ClassID:

207905

H01L27/013 - CPC Classification

Classification description:

Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate Thick-film circuits

Recent Application in this class:
#1
20240379649
2024-11-14

Thick Film Single Layer Capacitor

#2
20240006404
2024-01-04

CONTACT STRUCTURES IN RC-NETWORK COMPONENTS

#3
20230386923
2023-11-30

REDUCING CROSS-WAFER VARIABILITY FOR MINIMUM WIDTH RESISTORS

#4
20230326883
2023-10-12

INTEGRATED ULTRALONG TIME CONSTANT TIME MEASUREMENT DEVICE AND FABRICATION PROCESS

#5
20230110420
2023-04-13

Semiconductor device with multiple polarity groups

#6
20230012912
2023-01-19

ELECTRONIC DEVICE WITH DIFFERENTIAL TRANSMISSION LINES EQUIPPED WITH CAPACITORS SEPARATED BY A CAVITY, AND CORRESPONDING MANUFACTURING METHOD

#7
20230010467
2023-01-12

Contact structures in RC-network components

#8
20230005901
2023-01-05

Package comprising a substrate and a multi-capacitor integrated passive device

#9
20220406649
2022-12-22

PASSIVE COMPONENT Q FACTOR ENHANCEMENT WITH ELEVATED RESISTANCE REGION OF SUBSTRATE

#10
20220310582
2022-09-29

SEMICONDUCTOR DEVICE

#11
20220209750
2022-06-30

QUALITY FACTOR OF A PARASITIC CAPACITANCE

#12
20220157930
2022-05-19

PASSIVE COMPONENT

#13
20210272865
2021-09-02

METAL BASE SUBSTRATE

#14
20210151392
2021-05-20

Integrated ultralong time constant time measurement device and fabrication process

#15
20210125872
2021-04-29

Reducing cross-wafer variability for minimum width resistors

#16
20210091065
2021-03-25

Semiconductor device with multiple polarity groups

#17
20200294985
2020-09-17

Semiconductor device and method of manufacturing the same

#18
20200286880
2020-09-10

Semiconductor apparatus

#19
20200189960
2020-06-18

Thick-film resistive element paste and use of thick-film resistive element paste in resistor

#20
20200185336
2020-06-11

Integrated circuit with inductors having electrically split scribe seal

#21
20200105738
2020-04-02

Semiconductor device with multiple polarity groups

#22
20200075506
2020-03-05

Integrated ultralong time constant time measurement device and fabrication process

#23
20200028071
2020-01-23

Co-fired passive integrated circuit devices

#24
20190273208
2019-09-05

Display device and method of manufacturing the same

#25
20190189608
2019-06-20

Capacitor array overlapped by on-chip inductor/transformer

#26
20190013464
2019-01-10

Co-fired passive integrated circuit devices

#27
20180286849
2018-10-04

Deep high capacity capacitor for bulk substrates

#28
20180286848
2018-10-04

Deep high capacity capacitor for bulk substrates

#29
20180102480
2018-04-12

Display device and method of manufacturing the same

#30
20180090696
2018-03-29

Display apparatus

#31
20170207209
2017-07-20

INTEGRATED CIRCUITS WITH HIGH VOLTAGE AND HIGH DENSITY CAPACITORS AND METHODS OF PRODUCING THE SAME

#32
20160379969
2016-12-29

Patterned Wafer and Method of Making the Same

#33
20160295699
2016-10-06

Co-fired passive integrated circuit devices

#34
20070220725
2007-09-27

Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

#35
20070138633
2007-06-21

Thick film capacitors on ceramic interconnect substrates

#36
20060125047
2006-06-15

Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer

#37
20060120015
2006-06-08

Thick-film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards

#38
20060024901
2006-02-02

Method for fabricating a high-frequency and high-power semiconductor module

#39
20060024900
2006-02-02

Method of manufacturing an interposer including at least one passive element at least partially defined by a recess therein

#40
20050285147
2005-12-29

Circuit apparatus provided with asperities on substrate surface

#41
20050024166
2005-02-03

Millimeter wave (MMW) radio frequency transceiver module and method of forming same