207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL
#2102ELECTRICAL CONTACT ARRANGEMENT, POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING AN ELECTRICAL CONTACT ARRANGEMENT AND METHOD FOR MANUFACTURING A POWER SEMICONDUCTOR MODULE
#2103PACKAGING STRUCTURE WITH EMBEDDED POWER CHIP AND CIRCUIT BOARD MODULE HAVING THE SAME
#2104Semiconductor device package with combined contacts
#2105SEMICONDUCTOR DEVICE
#2106SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
#2107Power Semiconductor Module Arrangements and Methods for Producing Power Semiconductor Module Arrangements
#2108POWER COMPONENT FOR ELECTRIC OR HYBRID AIRCRAFT
#2109MOLDING COMPOUND THERMAL ENHANCEMENT UTILIZING GRAPHENE OR GRAPHITE MATERIALS
#2110INTEGRATED DEVICE PACKAGE WITH OPENING IN CARRIER
#21113D semiconductor device and structure with single-crystal layers
#2112Electronic package and method for fabricating the same
#2113Fingerprint Sensor Device and Method
#2114WIDE BANDGAP SEMICONDUCTOR DEVICE
#2115SEMICONDUCTOR DEVICE
#2116MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
#2117SEMICONDUCTOR DEVICE
#2118SEMICONDUCTOR DEVICE
#2119INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS ELECTRICALLY COUPLED THROUGH A SYNCHRONIZATION SIGNAL
#2120SEMICONDUCTOR DEVICE
#2121FILM PACKAGE
#2122Semiconductor device
#2123Power module
#2124POWER MODULE
#2125SEMICONDUCTOR DEVICE
#2126SEMICONDUCTOR APPARATUS
#2127SEMICONDUCTOR DEVICE
#2128SEMICONDUCTOR DEVICE
#2129RADIATION DETECTOR AND METHOD OF MANUFACTURE THEREOF
#2130Package structures
#2131Package for power semiconductor devices
#2132PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PARASITIC PARAMETERS
#2133Semiconductor device package and method for manufacturing the same
#2134Thermal performance improvement and stress reduction in semiconductor device modules
#2135SEMICONDUCTOR PACKAGE
#2136SEMICONDUCTOR DEVICE
#2137Electronic component package
#2138SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
#2139METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#2140Dynamic sense amplifier supply voltage for power and die size reduction
#2141ELECTRONIC PACKAGE
#2142THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED BACK-SIDE CAPACITOR
#2143DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
#2144Power Semiconductor Module and Manufacturing Method
#2145RIBBON SHIELD DEVICE AND METHOD
#2146SEMICONDUCTOR PACKAGE
#2147PACKAGED ELECTRONIC DEVICES HAVING TRANSIENT LIQUID PHASE SOLDER JOINTS AND METHODS OF FORMING SAME
#2148SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#2149DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#2150Microelectronic Package RDL Patterns to Reduce Stress in RDLs Across Components
#2151SEMICONDUCTOR PACKAGE
#2152PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#2153SEMICONDUCTOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE SUBSTRATE
#2154ISOLATION PACKAGE WITH HIGH THERMAL CONDUCTIVITY
#2155LEADFRAME
#2156EMBEDDED HEAT SLUG IN A SUBSTRATE
#2157CURRENT SENSOR
#2158RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEMENT UNIT
#2159Isolator
#2160SEMICONDUCTOR DEVICE
#2161PACKAGING MODULE AND ELECTRONIC DEVICE
#2162SEMICONDUCTOR DEVICE
#2163SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
#2164PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#2165Semiconductor device package
#2166SEMICONDUCTOR APPARATUS
#2167SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2168PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
#2169SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS
#2170Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#2171METHOD FOR PRODUCING AN APPARATUS HAVING A METAL BODY FOR COOLING A SEMICONDUCTOR ARRANGEMENT
#2172INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
#2173MEMORY DEVICE
#2174SEMICONDUCTOR DEVICE
#2175SEMICONDUCTOR PACKAGE HAVING ORDERED WIRE ARRANGEMENT BETWEEN DIFFERENTIAL PAIR CONNECTION PADS
#2176Electronic package device and method of operating the same
#2177SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#2178SEMICONDUCTOR DEVICE
#2179Semiconductor device and method for manufacturing same
#2180SEMICONDUCTOR DEVICE
#2181ELECTRONIC DEVICE WITH IMPROVED BOARD LEVEL RELIABILITY
#2182Semiconductor device
#2183ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
#2184Package, Lead Frame and Roughening Method Thereof
#2185WIRING STRUCTURE, SEMICONDUCTOR MODULE, AND VEHICLE
#2186SEMICONDUCTOR DEVICE
#2187SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED THEREIN
#2188PACKAGE STRUCTURE AND PACKAGE METHOD
#2189BOND WIRE LOSS DETECTION AND REDUNDANCY
#2190Semiconductor device and test method of semiconductor device
#2191SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE
#2192INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS
#2193SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2194ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#2195Air-Core Transformer Package with Ferrite Electro-Magnetic Interference (EMI) Shielding of Integrated-Circuit (IC) Chip
#2196Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package
#2197Sensor package and manufacturing method thereof
#2198SEMICONDUCTOR MODULE
#2199SEMICONDUCTOR MEMORY DIES BONDED TO LOGIC DIES AND ASSOCIATED SYSTEMS AND METHODS
#2200SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
#2201Semiconductor device
#2202SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2203PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUENCY DEVICE
#2204SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE
#2205SUBSTRATE FOR POWER MODULE AND METHOD OF PRODUCING SUBSTRATE FOR POWER MODULE
#2206SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTERCHANGEABLE INTERPOSER TO CONNECT DIE TO COMMON SUBSTRATE
#2207PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#2208MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE ASSEMBLIES EMPLOYING THE SAME, AND METHODS FOR FORMING THE SAME
#2209Through electrode substrate and semiconductor device
#2210Intelligent power module containing exposed surfaces of transistor die supporting elements
#2211SEMICONDUCTOR DEVICE
#2212SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2213Semiconductor device
#2214SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#2215PACKAGE STRUCTURE
#2216Shielded electronic component package
#2217LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
#2218SILVER- AND GOLD-PLATED CONDUCTIVE MEMBERS
#2219Conductive members atop semiconductor packages
#2220SEMICONDUCTOR APPARATUS
#2221COATED ARTICLES THAT DEMONSTRATE MOISTURE RESISTANCE, SUITABLE FOR USE IN ELECTRONIC PACKAGES
#2222Chemically anchored mold compounds in semiconductor packages
#2223Switching device and electronic circuit
#2224Switching device and electronic circuit
#2225Oscillator
#2226Method for Manufacturing Semiconductor Device
#2227SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASSOCIATED METHODS AND SYSTEMS
#2228SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#2229SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2230Semiconductor device with open cavity and method therefor
#2231Electronic device
#2232ELECTRONIC CIRCUIT MODULE
#2233SEMICONDUCTOR PACKAGE INCLUDING POST
#2234Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the same
#2235PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#2236Integrated circuit package structure with conductive stair structure and method of manufacturing thereof
#2237Power Semiconductor Device
#2238SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
#2239Switching device and electronic circuit
#2240Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
#2241SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2242SEMICONDUCTOR APPARATUS AND VEHICLE
#2243SEMICONDUCTOR DEVICE
#2244Chip package and manufacturing method thereof
#2245Package structure and method of fabricating the same
#2246SEMICONDUCTOR PACKAGE
#2247INTERPOSER, CIRCUIT DEVICE, METHOD OF MANUFACTURING INTERPOSER, AND METHOD OF MANUFACTURING CIRCUIT DEVICE
#2248Three-dimensional functional integration
#2249WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
#2250Packaged die and RDL with bonding structures therebetween
#2251SEMICONDUCTOR PACKAGE ASSEMBLY
#2252SEMICONDUCTOR PACKAGE
#2253Integrated voltage regulator (IVR) package including inductor and capacitor and IVR system package including the IVR package
#2254Semiconductor package including stacked semiconductor chips
#2255Semiconductor device and fabrication method of the semiconductor device
#2256SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#2257ELECTRONIC PACKAGE
#2258Packaging of a semiconductor device with a plurality of leads
#2259SEMICONDUCTOR MODULE
#2260POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
#2261SENSOR PACKAGE WITH CAVITY CREATED USING SACRIFICIAL MATERIAL
#2262SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2263Semiconductor device with unbalanced die stackup
#2264Bonding wire for semiconductor devices
#2265PROTECTION OF INTEGRATED CIRCUITS
#2266SEMICONDUCTOR APPARATUS
#2267Semiconductor device
#2268SEMICONDUCTOR MODULE
#2269SEMICONDUCTOR MODULE
#2270SEMICONDUCTOR DEVICE
#2271SEMICONDUCTOR DEVICE
#2272Semiconductor device package with isolated semiconductor die and electric field curtailment
#2273SEMICONDUCTOR MODULE
#2274METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#2275SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#2276Power module and related methods
#2277SEMICONDUCTOR DEVICE
#2278SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
#2279Stack package and methods of manufacturing the same
#2280CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
#2281INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND RACK SERVER UNIT
#2282Semiconductor device structure with magnetic element
#2283Sensor package structure
#2284POWER MODULE HAVING AT LEAST THREE POWER UNITS
#2285SEMICONDUCTOR PACKAGE ASSEMBLY AND ELECTRONIC DEVICE
#2286SEMICONDUCTOR PACKAGE
#2287IC PACKAGE WITH FIELD EFFECT TRANSISTOR
#2288Semiconductor package with conductive adhesive that overflows for return path reduction and associated method
#2289SEMICONDUCTOR DEVICE
#2290SEMICONDUCTOR PACKAGED STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE
#2291Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same
#2292PACKAGING SUBSTRATE, GRID ARRAY PACKAGE, AND PREPARATION METHOD THEREFOR
#2293Semiconductor device
#2294SEMICONDUCTOR MODULE
#2295Dual-side cooling semiconductor packages and related methods
#2296SEMICONDUCTOR DEVICE
#2297SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERTER
#2298Isolation device and method of transmitting a signal across an isolation material using wire bonds
#2299Semiconductor package device
#2300IC PACKAGE WITH MULTIPLE DIES
#2301SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION BONDING INTERCONNECTION, A METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND A CHIP STACK PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
#2302CIRCUIT MODULE
#2303SEMICONDUCTOR DEVICE
#2304SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE
#2305SEMICONDUCTOR DEVICE
#2306WET ETCHING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE BY USING THE SAME
#2307ESD protection device
#2308SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
#2309Semiconductor package
#2310HIGH FREQUENCY CIRCUIT
#2311SEMICONDUCTOR MODULE
#2312Method of improving current balance of parallel chips in power module and power module employing same
#2313PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#2314Semiconductor package having a thermally and electrically conductive spacer
#2315Semiconductor package and method of manufacturing semiconductor package
#2316CHIP CARRIER
#2317CURRENT SENSE CIRCUIT HAVING A TEMPERATURE COMPENSATED RESPONSE
#2318LIGHT EMITTING DISPLAY APPARATUS
#2319SEMICONDUCTOR DEVICE
#2320Limiting failures caused by dendrite growth on semiconductor chips
#2321SEMICONDUCTOR PACKAGE
#2322MULTI-CHIP INTEGRATED CIRCUIT DEVICES HAVING RECESSED REGIONS THEREIN THAT SUPPORT HIGH YIELD DICING
#2323Multi-channel gate driver package with grounded shield metal
#2324SEMICONDUCTOR PACKAGE
#2325Low Parasitic Inductance Power Module Featuring Staggered Interleaving Conductive Members
#2326SEMICONDUCTOR DEVICE
#2327TECHNOLOGIES FOR RADIO FREQUENCY OPTIMIZED INTERCONNECTS FOR A QUANTUM PROCESSOR
#2328MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
#2329PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
#2330Composant de puissance à filtrage local et convertisseur mettant en ?uvre plusieurs composants de puissance à filtrage local
#2331Sensor package structure
#2332PACKAGING STRUCTURE FOR POWER MODULE, PACKAGING METHOD AND ELECTRIC VEHICLE
#2333SEMICONDUCTOR DEVICE
#2334CHIP-PACKAGE DEVICE
#2335Pad Design For Reliability Enhancement in Packages
#2336HIGH-FREQUENCY CIRCUIT DEVICE AND DETECTION SYSTEM
#2337Device having a coupled interstage transformer and process implementing the same
#2338SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES
#2339Integrated circuit packages to minimize stress on a semiconductor die
#2340METHODS AND APPARATUS FOR USING SPACER-ON-SPACER DESIGN FOR SOLDER JOINT RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DEVICES
#2341SEMICONDUCTOR DEVICE
#2342Semiconductor device and method for manufacturing the same
#2343SEMICONDUCTOR DEVICE
#2344SEMICONDUCTOR PACKAGE
#2345Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
#2346METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#2347SENSOR PACKAGE STRUCTURE
#2348SUNK-TYPE PACKAGE STRUCTURE
#2349Multi-typed integrated passive device (IPD) components and devices and processes implementing the same
#2350SEMICONDUCTOR POWER MODULE AND POWER CONVERSION APPARATUS
#2351SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#2352POWER SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS
#2353Radio frequency packages containing multilevel power substrates and associated fabrication methods
#2354SEMICONDUCTOR PACKAGE DEVICE
#2355POWER MODULE AND MANUFACTURING METHOD THEREOF
#2356SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#2357IPD COMPONENTS HAVING SIC SUBSTRATES AND DEVICES AND PROCESSES IMPLEMENTING THE SAME
#2358Semiconductor device including a bidirectional switch
#2359POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#2360LEAD FRAME, METHOD OF MAKING LEAD FRAME, SEMICONDUCTOR APPARATUS, AND METHOD OF MAKING SEMICONDUCTOR APPARATUS
#2361DIE ATTACH ADHESIVE-READY LEAD FRAME DESIGN
#2362POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUCTOR COMPONENTS AND COMPRISING A PRESSURE BODY
#2363SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2364SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2365Group III nitride based depletion mode differential amplifiers and related RF transistor amplifier circuits
#2366Fan-out semiconductor package
#2367POWER DISTRIBUTION FOR STACKED ELECTRONIC DEVICES
#2368Semiconductor fuse with multi-bond wire
#2369SEMICONDUCTOR DEVICE
#2370SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2371Semiconductor device
#2372IC package with heat spreader
#2373SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND CASE UNIT
#2374Housing, Semiconductor Module Comprising a Housing and Method for Producing a Housing
#2375SEMICONDUCTOR DEVICE
#2376Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#2377Housing for a power semiconductor module arrangement
#2378SEMICONDUCTOR DEVICE
#2379Semiconductor package
#2380Semiconductor device with open cavity and method therefor
#2381MEMORY MODULE
#2382Electronic Package and Electronic Device Comprising the Same
#2383SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#2384SEMICONDUCTOR DEVICE
#2385Semiconductor devices and methods of manufacturing semiconductor devices
#2386Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof
#2387Highly protective wafer edge sidewall protection layer
#2388TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD THEREFOR, LEAD FRAME WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
#2389Electronic package with interposer between integrated circuit dies
#2390Semiconductor package including heat dissipation structure
#2391Power module layout for symmetric switching and temperature sensing
#2392Semiconductor device
#2393SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#2394SEMICONDUCTOR DEVICE, POWER CONVERTER, MOVING VEHICLE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#2395Semiconductor device including a suspended reinforcing layer and method of manufacturing same
#2396POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE
#2397INTERCONNECT FOR IC PACKAGE
#2398METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#2399SEMICONDUCTOR MODULE, SEMICONDUCTOR APPARATUS, AND VEHICLE
#2400SEMICONDUCTOR MODULE, SEMICONDUCTOR APPARATUS, AND VEHICLE