H01L24/63 - CPC Classification Index

ClassID:

207829 ⎘

H01L24/63 - CPC Classification

Classification description:

Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto

Sub-classes:

H01L24/64 » {Manufacturing methods} 42
H01L24/65 » {Structure, shape, material or disposition of the connectors prior to the connecting process} 5
H01L24/68 » {Structure, shape, material or disposition of the connectors after the connecting process} 1

Recent Application in this class:

20240404864

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

20190318990

Semiconductor device including semiconductor chip transmitting signals at high speed

20130018434

Void-Free Implantable Hermetically Sealed Structures

20110260279

Semiconductor device connection

20100258891

Fingerprint sensor chip package method and the package structure thereof

20100207229

Non-planar microcircuit structure and method of fabricating same

20100016928

VOID-FREE IMPLANTABLE HERMETICALLY SEALED STRUCTURES