pattern
#72Semiconductor device
#73Package for an integrated circuit
#74Integrated circuit device
#75INTEGRATED CIRCUIT
#76Explosion-protected semiconductor module
#77Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
#78Adhesive film, method of manufacturing semiconductor device, and semiconductor device
#79Joint structure for substrates and methods of forming
#80Power device having a specific range of distances between collector and emitter electrodes
#81Integrated circuit device
#82Semiconductor device
#83Method of fabricating semiconductor device and the semiconductor device
#84Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis
#85Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium
#86ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME
#87System, method, and computer program product for predicting pin placement in an electronic design
#88Apparatuses and methods for drivers with reduced noise
#89Optoelectronic package
#90Integrated circuit package having side and bottom contact pads
#91Method and apparatus for mitigating parasitic coupling in a packaged integrated circuit
#92Method of making RFID devices on fabrics by stitching metal wires
#93Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming