ClassID:

207892

H01L25/11 - CPC Classification

Classification description:

Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups  - , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group

Sub-classes:
Recent Application in this class:
#1
20210280724
2021-09-09

Semiconductor device and imaging apparatus

#2
20200204724
2020-06-25

Analysis system, analysis method, and program storage medium

#3
20190172903
2019-06-06

Making electrical components in handle wafers of integrated circuit packages

#4
20190157190
2019-05-23

Power package having multiple mold compounds

#5
20190013419
2019-01-10

Semiconductor device and imaging apparatus

#6
20180166357
2018-06-14

Heat exchanger for dual-sided cooling of electronic modules

#7
20180130748
2018-05-10

Semiconductor device having a plurality of semiconductor modules connected by a connection component

#8
20180122768
2018-05-03

Spring element for a power semiconductor module

#9
20180076278
2018-03-15

Making electrical components in handle wafers of integrated circuit packages

#10
20180040581
2018-02-08

Pressure contact type semiconductor device stack

#11
20170077076
2017-03-16

Making electrical components in handle wafers of integrated circuit packages

#12
20160064308
2016-03-03

Semiconductor module

#13
20160064302
2016-03-03

Semiconductor module

#14
20160027710
2016-01-28

Semiconductor module for high pressure applications

#15
20150187747
2015-07-02

Circuit with inter-layer vias and intra-layer coupled transistors

#16
20150171062
2015-06-18

Three-dimensional integrated circuit with inter-layer vias and intra-layer coupled transistors

#17
20140362540
2014-12-11

Semiconductor device

#18
20140118959
2014-05-01

Chip-housing module and a method for forming a chip-housing module

#19
20130334677
2013-12-19

Semiconductor modules and methods of formation thereof

#20
20130056877
2013-03-07

Chip-housing module and a method for forming a chip-housing module

#21
20120273927
2012-11-01

Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package

#22
20110215449
2011-09-08

Semiconductor device and method of forming wafer level multi-row etched lead package

#23
20110018374
2011-01-27

Electronic circuit-integrated motor apparatus

#24
20100327677
2010-12-30

Drive apparatus and semiconductor module

#25
20060284499
2006-12-21

Rotating rectifier module

#26
20060176720
2006-08-10

Rotating rectifier with strap and diode assembly

#27
20060163957
2006-07-27

Rotating rectifier assembly with inner mounted diodes

#28
20050270715
2005-12-08

Snubber module and power conversion device

#29
20050041369
2005-02-24

Capacitor module and semiconductor