207904 ⎘
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
Sub-classes:PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
#2GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
#3SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
#4SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR
#5Zero Mask High Density Capacitor
#6SEMICONDUCTOR INTEGRATED CIRCUIT
#7INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
#8SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#9ISOLATOR
#10TRANSFORMER ARRANGEMENT
#11DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED PILLARS FOR DEVICE INTEGRATION
#12PASSIVE COMPONENT MODULE
#13METAL-INSULATOR-METAL STRUCTURE
#14SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
#15TRANSFORMER CHIP
#16ELECTRONIC COMPONENT AND APPARATUS
#17ANTIFUSE DEVICES AND METHODS OF MAKING THEREOF
#18TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE
#19SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP
#20INTEGRATED CIRCUIT PROVIDING GALVANIC ISOLATION AND DEVICE INCLUDING THE SAME
#21MULTILAYER ELECTRONIC COMPONENT
#22SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
#23STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
#24GALVANIC ISOLATION DEVICE
#25INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
#263D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
#27SIGNAL TRANSMISSION DEVICE AND INSULATED MODULE
#28Packages with Chips Comprising Inductor-Vias and Methods Forming the Same
#29CHIP-TYPE ELECTRONIC COMPONENT
#30DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
#31ISOLATION TRANSFORMER
#32ISOLATION TRANSFORMER
#33WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
#34INSULATING TRANSFORMER
#35SILICON CARBIDE BASED INTEGRATED PASSIVE DEVICES FOR IMPEDENCE MATCHING OF RADIO FREQUENCY POWER DEVICES AND PROCESS OF IMPLEMENTING THE SAME
#36SEMICONDUCTOR DEVICE
#37INSULATION MODULE AND GATE DRIVER
#38PASSIVE COMPONENT, THREE-DIMENSIONAL DEVICE, AND METHOD FOR MANUFACTURING PASSIVE COMPONENT
#39MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
#40Semiconductor device including a capacitor
#41Semiconductor structure
#42Capacitor structure
#43Semiconductor device structure with magnetic element
#44ELECTRONIC CIRCUITS AND THEIR METHODS OF MANUFACTURE
#45SEMICONDUCTOR DEVICE
#46Zero mask high density capacitor
#47ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
#48Three-dimensional capacitor-inductor based on high functional density through silicon via structure and preparation method thereof
#49Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same
#50Semiconductor structure
#51On-chip electrostatic discharge sensor
#52Semiconductor capacitor array layout with dummy capacitor structure
#53Cross-type semiconductor capacitor array layout
#54Metal-insulator-metal structure
#55Semiconductor device including capacitor and resistor
#56Display device and manufacturing method thereof
#57Capacitance fine tuning by fin capacitor design
#58Semiconductor structure and method for preparing semiconductor structure
#59Semiconductor packages and methods of forming same
#60Array of capacitors and method used in forming an array of capacitors
#61Layout structure with minimal additional parasitic capacitance
#62Hybrid reconstituted substrate for electronic packaging
#63Method of manufacturing package structure
#64Land-side silicon capacitor design and semiconductor package using the same
#653D trench capacitor for integrated passive devices
#66Semiconductor structure
#67Semiconductor structure
#68Semiconductor device including a capacitor
#69Array of capacitors and method used in forming an array of capacitors
#70Semiconductor packages and methods of forming same
#71Semiconductor device including capacitor and resistor
#72Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)
#73Modular capacitor array
#74Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same
#753D trench capacitor for integrated passive devices
#76Semiconductor device structure with magnetic element
#77Semiconductor structure having integrated inductor therein
#78Semiconductor component
#79Semiconductor package and method of manufacturing the same
#80Reliable lateral flux capacitor design
#81Semiconductor device structure with magnetic element in testing region
#82Package structure and method of manufacturing the same
#83Two-terminal device and lighting device using the same
#84Zero mask high density capacitor
#85Integration of passive components in III-N devices
#86Integrated assemblies having capacitive units, and having resistive structures coupled with the capacitive units
#87Semiconductor device including a capacitor structure and a thin film resistor and a method of fabricating the same
#88Display device and manufacturing method thereof
#89Fingerprint sensor device and method for manufacturing a semiconductor sensor device comprising a cover layer having an anisotropic dielectric constant
#90Semiconductor structure having integrated inductor therein
#91Passive element, electronic device and method for manufacturing the same
#92Semiconductor device including a capacitor
#93Via-based vertical capacitor and resistor structures
#94MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED TUNABLE FERROELECTRIC CAPACITORS
#95Module and method of manufacturing module
#96SEAL RING INDUCTOR
#97Resistance circuit, oscillation circuit, and in-vehicle sensor apparatus
#98Shielding in a unit capacitor array
#99Package structure and method of manufacturing the same
#100Solenoid structure with conductive pillar technology
#101Integrated electronic component suitable for broadband biasing
#102In-situ plasma treatment for thin film resistors
#103Structure and method for monitoring directed self-assembly pattern formation
#104Integrated circuit and test method for integrated circuit
#105Semiconductor structure having integrated inductor therein
#106Display device and manufacturing method thereof
#107Integrated passive component and method for manufacturing the same
#108Capacitor array structure
#109Glass substrate including passive-on-glass device and semiconductor die
#110Passive-on-glass (POG) device and method
#111Backside ground plane for integrated circuit
#112Glass substrate including passive-on-glass device and semiconductor die
#113Method of processing a wafer and wafer processing system
#114Random number generation using threshold switching mechanism
#115Passive-on-glass (POG) device and method
#116System and methods for additive manufacturing of electromechanical assemblies
#117METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO REDUCE INDUCTANCE, AND RELATED METHODS
#118Methods for forming stacked capacitors with fuse protection
#119Method for manufacturing an acoustic wave device
#120Phase corrector for laser trimming, an integrated circuit including such a phase corrector, and a method of providing phase correction in an integrated circuit
#121Semiconductor device
#122Integrated circuit comprising an integrated transformer of the “BALUN” type with several input and output channels
#123Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
#124MICRO-FLUIDIC ELECTRONIC DEVICES AND METHOD FOR PRODUCING SUCH DEVICES
#125Passive devices fabricated on glass substrates, methods of manufacture and design structures
#126CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME
#127Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
#128Thermally enhanced substrate
#129Semiconductor structure having integrated inductor therein