H01L24/64 - CPC Classification Index

ClassID:

207830 ⎘

H01L24/64 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto Manufacturing methods

Recent Application in this class:

20230102133

2023-03-30

Semiconductor Dies and Devices with a Coil for Inductive Coupling

20190074259

2019-03-07

Conductive micro pin

20190074232

2019-03-07

Test structure and manufacturing method therefor

20180344245

2018-12-06

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

20180301609

2018-10-18

Using MEMS fabrication incorporating into LED device mounting and assembly

20180164171

2018-06-14

METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS

20180005982

2018-01-04

Via and trench filling using injection molded soldering

20180005932

2018-01-04

Via and trench filling using injection molded soldering

20180005879

2018-01-04

Via and trench filling using injection molded soldering

#10

20170317045

2017-11-02

Manufacturing method of semiconductor package

#11

20160099393

2016-04-07

Using MEMS fabrication incorporating into LED device mounting and assembly

#12

20150214179

2015-07-30

SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS

#13

20150145136

2015-05-28

VERTICALLY CONNECTED INTEGRATED CIRCUITS

#14

20150048513

2015-02-19

Method for obtaining three-dimensional actin structures and uses thereof

#15

20150024547

2015-01-22

EMI package and method for making same

#16

20150014841

2015-01-15

Heat-transfer structure

#17

20140367849

2014-12-18

Interposer and method of manufacturing the same

#18

20140273440

2014-09-18

Semiconductor device channels

#19

20140273439

2014-09-18

Semiconductor device channels

#20

20140264942

2014-09-18

Semiconductor device channels

#21

20140264889

2014-09-18

Semiconductor device channels

#22

20140253137

2014-09-11

TEST PATTERN DESIGN FOR SEMICONDUCTOR DEVICES AND METHOD OF UTILIZING THEREOF

#23

20140225274

2014-08-14

Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer

#24

20140106507

2014-04-17

System and process for fabricating semiconductor packages

#25

20140035140

2014-02-06

Semiconductor structure and method for manufacturing the same

#26

20130320071

2013-12-05

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

#27

20130210196

2013-08-15

Method of fabricating a semiconductor package with integrated substrate thermal slug

#28

20130082364

2013-04-04

EMI package and method for making same

#29

20120181684

2012-07-19

Semiconductor structure and method for manufacturing the same

#30

20120164828

2012-06-28

Hidden plating traces

#31

20120063096

2012-03-15

Semiconductor package with integrated substrate thermal slug

#32

20110260279

2011-10-27

Semiconductor device connection

#33

20110198745

2011-08-18

Wafer-level packaged device having self-assembled resilient leads

#34

20110042812

2011-02-24

Electronic device and method of manufacturing the same

#35

20100308473

2010-12-09

Method for making an electrically conducting mechanical interconnection member

#36

20100136747

2010-06-03

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

#37

20100050423

2010-03-04

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

#38

20090315173

2009-12-24

Heat-transfer structure

#39

20090263969

2009-10-22

Hidden plating traces

#40

20090261480

2009-10-22

Integrated circuit and method of fabricating the same

#41

20080111229

2008-05-15

Semiconductor package

#42

20070152319

2007-07-05

Hidden plating traces

#43

15214935

2017-09-26

Via and trench filling using injection molded soldering

#44

15169591

2017-12-05

Wafer-level die to package and die to die interconnects suspended over integrated heat sinks

#45

13949432

2015-09-01

Leadframe system with warp control mechanism and method of manufacture thereof