207831 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Connectors not provided for in any of the groups - and subgroups; Manufacturing methods related thereto Structure, shape, material or disposition of the connectors prior to the connecting process
Sub-classes:MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
#2SEMICONDUCTOR APPARATUS WITH AN ALIGNMENT MOAT
#3Semiconductor device including semiconductor chip transmitting signals at high speed
#4Semiconductor device and power converter
#5Hidden plating traces
#6Hidden plating traces
#7Hidden plating traces
#8Fixture design for pre-attachment package on package component assembly